| 器件名 | 厂商 | 描 述 | 功能 |
|---|---|---|---|
| CD74HC259M | General Electric Solid State | FF/Latch, | 下载 |
| CD74HC259M | RCA | D Latch, 1-Func, 8-Bit, CMOS, PDSO16, | 下载 |
| CD74HC259M | Texas Instruments(德州仪器) | High Speed CMOS Logic 8-Bit Addressable Latch 16-SOIC -55 to 125 | 下载 |
| CD74HC259M | Harris | D Latch, HC/UH Series, 1-Func, Low Level Triggered, 1-Bit, True Output, CMOS, PDSO16, SOIC-16 | 下载 |
| CD74HC259M | Renesas(瑞萨电子) | D LATCH | 下载 |
| CD74HC259M | Rochester Electronics | D Latch, HC/UH Series, 1-Func, Low Level Triggered, 1-Bit, True Output, CMOS, PDSO16, SOIC-16 | 下载 |
| CD74HC259M96 | Texas Instruments(德州仪器) | 电压-电源:2V ~ 6V 逻辑类型:D 型,可寻址 输出类型:- 系列:74HC | 下载 |
| CD74HC259M96 | Renesas(瑞萨电子) | D LATCH | 下载 |
| CD74HC259M96 | Harris | D Latch, HC/UH Series, 1-Func, Low Level Triggered, 1-Bit, True Output, CMOS, PDSO16, SOIC-16 | 下载 |
| CD74HC259M96 | RCA | D Latch, 1-Func, 8-Bit, CMOS, PDSO16, | 下载 |
| CD74HC259M96E4 | Texas Instruments(德州仪器) | Latches High Speed CMOS 8-Bit Add Latch | 下载 |
| CD74HC259M96E4 | Rochester Electronics | D Latch, HC/UH Series, 1-Func, Low Level Triggered, 8-Bit, True Output, CMOS, PDSO16, GREEN, PLASTIC, MS-012AC, SOIC-16 | 下载 |
| CD74HC259M96G4 | Texas Instruments(德州仪器) | Latches Hi Sp CMOS Log 8B Addressable Latch | 下载 |
| CD74HC259ME4 | Texas Instruments(德州仪器) | Latches High Speed CMOS 8-Bit Add Latch | 下载 |
| CD74HC259ME4 | Rochester Electronics | D Latch, HC/UH Series, 1-Func, Low Level Triggered, 8-Bit, True Output, CMOS, PDSO16, GREEN, PLASTIC, MS-012AC, SOIC-16 | 下载 |
| CD74HC259MG4 | Texas Instruments(德州仪器) | High Speed CMOS Logic 8-Bit Addressable Latch 16-SOIC -55 to 125 | 下载 |
| CD74HC259MT | Texas Instruments(德州仪器) | High Speed CMOS Logic 8-Bit Addressable Latch 16-SOIC -55 to 125 | 下载 |
| CD74HC259MTE4 | Texas Instruments(德州仪器) | Latches High Speed CMOS 8-Bit Add Latch | 下载 |
| CD74HC259MTG4 | Texas Instruments(德州仪器) | Latches Hi Sp CMOS Log 8B Addressable Latch | 下载 |
| CD74HC259MX | RCA | D Latch, 1-Func, 8-Bit, CMOS, PDSO16 | 下载 |
| 对应元器件 | pdf文档资料下载 |
|---|---|
| CD74HC259M96E4 、 CD74HC259M96G4 、 CD74HC259ME4 、 CD74HC259MTE4 、 CD74HC259MTG4 | 下载文档 |
| CD74HC259M 、 CD74HC259M96 、 CD74HC259MX | 下载文档 |
| CD74HC259M 、 CD74HC259MG4 、 CD74HC259MT | 下载文档 |
| CD74HC259M96E4 、 CD74HC259ME4 | 下载文档 |
| CD74HC259M 、 CD74HC259M96 | 下载文档 |
| CD74HC259M 、 CD74HC259M96 | 下载文档 |
| CD74HC259M | 下载文档 |
| CD74HC259M96 | 下载文档 |
| CD74HC259M | 下载文档 |
| 型号 | CD74HC259M96E4 | CD74HC259M96G4 | CD74HC259ME4 | CD74HC259MTE4 | CD74HC259MTG4 |
|---|---|---|---|---|---|
| 描述 | Latches High Speed CMOS 8-Bit Add Latch | Latches Hi Sp CMOS Log 8B Addressable Latch | Latches High Speed CMOS 8-Bit Add Latch | Latches High Speed CMOS 8-Bit Add Latch | Latches Hi Sp CMOS Log 8B Addressable Latch |
| 是否无铅 | 不含铅 | 不含铅 | 不含铅 | 不含铅 | 不含铅 |
