器件名 | 厂商 | 描 述 | 功能 |
---|---|---|---|
GS8321Z36AGD-150 | GSI Technology | 静态随机存取存储器 2.5 or 3.3V 1M x 36 36M | 下载 |
GS8321Z36AGD-150I | GSI Technology | ZBT SRAM, 1MX36, CMOS, PBGA165, 13 X 15 MM, 1 MM PITCH, ROHS COMPLIANT, FPBGA-165 | 下载 |
GS8321Z36AGD-150IT | GSI Technology | ZBT SRAM, 1MX36, CMOS, PBGA165, 13 X 15 MM, 1 MM PITCH, ROHS COMPLIANT, FPBGA-165 | 下载 |
GS8321Z36AGD-150IV | GSI Technology | ZBT SRAM, 1MX36, 7.5ns, CMOS, PBGA165, 13 X 15 MM, 1 MM PITCH, ROHS COMPLIANT, FPBGA-165 | 下载 |
GS8321Z36AGD-150IVT | GSI Technology | ZBT SRAM, 1MX36, 7.5ns, CMOS, PBGA165, 13 X 15 MM, 1 MM PITCH, ROHS COMPLIANT, FPBGA-165 | 下载 |
GS8321Z36AGD-150T | GSI Technology | ZBT SRAM, 1MX36, CMOS, PBGA165, 13 X 15 MM, 1 MM PITCH, ROHS COMPLIANT, FPBGA-165 | 下载 |
GS8321Z36AGD-150V | GSI Technology | SRAM 1.8/2.5V 1M x 36 36M | 下载 |
GS8321Z36AGD-150VT | GSI Technology | ZBT SRAM, 1MX36, 7.5ns, CMOS, PBGA165, 13 X 15 MM, 1 MM PITCH, ROHS COMPLIANT, FPBGA-165 | 下载 |
GS8321Z36AGD-200 | GSI Technology | ZBT SRAM, 1MX36, CMOS, PBGA165, 13 X 15 MM, 1 MM PITCH, ROHS COMPLIANT, FPBGA-165 | 下载 |
GS8321Z36AGD-200I | GSI Technology | SRAM 2.5 or 3.3V 1M x 36 36M | 下载 |
GS8321Z36AGD-200IT | GSI Technology | ZBT SRAM, 1MX36, CMOS, PBGA165, 13 X 15 MM, 1 MM PITCH, ROHS COMPLIANT, FPBGA-165 | 下载 |
GS8321Z36AGD-200IV | GSI Technology | 静态随机存取存储器 1.8/2.5V 1M x 36 36M | 下载 |
GS8321Z36AGD-200IVT | GSI Technology | ZBT SRAM, 1MX36, 6.5ns, CMOS, PBGA165, 13 X 15 MM, 1 MM PITCH, ROHS COMPLIANT, FPBGA-165 | 下载 |
GS8321Z36AGD-200T | GSI Technology | ZBT SRAM, 1MX36, CMOS, PBGA165, 13 X 15 MM, 1 MM PITCH, ROHS COMPLIANT, FPBGA-165 | 下载 |
GS8321Z36AGD-200V | GSI Technology | SRAM 1.8/2.5V 1M x 36 36M | 下载 |
GS8321Z36AGD-200VT | GSI Technology | ZBT SRAM, 1MX36, 6.5ns, CMOS, PBGA165, 13 X 15 MM, 1 MM PITCH, ROHS COMPLIANT, FPBGA-165 | 下载 |
GS8321Z36AGD-250 | GSI Technology | SRAM 2.5 or 3.3V 1M x 36 36M | 下载 |
GS8321Z36AGD-250I | GSI Technology | SRAM 2.5 or 3.3V 1M x 36 36M | 下载 |
GS8321Z36AGD-250IT | GSI Technology | ZBT SRAM, 1MX36, CMOS, PBGA165, 13 X 15 MM, 1 MM PITCH, ROHS COMPLIANT, FPBGA-165 | 下载 |
GS8321Z36AGD-250IV | GSI Technology | 静态随机存取存储器 1.8/2.5V 1M x 36 36M | 下载 |
GS8321Z36AGD-250IVT | GSI Technology | ZBT SRAM, 1MX36, 5.5ns, CMOS, PBGA165, 13 X 15 MM, 1 MM PITCH, ROHS COMPLIANT, FPBGA-165 | 下载 |
GS8321Z36AGD-250T | GSI Technology | ZBT SRAM, 1MX36, CMOS, PBGA165, 13 X 15 MM, 1 MM PITCH, ROHS COMPLIANT, FPBGA-165 | 下载 |
GS8321Z36AGD-250V | GSI Technology | SRAM 1.8/2.5V 1M x 36 36M | 下载 |
GS8321Z36AGD-250VT | GSI Technology | ZBT SRAM, 1MX36, 5.5ns, CMOS, PBGA165, 13 X 15 MM, 1 MM PITCH, ROHS COMPLIANT, FPBGA-165 | 下载 |
