| 型号 |
EP3C25E144C7N |
EP3C25E144C7N |
| 描述 |
FPGA - Field Programmable Gate Array FPGA - Cyclone III 1539 LABs 82 IOs |
fpga - field programmable gate array fpga - cyclone iii 1539 labs 82 ios |
| 是否Rohs认证 |
符合 |
符合 |
| 厂商名称 |
Intel(英特尔) |
Altera (Intel) |
| 包装说明 |
LFQFP, QFP144,.87SQ,20 |
22 X 22 MM, 1.60 MM HEIGHT, 0.50 MM PITCH, PLASTIC, LEAD FREE, EQFP-144 |
| Reach Compliance Code |
compliant |
unknow |
| ECCN代码 |
3A991 |
3A991 |
| 最大时钟频率 |
472.5 MHz |
472.5 MHz |
| JESD-30 代码 |
R-PQFP-G144 |
R-PQFP-G144 |
| JESD-609代码 |
e3 |
e3 |
| 长度 |
20 mm |
20 mm |
| 湿度敏感等级 |
3 |
3 |
| 可配置逻辑块数量 |
24624 |
24624 |
| 输入次数 |
82 |
82 |
| 逻辑单元数量 |
24624 |
24624 |
| 输出次数 |
82 |
82 |
| 端子数量 |
144 |
144 |
| 最高工作温度 |
85 °C |
85 °C |
| 组织 |
24624 CLBS |
24624 CLBS |
| 封装主体材料 |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
| 封装代码 |
LFQFP |
LFQFP |
| 封装等效代码 |
QFP144,.87SQ,20 |
QFP144,.87SQ,20 |
| 封装形状 |
RECTANGULAR |
RECTANGULAR |
| 封装形式 |
FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH |
FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH |
| 峰值回流温度(摄氏度) |
260 |
260 |
| 可编程逻辑类型 |
FIELD PROGRAMMABLE GATE ARRAY |
FIELD PROGRAMMABLE GATE ARRAY |
| 认证状态 |
Not Qualified |
Not Qualified |
| 座面最大高度 |
1.6 mm |
1.6 mm |
| 最大供电电压 |
1.25 V |
1.25 V |
| 最小供电电压 |
1.15 V |
1.15 V |
| 标称供电电压 |
1.2 V |
1.2 V |
| 表面贴装 |
YES |
YES |
| 技术 |
CMOS |
CMOS |
| 温度等级 |
OTHER |
OTHER |
| 端子面层 |
MATTE TIN (472) OVER COPPER |
Matte Tin (Sn) - annealed |
| 端子形式 |
GULL WING |
GULL WING |
| 端子节距 |
0.5 mm |
0.5 mm |
| 端子位置 |
QUAD |
QUAD |
| 处于峰值回流温度下的最长时间 |
40 |
40 |
| 宽度 |
20 mm |
20 mm |