器件名 | 厂商 | 描 述 | 功能 |
---|---|---|---|
GRM31CR71H105K61 | Murata(村田) | Chip Multilayer Ceramic Capacitors for General Purpose | 下载 |
GRM31CR71H105K61K | Murata(村田) | Chip Multilayer Ceramic Capacitors for General Purpose | 下载 |
GRM31CR71H105K61L | Murata(村田) | Chip Multilayer Ceramic Capacitors for General Purpose | 下载 |
GRM31CR71H105KA12L | FREESCALE (NXP) | CAPACITOR, CERAMIC, MULTILAYER, 250 V, C0G, 0.0000005 uF, SURFACE MOUNT, 0805 | 下载 |
GRM31CR71H105KA12L | NXP(恩智浦) | RF LDMOS Wideband Integrated Power Amplifiers | 下载 |
GRM31CR71H105KA61K | Murata(村田) | Multilayer Ceramic Capacitors MLCC - SMD/SMT | 下载 |
GRM31CR71H105KA61L | Murata(村田) | 精度:±10% 容值:1uF 额定电压:50V 温漂系数(介质材料):X7R 材质:X7R | 下载 |
GRM31CR71H105M61 | Murata(村田) | Chip Multilayer Ceramic Capacitors for General Purpose | 下载 |
GRM31CR71H105M61K | Murata(村田) | Chip Multilayer Ceramic Capacitors for General Purpose | 下载 |
GRM31CR71H105M61L | Murata(村田) | Chip Multilayer Ceramic Capacitors for General Purpose | 下载 |
GRM31CR71H105MA61K | Murata(村田) | Ceramic Capacitor, Multilayer, Ceramic, 50V, 20% +Tol, 20% -Tol, X7R, 15% TC, 1uF, Surface Mount, 1206, CHIP, ROHS COMPLIANT | 下载 |
GRM31CR71H105MA61L | Murata(村田) | Multilayer Ceramic Capacitors MLCC - SMD/SMT | 下载 |
对应元器件 | pdf文档资料下载 |
---|---|
GRM31CR71H105MA61K 、 GRM31CR71H105MA61L | 下载文档 |
GRM31CR71H105KA61L | 下载文档 |
GRM31CR71H105KA61K | 下载文档 |
GRM31CR71H105KA12L | 下载文档 |
型号 | GRM31CR71H105MA61L | GRM31CR71H105MA61K |
---|---|---|
描述 | Multilayer Ceramic Capacitors MLCC - SMD/SMT | Ceramic Capacitor, Multilayer, Ceramic, 50V, 20% +Tol, 20% -Tol, X7R, 15% TC, 1uF, Surface Mount, 1206, CHIP, ROHS COMPLIANT |
是否无铅 | 不含铅 | 不含铅 |
是否Rohs认证 | 符合 | 符合 |
包装说明 | , 1206 | , 1206 |
Reach Compliance Code | compliant | compliant |
ECCN代码 | EAR99 | EAR99 |
Factory Lead Time | 14 weeks | 14 weeks |
电容 | 1 µF | 1 µF |
电容器类型 | CERAMIC CAPACITOR | CERAMIC CAPACITOR |
介电材料 | CERAMIC | CERAMIC |
高度 | 1.6 mm | 1.6 mm |
JESD-609代码 | e3 | e3 |
长度 | 3.2 mm | 3.2 mm |
安装特点 | SURFACE MOUNT | SURFACE MOUNT |
多层 | Yes | Yes |
负容差 | 20% | 20% |
端子数量 | 2 | 2 |
最高工作温度 | 125 °C | 125 °C |
最低工作温度 | -55 °C | -55 °C |
封装形状 | RECTANGULAR PACKAGE | RECTANGULAR PACKAGE |
封装形式 | SMT | SMT |
包装方法 | TR, EMBOSSED, 7 INCH | TR, EMBOSSED, 13 INCH |
正容差 | 20% | 20% |
额定(直流)电压(URdc) | 50 V | 50 V |
尺寸代码 | 1206 | 1206 |
表面贴装 | YES | YES |
温度特性代码 | X7R | X7R |
温度系数 | 15% ppm/°C | 15% ppm/°C |
端子面层 | Matte Tin (Sn) - with Nickel (Ni) barrier | Matte Tin (Sn) - with Nickel (Ni) barrier |
端子形状 | WRAPAROUND | WRAPAROUND |
宽度 | 1.6 mm | 1.6 mm |
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