GS8321Z36AGD-333 | GSI Technology | SRAM 2.5 or 3.3V 1M x 36 36M | 下载 |
GS8321Z36AGD-333I | GSI Technology | 静态随机存取存储器 2.5 or 3.3V 1M x 36 36M | 下载 |
GS8321Z36AGD-333IT | GSI Technology | ZBT SRAM, 1MX36, CMOS, PBGA165, 13 X 15 MM, 1 MM PITCH, ROHS COMPLIANT, FPBGA-165 | 下载 |
GS8321Z36AGD-333IV | GSI Technology | SRAM 1.8/2.5V 1M x 36 36M | 下载 |
GS8321Z36AGD-333IVT | GSI Technology | ZBT SRAM, 1MX36, 5ns, CMOS, PBGA165, 13 X 15 MM, 1 MM PITCH, ROHS COMPLIANT, FPBGA-165 | 下载 |
GS8321Z36AGD-333T | GSI Technology | ZBT SRAM, 1MX36, CMOS, PBGA165, 13 X 15 MM, 1 MM PITCH, ROHS COMPLIANT, FPBGA-165 | 下载 |
对应元器件 | pdf文档资料下载 |
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GS8321Z36AGD-150IV 、 GS8321Z36AGD-150IVT 、 GS8321Z36AGD-150VT 、 GS8321Z36AGD-200IVT 、 GS8321Z36AGD-200VT 、 GS8321Z36AGD-250IVT 、 GS8321Z36AGD-250VT 、 GS8321Z36AGD-333IVT 、 GS8321Z36AGD-333VT | 下载文档 |
GS8321Z36AGD-150V 、 GS8321Z36AGD-200IV 、 GS8321Z36AGD-200V 、 GS8321Z36AGD-250IV 、 GS8321Z36AGD-250V 、 GS8321Z36AGD-333IV 、 GS8321Z36AGD-333V | 下载文档 |
GS8321Z36AGD-200I 、 GS8321Z36AGD-250 、 GS8321Z36AGD-250I 、 GS8321Z36AGD-333 、 GS8321Z36AGD-375I 、 GS8321Z36AGD-400I | 下载文档 |
GS8321Z36AGD-150 、 GS8321Z36AGD-333I | 下载文档 |
型号 | GS8321Z36AGD-150IV | GS8321Z36AGD-150IVT | GS8321Z36AGD-150VT | GS8321Z36AGD-200IVT | GS8321Z36AGD-200VT | GS8321Z36AGD-250IVT | GS8321Z36AGD-250VT | GS8321Z36AGD-333IVT | GS8321Z36AGD-333VT |
---|---|---|---|---|---|---|---|---|---|
描述 | ZBT SRAM, 1MX36, 7.5ns, CMOS, PBGA165, 13 X 15 MM, 1 MM PITCH, ROHS COMPLIANT, FPBGA-165 | ZBT SRAM, 1MX36, 7.5ns, CMOS, PBGA165, 13 X 15 MM, 1 MM PITCH, ROHS COMPLIANT, FPBGA-165 | ZBT SRAM, 1MX36, 7.5ns, CMOS, PBGA165, 13 X 15 MM, 1 MM PITCH, ROHS COMPLIANT, FPBGA-165 | ZBT SRAM, 1MX36, 6.5ns, CMOS, PBGA165, 13 X 15 MM, 1 MM PITCH, ROHS COMPLIANT, FPBGA-165 | ZBT SRAM, 1MX36, 6.5ns, CMOS, PBGA165, 13 X 15 MM, 1 MM PITCH, ROHS COMPLIANT, FPBGA-165 | ZBT SRAM, 1MX36, 5.5ns, CMOS, PBGA165, 13 X 15 MM, 1 MM PITCH, ROHS COMPLIANT, FPBGA-165 | ZBT SRAM, 1MX36, 5.5ns, CMOS, PBGA165, 13 X 15 MM, 1 MM PITCH, ROHS COMPLIANT, FPBGA-165 | ZBT SRAM, 1MX36, 5ns, CMOS, PBGA165, 13 X 15 MM, 1 MM PITCH, ROHS COMPLIANT, FPBGA-165 | ZBT SRAM, 1MX36, 5ns, CMOS, PBGA165, 13 X 15 MM, 1 MM PITCH, ROHS COMPLIANT, FPBGA-165 |
是否无铅 | 不含铅 | 不含铅 | 不含铅 | 不含铅 | 不含铅 | 不含铅 | 不含铅 | 不含铅 | 不含铅 |
是否Rohs认证 | 符合 | 符合 | 符合 | 符合 | 符合 | 符合 | 符合 | 符合 | 符合 |
厂商名称 | GSI Technology | GSI Technology | GSI Technology | GSI Technology | GSI Technology | GSI Technology | GSI Technology | GSI Technology | GSI Technology |
零件包装代码 | BGA | BGA | BGA | BGA | BGA | BGA | BGA | BGA | BGA |
