| 器件名 | 厂商 | 描 述 | 功能 |
|---|---|---|---|
| ADG5212 | ADI(亚德诺半导体) | ANALOG DEVICES - ADG5212BRUZ - IC; ANALOG SWITCH; QUAD; SPST; TSSOP-16 | 下载 |
| ADG5212BCPZ-RL7 | ADI(亚德诺半导体) | High Voltage Latch-Up Proof, Quad SPST Switches | 下载 |
| ADG5212BRUZ | ADI(亚德诺半导体) | High Voltage Latch-Up Proof, Quad SPST Switches | 下载 |
| ADG5212BRUZ-RL7 | ADI(亚德诺半导体) | Analog Switch ICs High VTG Latch-Up Proof Quad SPST | 下载 |
| ADG5213 | ADI(亚德诺半导体) | ANALOG DEVICES - ADG5212BRUZ - IC; ANALOG SWITCH; QUAD; SPST; TSSOP-16 | 下载 |
| ADG5213BCPZ-RL7 | ADI(亚德诺半导体) | High Voltage Latch-Up Proof, Quad SPST Switches | 下载 |
| ADG5213BRUZ | ADI(亚德诺半导体) | High Voltage Latch-Up Proof, Quad SPST Switches | 下载 |
| ADG5213BRUZ-RL7 | ADI(亚德诺半导体) | High Voltage Latch-Up Proof, Quad SPST Switches | 下载 |
| 对应元器件 | pdf文档资料下载 |
|---|---|
| ADG5212BCPZ-RL7 、 ADG5212BRUZ 、 ADG5213BCPZ-RL7 、 ADG5213BRUZ 、 ADG5213BRUZ-RL7 | 下载文档 |
| ADG5212 、 ADG5213 | 下载文档 |
| ADG5212BRUZ-RL7 | 下载文档 |
| 型号 | ADG5213BRUZ-RL7 | ADG5212BCPZ-RL7 | ADG5212BRUZ | ADG5213BCPZ-RL7 | ADG5213BRUZ |
|---|---|---|---|---|---|
| 描述 | High Voltage Latch-Up Proof, Quad SPST Switches | High Voltage Latch-Up Proof, Quad SPST Switches | High Voltage Latch-Up Proof, Quad SPST Switches | High Voltage Latch-Up Proof, Quad SPST Switches | High Voltage Latch-Up Proof, Quad SPST Switches |
| Source Url Status Check Date | 2013-05-01 14:56:37.687 | 2013-05-01 14:56:37.685 | 2013-05-01 14:56:37.685 | 2013-05-01 14:56:37.686 | 2013-05-01 14:56:37.687 |
| Brand Name | Analog Devices Inc | Analog Devices Inc | Analog Devices Inc | Analog Devices Inc | Analog Devices Inc |
| 是否无铅 | 含铅 | 含铅 | 含铅 | 含铅 | 含铅 |
| 是否Rohs认证 | 符合 | 符合 | 符合 | 符合 | 符合 |
| 厂商名称 | ADI(亚德诺半导体) | ADI(亚德诺半导体) | ADI(亚德诺半导体) | ADI(亚德诺半导体) | ADI(亚德诺半导体) |
| 包装说明 | TSSOP, TSSOP16,.25 | HVQCCN, LCC16,.16SQ,25 | TSSOP, TSSOP16,.25 | HVQCCN, LCC16,.16SQ,25 | TSSOP, TSSOP16,.25 |
| 针数 | 16 | 16 | 16 | 16 | 16 |
| 制造商包装代码 | RU-16 | CP-16-17 | RU-16 | CP-16-17 | RU-16 |
| Reach Compliance Code | compliant | compli | compliant | compliant | compliant |
| 模拟集成电路 - 其他类型 | SPST | SPST | SPST | SPST | SPST |
| JESD-30 代码 | R-PDSO-G16 | S-XQCC-N16 | R-PDSO-G16 | S-XQCC-N16 | R-PDSO-G16 |
| JESD-609代码 | e3 | e3 | e3 | e3 | e3 |
