| 型号 |
CD74HCT08M96E4 |
CD74HCT08M96E4 |
CD74HCT08MG4 |
CD74HCT08MTE4 |
CD74HCT08MTG4 |
| 描述 |
AND Gate, HCT Series, 4-Func, 2-Input, CMOS, PDSO14, GREEN, PLASTIC, MS-012AB, SOIC-14 |
Logic Gates Hi-Speed CMOS Logic Quad 2-Inp AND Gate |
Logic Gates Hi Spd CMOS Log Quad 2-Input AND |
Logic Gates Hi-Speed CMOS Logic Quad 2-Inp AND Gate |
Logic Gates Hi Spd CMOS Log Quad 2-Input AND |
| 包装说明 |
SOP, |
SOP, SOP14,.25 |
GREEN, PLASTIC, MS-012AB, SOIC-14 |
GREEN, PLASTIC, MS-012AB, SOIC-14 |
GREEN, PLASTIC, MS-012AB, SOIC-14 |
| Reach Compliance Code |
unknown |
unknown |
unknown |
unknown |
unknown |
| 系列 |
HCT |
HCT |
HCT |
HCT |
HCT |
| JESD-30 代码 |
R-PDSO-G14 |
R-PDSO-G14 |
R-PDSO-G14 |
R-PDSO-G14 |
R-PDSO-G14 |
| 长度 |
8.65 mm |
8.65 mm |
8.65 mm |
8.65 mm |
8.65 mm |
| 逻辑集成电路类型 |
AND GATE |
AND GATE |
AND GATE |
AND GATE |
AND GATE |
| 功能数量 |
4 |
4 |
4 |
4 |
4 |
| 输入次数 |
2 |
2 |
2 |
2 |
2 |
| 端子数量 |
14 |
14 |
14 |
14 |
14 |
| 最高工作温度 |
125 °C |
125 °C |
125 °C |
125 °C |
125 °C |
| 最低工作温度 |
-55 °C |
-55 °C |
-55 °C |
-55 °C |
-55 °C |
| 封装主体材料 |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
| 封装代码 |
SOP |
SOP |
SOP |
SOP |
SOP |
| 封装形状 |
RECTANGULAR |
RECTANGULAR |
RECTANGULAR |
RECTANGULAR |
RECTANGULAR |
| 封装形式 |
SMALL OUTLINE |
SMALL OUTLINE |
SMALL OUTLINE |
SMALL OUTLINE |
SMALL OUTLINE |
| 传播延迟(tpd) |
38 ns |
38 ns |
38 ns |
38 ns |
38 ns |
| 座面最大高度 |
1.75 mm |
1.75 mm |
1.75 mm |
1.75 mm |
1.75 mm |
| 最大供电电压 (Vsup) |
5.5 V |
5.5 V |
5.5 V |
5.5 V |
5.5 V |
| 最小供电电压 (Vsup) |
4.5 V |
4.5 V |
4.5 V |
4.5 V |
4.5 V |
| 标称供电电压 (Vsup) |
5 V |
5 V |
5 V |
5 V |
5 V |
| 表面贴装 |
YES |
YES |
YES |
YES |
YES |
| 技术 |
CMOS |
CMOS |
CMOS |
CMOS |
CMOS |
| 温度等级 |
MILITARY |
MILITARY |
MILITARY |
MILITARY |
MILITARY |
| 端子形式 |
GULL WING |
GULL WING |
GULL WING |
GULL WING |
GULL WING |
| 端子节距 |
1.27 mm |
1.27 mm |
1.27 mm |
1.27 mm |
1.27 mm |
| 端子位置 |
DUAL |
DUAL |
DUAL |
DUAL |
DUAL |
| 宽度 |
3.9 mm |
3.9 mm |
3.9 mm |
3.9 mm |
3.9 mm |
| Base Number Matches |
1 |
1 |
1 |
1 |
1 |
| 是否无铅 |
- |
不含铅 |
不含铅 |
不含铅 |
不含铅 |
| 是否Rohs认证 |
- |
符合 |
符合 |
符合 |
符合 |
| 零件包装代码 |
- |
SOIC |
SOIC |
SOIC |
SOIC |
| 针数 |
- |
14 |
14 |
14 |
14 |
| ECCN代码 |
- |
EAR99 |
EAR99 |
EAR99 |
EAR99 |
| JESD-609代码 |
- |
e4 |
e4 |
e4 |
e4 |
| 负载电容(CL) |
- |
50 pF |
50 pF |
50 pF |
50 pF |
| 最大I(ol) |
- |
0.004 A |
0.004 A |
0.004 A |
0.004 A |
| 湿度敏感等级 |
- |
1 |
1 |
1 |
1 |
| 封装等效代码 |
- |
SOP14,.25 |
SOP14,.25 |
SOP14,.25 |
SOP14,.25 |
| 包装方法 |
- |
TAPE AND REEL |
TUBE |
TAPE AND REEL |
TAPE AND REEL |
| 峰值回流温度(摄氏度) |
- |
260 |
260 |
260 |
260 |
| 电源 |
- |
5 V |
5 V |
5 V |
5 V |
| Prop。Delay @ Nom-Sup |
- |
38 ns |
38 ns |
38 ns |
38 ns |
| 认证状态 |
- |
Not Qualified |
Not Qualified |
Not Qualified |
Not Qualified |
| 施密特触发器 |
- |
NO |
NO |
NO |
NO |
| 端子面层 |
- |
Nickel/Palladium/Gold (Ni/Pd/Au) |
Nickel/Palladium/Gold (Ni/Pd/Au) |
Nickel/Palladium/Gold (Ni/Pd/Au) |
Nickel/Palladium/Gold (Ni/Pd/Au) |
| 处于峰值回流温度下的最长时间 |
- |
NOT SPECIFIED |
NOT SPECIFIED |
NOT SPECIFIED |
NOT SPECIFIED |
| 厂商名称 |
- |
- |
Texas Instruments(德州仪器) |
Texas Instruments(德州仪器) |
Texas Instruments(德州仪器) |