包装说明 | LBGA, BGA165,11X15,40 | LBGA, BGA165,11X15,40 | LBGA, BGA165,11X15,40 | LBGA, BGA165,11X15,40 | LBGA, BGA165,11X15,40 | LBGA, BGA165,11X15,40 | LBGA, BGA165,11X15,40 | LBGA, BGA165,11X15,40 | LBGA, BGA165,11X15,40 |
针数 | 165 | 165 | 165 | 165 | 165 | 165 | 165 | 165 | 165 |
Reach Compliance Code | compliant | compliant | compliant | compliant | compliant | compliant | compliant | compliant | compliant |
ECCN代码 | 3A991.B.2.B | 3A991.B.2.B | 3A991.B.2.B | 3A991.B.2.B | 3A991.B.2.B | 3A991.B.2.B | 3A991.B.2.B | 3A991.B.2.B | 3A991.B.2.B |
最长访问时间 | 7.5 ns | 7.5 ns | 7.5 ns | 6.5 ns | 6.5 ns | 5.5 ns | 5.5 ns | 5 ns | 5 ns |
其他特性 | ALSO OPERATES AT 2.5V SUPPLY, PIPELINED ARCHITECTURE, FLOW THROUGH | ALSO OPERATES AT 2.5V SUPPLY, PIPELINED ARCHITECTURE, FLOW THROUGH | ALSO OPERATES AT 2.5V SUPPLY, PIPELINED ARCHITECTURE, FLOW THROUGH | ALSO OPERATES AT 2.5V SUPPLY, PIPELINED ARCHITECTURE, FLOW THROUGH | ALSO OPERATES AT 2.5V SUPPLY, PIPELINED ARCHITECTURE, FLOW THROUGH | ALSO OPERATES AT 2.5V SUPPLY, PIPELINED ARCHITECTURE, FLOW THROUGH | ALSO OPERATES AT 2.5V SUPPLY, PIPELINED ARCHITECTURE, FLOW THROUGH | ALSO OPERATES AT 2.5V SUPPLY, PIPELINED ARCHITECTURE, FLOW THROUGH | ALSO OPERATES AT 2.5V SUPPLY, PIPELINED ARCHITECTURE, FLOW THROUGH |
最大时钟频率 (fCLK) | 150 MHz | 150 MHz | 150 MHz | 200 MHz | 200 MHz | 250 MHz | 250 MHz | 333 MHz | 333 MHz |
I/O 类型 | COMMON | COMMON | COMMON | COMMON | COMMON | COMMON | COMMON | COMMON | COMMON |
JESD-30 代码 | R-PBGA-B165 | R-PBGA-B165 | R-PBGA-B165 | R-PBGA-B165 | R-PBGA-B165 | R-PBGA-B165 | R-PBGA-B165 | R-PBGA-B165 | R-PBGA-B165 |
JESD-609代码 | e1 | e1 | e1 | e1 | e1 | e1 | e1 | e1 | e1 |
长度 | 15 mm | 15 mm | 15 mm | 15 mm | 15 mm | 15 mm | 15 mm | 15 mm | 15 mm |
内存密度 | 37748736 bit | 37748736 bit | 37748736 bit | 37748736 bit | 37748736 bit | 37748736 bit | 37748736 bit | 37748736 bit | 37748736 bit |
内存集成电路类型 | ZBT SRAM | ZBT SRAM | ZBT SRAM | ZBT SRAM | ZBT SRAM | ZBT SRAM | ZBT SRAM | ZBT SRAM | ZBT SRAM |
内存宽度 | 36 | 36 | 36 | 36 | 36 | 36 | 36 | 36 | 36 |
湿度敏感等级 | 3 | 3 | 3 | 3 | 3 | 3 | 3 | 3 | 3 |
功能数量 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
端子数量 | 165 | 165 | 165 | 165 | 165 | 165 | 165 | 165 | 165 |
字数 | 1048576 words | 1048576 words | 1048576 words | 1048576 words | 1048576 words | 1048576 words | 1048576 words | 1048576 words | 1048576 words |
字数代码 | 1000000 | 1000000 | 1000000 | 1000000 | 1000000 | 1000000 | 1000000 | 1000000 | 1000000 |
工作模式 | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS |
最高工作温度 | 85 °C | 85 °C | 70 °C | 85 °C | 70 °C | 85 °C | 70 °C | 85 °C | 70 °C |
最低工作温度 | -40 °C | -40 °C | - | -40 °C | - | -40 °C | - | -40 °C | - |