| 长度 | 5 mm | 4 mm | 5 mm | 4 mm | 5 mm |
| 湿度敏感等级 | 1 | 3 | 1 | 3 | 1 |
| 负电源电压最大值(Vsup) | -22 V | -22 V | -22 V | -22 V | -22 V |
| 负电源电压最小值(Vsup) | -9 V | -9 V | -9 V | -9 V | -9 V |
| 标称负供电电压 (Vsup) | -15 V | -15 V | -15 V | -15 V | -15 V |
| 正常位置 | NO/NC | NO | NO | NO/NC | NO/NC |
| 信道数量 | 1 | 1 | 1 | 1 | 1 |
| 功能数量 | 4 | 4 | 4 | 4 | 4 |
| 端子数量 | 16 | 16 | 16 | 16 | 16 |
| 通态电阻匹配规范 | 2 Ω | 2 Ω | 2 Ω | 2 Ω | 2 Ω |
| 最大通态电阻 (Ron) | 200 Ω | 200 Ω | 200 Ω | 200 Ω | 200 Ω |
| 最高工作温度 | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C |
| 最低工作温度 | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C |
| 输出 | SEPARATE OUTPUT | SEPARATE OUTPUT | SEPARATE OUTPUT | SEPARATE OUTPUT | SEPARATE OUTPUT |
| 封装主体材料 | PLASTIC/EPOXY | UNSPECIFIED | PLASTIC/EPOXY | UNSPECIFIED | PLASTIC/EPOXY |
| 封装代码 | TSSOP | HVQCCN | TSSOP | HVQCCN | TSSOP |
| 封装等效代码 | TSSOP16,.25 | LCC16,.16SQ,25 | TSSOP16,.25 | LCC16,.16SQ,25 | TSSOP16,.25 |
| 封装形状 | RECTANGULAR | SQUARE | RECTANGULAR | SQUARE | RECTANGULAR |
| 封装形式 | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
| 峰值回流温度(摄氏度) | 260 | 260 | 260 | 260 | 260 |
| 电源 | +-9/+-22/9/40 V | +-9/+-22/9/40 V | +-9/+-22/9/40 V | +-9/+-22/9/40 V | +-9/+-22/9/40 V |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 座面最大高度 | 1.2 mm | 0.8 mm | 1.2 mm | 0.8 mm | 1.2 mm |
| 最大供电电压 (Vsup) | 22 V | 22 V | 22 V | 22 V | 22 V |
| 最小供电电压 (Vsup) | 9 V | 9 V | 9 V | 9 V | 9 V |
| 标称供电电压 (Vsup) | 15 V | 15 V | 15 V | 15 V | 15 V |
| 表面贴装 | YES | YES | YES | YES | YES |
| 最长接通时间 | 290 ns | 290 ns | 290 ns | 290 ns | 290 ns |
| 切换 | BREAK-BEFORE-MAKE | BREAK-BEFORE-MAKE | BREAK-BEFORE-MAKE | BREAK-BEFORE-MAKE | BREAK-BEFORE-MAKE |
| 技术 | CMOS | CMOS | CMOS | CMOS | CMOS |
| 温度等级 | AUTOMOTIVE | AUTOMOTIVE | AUTOMOTIVE | AUTOMOTIVE | AUTOMOTIVE |
| 端子面层 | Matte Tin (Sn) | Matte Tin (Sn) | Matte Tin (Sn) | Matte Tin (Sn) | Matte Tin (Sn) |
| 端子形式 | GULL WING | NO LEAD | GULL WING | NO LEAD | GULL WING |
| 端子节距 | 0.65 mm | 0.65 mm | 0.65 mm | 0.65 mm | 0.65 mm |
| 端子位置 | DUAL | QUAD | DUAL | QUAD | DUAL |
| 处于峰值回流温度下的最长时间 | 30 | 30 | 30 | 30 | 30 |
| 宽度 | 4.4 mm | 4 mm | 4.4 mm | 4 mm | 4.4 mm |
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