型号 |
EP4CE40F23A7N |
EP4CE40F23C9L |
EP4CE40F23I8L |
EP4CE40F29C7 |
EP4CE40F29C8L |
EP4CE40F29C8LN |
EP4CE40F29I7N |
EP4CE40F29I8L |
描述 |
fpga - field programmable gate array fpga - cyclone IV E 2475 labs 328 ios |
fpga - field programmable gate array fpga - cyclone IV E 2475 labs 328 ios |
fpga - field programmable gate array fpga - cyclone IV E 2475 labs 328 ios |
fpga - field programmable gate array fpga - cyclone IV E 2475 labs 532 ios |
fpga - field programmable gate array fpga - cyclone IV E 2475 labs 532 ios |
fpga - field programmable gate array fpga - cyclone IV E 2475 labs 532 ios |
fpga - field programmable gate array fpga - cyclone IV E 2475 labs 532 ios |
fpga - field programmable gate array fpga - cyclone IV E 2475 labs 532 ios |
是否无铅 |
不含铅 |
含铅 |
含铅 |
含铅 |
含铅 |
不含铅 |
不含铅 |
含铅 |
是否Rohs认证 |
符合 |
不符合 |
不符合 |
不符合 |
不符合 |
符合 |
符合 |
不符合 |
厂商名称 |
Altera (Intel) |
Altera (Intel) |
Altera (Intel) |
Altera (Intel) |
Altera (Intel) |
Altera (Intel) |
Altera (Intel) |
Altera (Intel) |
零件包装代码 |
BGA |
BGA |
BGA |
BGA |
BGA |
BGA |
BGA |
BGA |
包装说明 |
BGA, BGA484,22X22,40 |
23 X 23 MM, 1 MM PITCH, FBGA-484 |
23 X 23 MM, 1 MM PITCH, FBGA-484 |
29 X 29 MM, 1 MM PITCH, FBGA-780 |
29 X 29 MM, 1 MM PITCH, FBGA-780 |
29 X 29 MM, 1 MM PITCH, LEAD FREE, FBGA-780 |
29 X 29 MM, 1 MM PITCH, LEAD FREE, FBGA-780 |
29 X 29 MM, 1 MM PITCH, FBGA-780 |
针数 |
484 |
484 |
484 |
780 |
780 |
780 |
780 |
780 |
Reach Compliance Code |
compliant |
not_compliant |
not_compliant |
not_compliant |
not_compliant |
unknown |
unknown |
not_compliant |
ECCN代码 |
3A001.A.7.A |
3A001.A.7.A |
3A001.A.7.A |
3A001.A.7.A |
3A001.A.7.A |
3A001.A.7.A |
3A001.A.7.A |
3A001.A.7.A |
最大时钟频率 |
472.5 MHz |
265 MHz |
362 MHz |
472.5 MHz |
362 MHz |
362 MHz |
472.5 MHz |
362 MHz |
JESD-30 代码 |
S-PBGA-B484 |
S-PBGA-B484 |
S-PBGA-B484 |
S-PBGA-B780 |
S-PBGA-B780 |
S-PBGA-B780 |
S-PBGA-B780 |
S-PBGA-B780 |
JESD-609代码 |
e1 |
e0 |
e0 |
e0 |
e0 |
e1 |
e1 |
e0 |
长度 |
23 mm |
23 mm |
23 mm |
29 mm |
29 mm |
29 mm |
29 mm |
29 mm |
湿度敏感等级 |
3 |
3 |
3 |
3 |
3 |
3 |
3 |
3 |
可配置逻辑块数量 |
2475 |
2475 |
2475 |
2475 |
2475 |
2475 |
2475 |
2475 |
输入次数 |
328 |
331 |
331 |
535 |
535 |
535 |
535 |
535 |
逻辑单元数量 |
39600 |
39600 |
39600 |
39600 |
39600 |
39600 |
39600 |
39600 |
输出次数 |
328 |
331 |
331 |
535 |
535 |
535 |
535 |
535 |