组织 | 1MX36 | 1MX36 | 1MX36 | 1MX36 | 1MX36 | 1MX36 | 1MX36 | 1MX36 | 1MX36 |
输出特性 | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE |
封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
封装代码 | LBGA | LBGA | LBGA | LBGA | LBGA | LBGA | LBGA | LBGA | LBGA |
封装等效代码 | BGA165,11X15,40 | BGA165,11X15,40 | BGA165,11X15,40 | BGA165,11X15,40 | BGA165,11X15,40 | BGA165,11X15,40 | BGA165,11X15,40 | BGA165,11X15,40 | BGA165,11X15,40 |
封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
封装形式 | GRID ARRAY, LOW PROFILE | GRID ARRAY, LOW PROFILE | GRID ARRAY, LOW PROFILE | GRID ARRAY, LOW PROFILE | GRID ARRAY, LOW PROFILE | GRID ARRAY, LOW PROFILE | GRID ARRAY, LOW PROFILE | GRID ARRAY, LOW PROFILE | GRID ARRAY, LOW PROFILE |
并行/串行 | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL |
峰值回流温度(摄氏度) | 260 | 260 | 260 | 260 | 260 | 260 | 260 | 260 | 260 |
电源 | 1.8/2.5 V | 1.8/2.5 V | 1.8/2.5 V | 1.8/2.5 V | 1.8/2.5 V | 1.8/2.5 V | 1.8/2.5 V | 1.8/2.5 V | 1.8/2.5 V |
认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
座面最大高度 | 1.4 mm | 1.4 mm | 1.4 mm | 1.4 mm | 1.4 mm | 1.4 mm | 1.4 mm | 1.4 mm | 1.4 mm |
最大待机电流 | 0.04 A | 0.04 A | 0.03 A | 0.04 A | 0.03 A | 0.04 A | 0.03 A | 0.04 A | 0.03 A |
最小待机电流 | 1.7 V | 1.7 V | 1.7 V | 1.7 V | 1.7 V | 1.7 V | 1.7 V | 1.7 V | 1.7 V |
最大压摆率 | 0.165 mA | 0.165 mA | 0.155 mA | 0.205 mA | 0.195 mA | 0.24 mA | 0.23 mA | 0.295 mA | 0.285 mA |
最大供电电压 (Vsup) | 2 V | 2 V | 2 V | 2 V | 2 V | 2 V | 2 V | 2 V | 2 V |
最小供电电压 (Vsup) | 1.7 V | 1.7 V | 1.7 V | 1.7 V | 1.7 V | 1.7 V | 1.7 V | 1.7 V | 1.7 V |
标称供电电压 (Vsup) | 1.8 V | 1.8 V | 1.8 V | 1.8 V | 1.8 V | 1.8 V | 1.8 V | 1.8 V | 1.8 V |
表面贴装 | YES | YES | YES | YES | YES | YES | YES | YES | YES |
技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
温度等级 | INDUSTRIAL | INDUSTRIAL | COMMERCIAL | INDUSTRIAL | COMMERCIAL | INDUSTRIAL | COMMERCIAL | INDUSTRIAL | COMMERCIAL |
端子面层 | Tin/Silver/Copper (Sn/Ag/Cu) | Tin/Silver/Copper (Sn/Ag/Cu) | Tin/Silver/Copper (Sn/Ag/Cu) | Tin/Silver/Copper (Sn/Ag/Cu) | Tin/Silver/Copper (Sn/Ag/Cu) | Tin/Silver/Copper (Sn/Ag/Cu) | Tin/Silver/Copper (Sn/Ag/Cu) | Tin/Silver/Copper (Sn/Ag/Cu) | Tin/Silver/Copper (Sn/Ag/Cu) |
端子形式 | BALL | BALL | BALL | BALL | BALL | BALL | BALL | BALL | BALL |
端子节距 | 1 mm | 1 mm | 1 mm | 1 mm | 1 mm | 1 mm | 1 mm | 1 mm | 1 mm |
端子位置 | BOTTOM | BOTTOM | BOTTOM | BOTTOM | BOTTOM | BOTTOM | BOTTOM | BOTTOM | BOTTOM |
处于峰值回流温度下的最长时间 | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
宽度 | 13 mm | 13 mm | 13 mm | 13 mm | 13 mm | 13 mm | 13 mm | 13 mm | 13 mm |
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