| 型号 |
ISL8723IRZ-T |
ISL8723IRZ |
| 描述 |
Power Sequencing Controllers; QFN24; Temp Range: -40° to 85°C |
Power Sequencing Controllers; QFN24; Temp Range: -40° to 85°C |
| Brand Name |
Intersil |
Intersil |
| 厂商名称 |
Renesas(瑞萨电子) |
Renesas(瑞萨电子) |
| 零件包装代码 |
QFN |
QFN |
| 包装说明 |
HVQCCN, LCC24,.16SQ,20 |
HVQCCN, LCC24,.16SQ,20 |
| 针数 |
24 |
24 |
| Reach Compliance Code |
compliant |
compliant |
| ECCN代码 |
EAR99 |
EAR99 |
| Factory Lead Time |
22 weeks |
1 week |
| 可调阈值 |
YES |
YES |
| 模拟集成电路 - 其他类型 |
POWER SUPPLY SUPPORT CIRCUIT |
POWER SUPPLY SUPPORT CIRCUIT |
| JESD-30 代码 |
S-PQCC-N24 |
S-PQCC-N24 |
| JESD-609代码 |
e3 |
e3 |
| 长度 |
4 mm |
4 mm |
| 湿度敏感等级 |
3 |
3 |
| 信道数量 |
4 |
4 |
| 功能数量 |
1 |
1 |
| 端子数量 |
24 |
24 |
| 最高工作温度 |
85 °C |
85 °C |
| 最低工作温度 |
-40 °C |
-40 °C |
| 封装主体材料 |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
| 封装代码 |
HVQCCN |
HVQCCN |
| 封装等效代码 |
LCC24,.16SQ,20 |
LCC24,.16SQ,20 |
| 封装形状 |
SQUARE |
SQUARE |
| 封装形式 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
| 峰值回流温度(摄氏度) |
260 |
260 |
| 电源 |
3.3/5 V |
3.3/5 V |
| 认证状态 |
Not Qualified |
Not Qualified |
| 座面最大高度 |
1 mm |
1 mm |
| 最大供电电压 (Vsup) |
5 V |
5 V |
| 最小供电电压 (Vsup) |
2.5 V |
2.5 V |
| 标称供电电压 (Vsup) |
3.3 V |
3.3 V |
| 表面贴装 |
YES |
YES |
| 温度等级 |
INDUSTRIAL |
INDUSTRIAL |
| 端子面层 |
Matte Tin (Sn) - annealed |
Matte Tin (Sn) - annealed |
| 端子形式 |
NO LEAD |
NO LEAD |
| 端子节距 |
0.5 mm |
0.5 mm |
| 端子位置 |
QUAD |
QUAD |
| 处于峰值回流温度下的最长时间 |
30 |
30 |
| 宽度 |
4 mm |
4 mm |