型号 |
GAL16V8D-25QPNI |
GAL16V8D-25LJNI |
GAL16V8D-25LPI |
GAL16V8D-25LS |
GAL16V8D-25QJ |
GAL16V8D-25QJI |
描述 |
SPLD - Simple Programmable Logic Devices 16 Input 8 Output 5V 1/4 Power 25ns |
SPLD - Simple Programmable Logic Devices 16 INPUT 8 OUTPUT 5V LOW POWER 25ns |
SPLD - Simple Programmable Logic Devices 16 INPUT 8 OUTPUT 5V LOW POWER 25ns |
SPLD - Simple Programmable Logic Devices 16 INPUT 8 OUTPUT 5V LOW POWER 25NS |
SPLD - Simple Programmable Logic Devices 5V 16 I/O |
SPLD - Simple Programmable Logic Devices 16 INPUT 8 OUTPUT 5V 1/4 POWER 25ns |
是否Rohs认证 |
符合 |
符合 |
不符合 |
不符合 |
不符合 |
不符合 |
厂商名称 |
Lattice(莱迪斯) |
Lattice(莱迪斯) |
Lattice(莱迪斯) |
Lattice(莱迪斯) |
Lattice(莱迪斯) |
Lattice(莱迪斯) |
零件包装代码 |
DIP |
QLCC |
DIP |
SOIC |
QLCC |
QLCC |
包装说明 |
LEAD FREE, PLASTIC, DIP-20 |
LEAD FREE, PLASTIC, LCC-20 |
PLASTIC, DIP-20 |
SOIC-20 |
PLASTIC, LCC-20 |
PLASTIC, LCC-20 |
针数 |
20 |
20 |
20 |
20 |
20 |
20 |
Reach Compliance Code |
unknown |
unknown |
not_compliant |
not_compliant |
not_compliant |
not_compliant |
ECCN代码 |
EAR99 |
EAR99 |
EAR99 |
EAR99 |
EAR99 |
EAR99 |
架构 |
PAL-TYPE |
PAL-TYPE |
PAL-TYPE |
PAL-TYPE |
PAL-TYPE |
PAL-TYPE |
最大时钟频率 |
37 MHz |
37 MHz |
37 MHz |
37 MHz |
37 MHz |
37 MHz |
JESD-30 代码 |
R-PDIP-T20 |
S-PQCC-J20 |
R-PDIP-T20 |
R-PDSO-G20 |
S-PQCC-J20 |
S-PQCC-J20 |
JESD-609代码 |
e3 |
e3 |
e0 |
e0 |
e0 |
e0 |
长度 |
26.162 mm |
8.9662 mm |
26.162 mm |
12.8 mm |
8.9662 mm |
8.9662 mm |
专用输入次数 |
8 |
8 |
8 |
8 |
8 |
8 |
I/O 线路数量 |
8 |
8 |
8 |
8 |
8 |
8 |
输入次数 |
18 |
18 |
18 |
18 |
18 |
18 |
输出次数 |
8 |
8 |
8 |
8 |
8 |
8 |
产品条款数 |
64 |
64 |
64 |
64 |
64 |
64 |
端子数量 |
20 |
20 |
20 |
20 |
20 |
20 |
最高工作温度 |
85 °C |
85 °C |
85 °C |
70 °C |
70 °C |
85 °C |
最低工作温度 |
-40 °C |
-40 °C |
-40 °C |
- |
- |
-40 °C |
组织 |
8 DEDICATED INPUTS, 8 I/O |
8 DEDICATED INPUTS, 8 I/O |
8 DEDICATED INPUTS, 8 I/O |
8 DEDICATED INPUTS, 8 I/O |
8 DEDICATED INPUTS, 8 I/O |
8 DEDICATED INPUTS, 8 I/O |
输出函数 |
MACROCELL |
MACROCELL |
MACROCELL |
MACROCELL |
MACROCELL |
MACROCELL |
封装主体材料 |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
封装代码 |
DIP |
QCCJ |
DIP |
SOP |
QCCJ |
QCCJ |
封装等效代码 |
DIP20,.3 |
LDCC20,.4SQ |
DIP20,.3 |
SOP20,.4 |
LDCC20,.4SQ |
LDCC20,.4SQ |
封装形状 |
RECTANGULAR |
SQUARE |
RECTANGULAR |
RECTANGULAR |
SQUARE |
SQUARE |
封装形式 |
IN-LINE |
CHIP CARRIER |
IN-LINE |
SMALL OUTLINE |
CHIP CARRIER |
CHIP CARRIER |
电源 |
5 V |
5 V |
5 V |
5 V |
5 V |
5 V |
可编程逻辑类型 |
EE PLD |
EE PLD |
EE PLD |
EE PLD |
EE PLD |
EE PLD |
传播延迟 |
25 ns |
25 ns |
25 ns |
25 ns |
25 ns |
25 ns |
认证状态 |
Not Qualified |
Not Qualified |
Not Qualified |
Not Qualified |
Not Qualified |
Not Qualified |
座面最大高度 |
5.334 mm |
4.572 mm |
5.334 mm |
2.65 mm |
4.572 mm |
4.572 mm |
最大供电电压 |
5.5 V |
5.5 V |
5.5 V |
5.25 V |
5.25 V |
5.5 V |
最小供电电压 |
4.5 V |
4.5 V |
4.5 V |
4.75 V |
4.75 V |
4.5 V |
标称供电电压 |
5 V |
5 V |
5 V |
5 V |
5 V |
5 V |
表面贴装 |
NO |
YES |
NO |
YES |
YES |
YES |
技术 |
CMOS |
CMOS |
CMOS |
CMOS |
CMOS |
CMOS |
温度等级 |
INDUSTRIAL |
INDUSTRIAL |
INDUSTRIAL |
COMMERCIAL |
COMMERCIAL |
INDUSTRIAL |
端子面层 |
Matte Tin (Sn) |
Matte Tin (Sn) |
Tin/Lead (Sn/Pb) |
Tin/Lead (Sn85Pb15) |
Tin/Lead (Sn85Pb15) |
Tin/Lead (Sn85Pb15) |
端子形式 |
THROUGH-HOLE |
J BEND |
THROUGH-HOLE |
GULL WING |
J BEND |
J BEND |
端子节距 |
2.54 mm |
1.27 mm |
2.54 mm |
1.27 mm |
1.27 mm |
1.27 mm |
端子位置 |
DUAL |
QUAD |
DUAL |
DUAL |
QUAD |
QUAD |
宽度 |
7.62 mm |
8.9662 mm |
7.62 mm |
7.5 mm |
8.9662 mm |
8.9662 mm |
是否无铅 |
不含铅 |
不含铅 |
含铅 |
- |
含铅 |
含铅 |
峰值回流温度(摄氏度) |
NOT SPECIFIED |
250 |
225 |
- |
225 |
225 |
处于峰值回流温度下的最长时间 |
NOT SPECIFIED |
40 |
30 |
- |
30 |
30 |
湿度敏感等级 |
- |
1 |
- |
1 |
1 |
1 |