端子数量 |
484 |
484 |
484 |
780 |
780 |
780 |
780 |
780 |
组织 |
2475 CLBS |
2475 CLBS |
2475 CLBS |
2475 CLBS |
2475 CLBS |
2475 CLBS |
2475 CLBS |
2475 CLBS |
封装主体材料 |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
封装代码 |
BGA |
BGA |
BGA |
BGA |
BGA |
BGA |
BGA |
BGA |
封装等效代码 |
BGA484,22X22,40 |
BGA484,22X22,40 |
BGA484,22X22,40 |
BGA780,28X28,40 |
BGA780,28X28,40 |
BGA780,28X28,40 |
BGA780,28X28,40 |
BGA780,28X28,40 |
封装形状 |
SQUARE |
SQUARE |
SQUARE |
SQUARE |
SQUARE |
SQUARE |
SQUARE |
SQUARE |
封装形式 |
GRID ARRAY |
GRID ARRAY |
GRID ARRAY |
GRID ARRAY |
GRID ARRAY |
GRID ARRAY |
GRID ARRAY |
GRID ARRAY |
峰值回流温度(摄氏度) |
260 |
220 |
220 |
220 |
220 |
245 |
260 |
220 |
电源 |
1.2,1.2/3.3,2.5 V |
1,1.2/3.3,2.5 V |
1,1.2/3.3,2.5 V |
1.2,1.2/3.3,2.5 V |
1,1.2/3.3,2.5 V |
1,1.2/3.3,2.5 V |
1.2,1.2/3.3,2.5 V |
1,1.2/3.3,2.5 V |
可编程逻辑类型 |
FIELD PROGRAMMABLE GATE ARRAY |
FIELD PROGRAMMABLE GATE ARRAY |
FIELD PROGRAMMABLE GATE ARRAY |
FIELD PROGRAMMABLE GATE ARRAY |
FIELD PROGRAMMABLE GATE ARRAY |
FIELD PROGRAMMABLE GATE ARRAY |
FIELD PROGRAMMABLE GATE ARRAY |
FIELD PROGRAMMABLE GATE ARRAY |
认证状态 |
Not Qualified |
Not Qualified |
Not Qualified |
Not Qualified |
Not Qualified |
Not Qualified |
Not Qualified |
Not Qualified |
座面最大高度 |
2.4 mm |
2.4 mm |
2.4 mm |
2.4 mm |
2.4 mm |
2.4 mm |
2.4 mm |
2.4 mm |
最大供电电压 |
1.25 V |
1.03 V |
1.03 V |
1.25 V |
1.03 V |
1.03 V |
1.25 V |
1.03 V |
最小供电电压 |
1.15 V |
0.97 V |
0.97 V |
1.15 V |
0.97 V |
0.97 V |
1.15 V |
0.97 V |
标称供电电压 |
1.2 V |
1 V |
1 V |
1.2 V |
1 V |
1 V |
1.2 V |
1 V |
表面贴装 |
YES |
YES |
YES |
YES |
YES |
YES |
YES |
YES |
端子面层 |
TIN SILVER COPPER |
Tin/Lead (Sn63Pb37) |
Tin/Lead (Sn63Pb37) |
Tin/Lead (Sn63Pb37) |
Tin/Lead (Sn63Pb37) |
Tin/Silver/Copper (Sn/Ag/Cu) |
Tin/Silver/Copper (Sn/Ag/Cu) |
Tin/Lead (Sn63Pb37) |
端子形式 |
BALL |
BALL |
BALL |
BALL |
BALL |
BALL |
BALL |
BALL |
端子节距 |
1 mm |
1 mm |
1 mm |
1 mm |
1 mm |
1 mm |
1 mm |
1 mm |
端子位置 |
BOTTOM |
BOTTOM |
BOTTOM |
BOTTOM |
BOTTOM |
BOTTOM |
BOTTOM |
BOTTOM |
处于峰值回流温度下的最长时间 |
40 |
30 |
30 |
30 |
30 |
40 |
30 |
30 |
宽度 |
23 mm |
23 mm |
23 mm |
29 mm |
29 mm |
29 mm |
29 mm |
29 mm |
Base Number Matches |
1 |
1 |
1 |
1 |
1 |
1 |
1 |
1 |
最高工作温度 |
125 °C |
85 °C |
- |
85 °C |
85 °C |
85 °C |
- |
- |
温度等级 |
AUTOMOTIVE |
OTHER |
- |
OTHER |
OTHER |
OTHER |
- |
- |