| 型号 |
MAX1471ATJ |
MAX1471ATJ-C3N |
MAX1471ATJ-T |
MAX1471ATJ-V- |
MAX1471ATJ-V-T |
| 描述 |
RF Receiver |
RF Receiver 315MHz/434MHz Superheterodyne Rcvr |
RF Receiver |
RF Receiver 315MHz/434MHz Low-Power, 3V/5V ASK/FSK Superheterodyne Receiver |
RF Receiver 315MHz/434MHz Low-Power, 3V/5V ASK/FSK Superheterodyne Receiver |
| 是否无铅 |
含铅 |
含铅 |
含铅 |
- |
- |
| 是否Rohs认证 |
不符合 |
不符合 |
不符合 |
- |
- |
| 厂商名称 |
Maxim(美信半导体) |
Maxim(美信半导体) |
Maxim(美信半导体) |
- |
- |
| 包装说明 |
5 X 5 MM, 0.80 MM HEIGHT, TQFN-32 |
TQFN-32 |
5 X 5 MM, 0.80 MM HEIGHT, TQFN-32 |
- |
- |
| Reach Compliance Code |
not_compliant |
not_compliant |
not_compliant |
- |
- |
| JESD-30 代码 |
S-XQCC-N32 |
S-XQCC-N32 |
S-XQCC-N32 |
- |
- |
| JESD-609代码 |
e0 |
e0 |
e0 |
- |
- |
| 长度 |
5 mm |
5 mm |
5 mm |
- |
- |
| 湿度敏感等级 |
1 |
1 |
1 |
- |
- |
| 功能数量 |
1 |
1 |
1 |
- |
- |
| 端子数量 |
32 |
32 |
32 |
- |
- |
| 最高工作温度 |
125 °C |
125 °C |
125 °C |
- |
- |
| 最低工作温度 |
-40 °C |
-40 °C |
-40 °C |
- |
- |
| 封装主体材料 |
UNSPECIFIED |
UNSPECIFIED |
UNSPECIFIED |
- |
- |
| 封装代码 |
HVQCCN |
HVQCCN |
HVQCCN |
- |
- |
| 封装形状 |
SQUARE |
SQUARE |
SQUARE |
- |
- |
| 封装形式 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
- |
- |
| 峰值回流温度(摄氏度) |
240 |
NOT SPECIFIED |
245 |
- |
- |
| 座面最大高度 |
0.8 mm |
0.8 mm |
0.8 mm |
- |
- |
| 标称供电电压 |
3 V |
3 V |
3 V |
- |
- |
| 表面贴装 |
YES |
YES |
YES |
- |
- |
| 技术 |
CMOS |
CMOS |
CMOS |
- |
- |
| 电信集成电路类型 |
TELECOM CIRCUIT |
TELECOM CIRCUIT |
TELECOM CIRCUIT |
- |
- |
| 温度等级 |
AUTOMOTIVE |
AUTOMOTIVE |
AUTOMOTIVE |
- |
- |
| 端子面层 |
Tin/Lead (Sn85Pb15) |
Tin/Lead (Sn85Pb15) |
Tin/Lead (Sn85Pb15) |
- |
- |
| 端子形式 |
NO LEAD |
NO LEAD |
NO LEAD |
- |
- |
| 端子节距 |
0.5 mm |
0.5 mm |
0.5 mm |
- |
- |
| 端子位置 |
QUAD |
QUAD |
QUAD |
- |
- |
| 处于峰值回流温度下的最长时间 |
20 |
NOT SPECIFIED |
NOT SPECIFIED |
- |
- |
| 宽度 |
5 mm |
5 mm |
5 mm |
- |
- |