型号 |
71V546S133PFGI8 |
71V546S133PFG |
71V546S133PFG8 |
71V546S133PFGI |
描述 |
TQFP-100, Reel |
TQFP-100, Tray |
TQFP-100, Reel |
TQFP-100, Tray |
Brand Name |
Integrated Device Technology |
Integrated Device Technology |
Integrated Device Technology |
Integrated Device Technology |
是否无铅 |
不含铅 |
不含铅 |
不含铅 |
不含铅 |
是否Rohs认证 |
符合 |
符合 |
符合 |
符合 |
厂商名称 |
IDT (Integrated Device Technology) |
IDT (Integrated Device Technology) |
IDT (Integrated Device Technology) |
IDT (Integrated Device Technology) |
零件包装代码 |
TQFP |
TQFP |
TQFP |
TQFP |
包装说明 |
QFP, QFP100,.63X.87 |
LQFP, QFP100,.63X.87 |
QFP, QFP100,.63X.87 |
LQFP, QFP100,.63X.87 |
针数 |
100 |
100 |
100 |
100 |
制造商包装代码 |
PKG100 |
PKG100 |
PKG100 |
PKG100 |
Reach Compliance Code |
compliant |
compliant |
compliant |
compliant |
ECCN代码 |
3A991.B.2.A |
3A991.B.2.A |
3A991.B.2.A |
3A991.B.2.A |
Samacsys Description |
TQFP 14.0 X 20.0 X 1.4 MM |
TQFP 14.0 X 20.0 X 1.4 MM |
TQFP 14.0 X 20.0 X 1.4 MM |
TQFP 14.0 X 20.0 X 1.4 MM |
最长访问时间 |
4.2 ns |
4.2 ns |
4.2 ns |
4.2 ns |
最大时钟频率 (fCLK) |
133 MHz |
133 MHz |
133 MHz |
133 MHz |
I/O 类型 |
COMMON |
COMMON |
COMMON |
COMMON |
JESD-30 代码 |
R-PQFP-G100 |
R-PQFP-G100 |
R-PQFP-G100 |
R-PQFP-G100 |
JESD-609代码 |
e3 |
e3 |
e3 |
e3 |
内存密度 |
4718592 bit |
4718592 bit |
4718592 bit |
4718592 bit |
内存集成电路类型 |
ZBT SRAM |
ZBT SRAM |
ZBT SRAM |
ZBT SRAM |
内存宽度 |
36 |
36 |
36 |
36 |
湿度敏感等级 |
3 |
3 |
3 |
3 |
功能数量 |
1 |
1 |
1 |
1 |
端子数量 |
100 |
100 |
100 |
100 |
字数 |
131072 words |
131072 words |
131072 words |
131072 words |
字数代码 |
128000 |
128000 |
128000 |
128000 |
工作模式 |
SYNCHRONOUS |
SYNCHRONOUS |
SYNCHRONOUS |
SYNCHRONOUS |
最高工作温度 |
85 °C |
85 °C |
70 °C |
85 °C |
最低工作温度 |
-40 °C |
-40 °C |
- |
-40 °C |
组织 |
128KX36 |
128KX36 |
128KX36 |
128KX36 |
输出特性 |
3-STATE |
3-STATE |
3-STATE |
3-STATE |
封装主体材料 |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
封装代码 |
QFP |
LQFP |
QFP |
LQFP |
封装等效代码 |
QFP100,.63X.87 |
QFP100,.63X.87 |
QFP100,.63X.87 |
QFP100,.63X.87 |
封装形状 |
RECTANGULAR |
RECTANGULAR |
RECTANGULAR |
RECTANGULAR |
封装形式 |
FLATPACK |
FLATPACK, LOW PROFILE |
FLATPACK |
FLATPACK, LOW PROFILE |
并行/串行 |
PARALLEL |
PARALLEL |
PARALLEL |
PARALLEL |
峰值回流温度(摄氏度) |
260 |
260 |
260 |
260 |
电源 |
3.3 V |
3.3 V |
3.3 V |
3.3 V |
认证状态 |
Not Qualified |
Not Qualified |
Not Qualified |
Not Qualified |
最大待机电流 |
0.045 A |
0.04 A |
0.04 A |
0.045 A |
最小待机电流 |
3.14 V |
3.14 V |
3.14 V |
3.14 V |
最大压摆率 |
0.31 mA |
0.3 mA |
0.3 mA |
0.31 mA |
最大供电电压 (Vsup) |
3.465 V |
3.465 V |
3.465 V |
3.465 V |
最小供电电压 (Vsup) |
3.135 V |
3.135 V |
3.135 V |
3.135 V |
标称供电电压 (Vsup) |
3.3 V |
3.3 V |
3.3 V |
3.3 V |
表面贴装 |
YES |
YES |
YES |
YES |
技术 |
CMOS |
CMOS |
CMOS |
CMOS |
温度等级 |
INDUSTRIAL |
INDUSTRIAL |
COMMERCIAL |
INDUSTRIAL |
端子面层 |
MATTE TIN |
Matte Tin (Sn) - annealed |
MATTE TIN |
Matte Tin (Sn) - annealed |
端子形式 |
GULL WING |
GULL WING |
GULL WING |
GULL WING |
端子节距 |
0.635 mm |
0.65 mm |
0.635 mm |
0.65 mm |
端子位置 |
QUAD |
QUAD |
QUAD |
QUAD |
处于峰值回流温度下的最长时间 |
30 |
30 |
30 |
30 |
Base Number Matches |
1 |
1 |
1 |
1 |