| 是否Rohs认证 | 符合 | 符合 | 符合 | 符合 | 符合 |
| 厂商名称 | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) |
| 零件包装代码 | SOIC | SOIC | SOIC | SOIC | SOIC |
| 包装说明 | SOP, SOP16,.25 | SOP, SOP16,.25 | SOP, SOP16,.25 | SOP, SOP16,.25 | GREEN, PLASTIC, MS-012AC, SOIC-16 |
| 针数 | 16 | 16 | 16 | 16 | 16 |
| Reach Compliance Code | unknow | unknow | unknow | unknow | unknown |
| 其他特性 | 1:8 DMUX FOLLOWED BY LATCH | 1:8 DMUX FOLLOWED BY LATCH | 1:8 DMUX FOLLOWED BY LATCH | 1:8 DMUX FOLLOWED BY LATCH | 1:8 DMUX FOLLOWED BY LATCH |
| 系列 | HC/UH | HC/UH | HC/UH | HC/UH | HC/UH |
| JESD-30 代码 | R-PDSO-G16 | R-PDSO-G16 | R-PDSO-G16 | R-PDSO-G16 | R-PDSO-G16 |
| JESD-609代码 | e4 | e4 | e4 | e4 | e4 |
| 长度 | 9.9 mm | 9.9 mm | 9.9 mm | 9.9 mm | 9.9 mm |
| 负载电容(CL) | 50 pF | 50 pF | 50 pF | 50 pF | 50 pF |
| 逻辑集成电路类型 | D LATCH | D LATCH | D LATCH | D LATCH | D LATCH |
| 最大I(ol) | 0.004 A | 0.004 A | 0.004 A | 0.004 A | 0.004 A |
| 湿度敏感等级 | 1 | 1 | 1 | 1 | 1 |
| 位数 | 8 | 8 | 8 | 8 | 8 |
| 功能数量 | 1 | 1 | 1 | 1 | 1 |
| 端子数量 | 16 | 16 | 16 | 16 | 16 |
| 最高工作温度 | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C |
| 最低工作温度 | -55 °C | -55 °C | -55 °C | -55 °C | -55 °C |
| 输出极性 | TRUE | TRUE | TRUE | TRUE | TRUE |
| 封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| 封装代码 | SOP | SOP | SOP | SOP | SOP |
| 封装等效代码 | SOP16,.25 | SOP16,.25 | SOP16,.25 | SOP16,.25 | SOP16,.25 |
| 封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| 封装形式 | SMALL OUTLINE | SMALL OUTLINE | SMALL OUTLINE | SMALL OUTLINE | SMALL OUTLINE |
| 包装方法 | TAPE AND REEL | TAPE AND REEL | TUBE | TAPE AND REEL | TAPE AND REEL |
| 峰值回流温度(摄氏度) | 260 | 260 | 260 | 260 | 260 |
| 电源 | 2/6 V | 2/6 V | 2/6 V | 2/6 V | 2/6 V |
| 传播延迟(tpd) | 255 ns | 255 ns | 255 ns | 255 ns | 255 ns |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 座面最大高度 | 1.75 mm | 1.75 mm | 1.75 mm | 1.75 mm | 1.75 mm |
| 最大供电电压 (Vsup) | 6 V | 6 V | 6 V | 6 V | 6 V |
| 最小供电电压 (Vsup) | 2 V | 2 V | 2 V | 2 V | 2 V |
| 标称供电电压 (Vsup) | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V |
| 表面贴装 | YES | YES | YES | YES | YES |
| 技术 | CMOS | CMOS | CMOS | CMOS | CMOS |
| 温度等级 | MILITARY | MILITARY | MILITARY | MILITARY | MILITARY |
| 端子面层 | Nickel/Palladium/Gold (Ni/Pd/Au) | Nickel/Palladium/Gold (Ni/Pd/Au) | Nickel/Palladium/Gold (Ni/Pd/Au) | Nickel/Palladium/Gold (Ni/Pd/Au) | Nickel/Palladium/Gold (Ni/Pd/Au) |
| 端子形式 | GULL WING | GULL WING | GULL WING | GULL WING | GULL WING |
| 端子节距 | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm |
| 端子位置 | DUAL | DUAL | DUAL | DUAL | DUAL |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
| 触发器类型 | LOW LEVEL | LOW LEVEL | LOW LEVEL | LOW LEVEL | LOW LEVEL |
| 宽度 | 3.9 mm | 3.9 mm | 3.9 mm | 3.9 mm | 3.9 mm |
| Prop。Delay @ Nom-Su | 56 ns | 56 ns | 56 ns | 56 ns | - |
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