器件名 | 厂商 | 描 述 | 功能 |
---|---|---|---|
25LC640 | Microchip(微芯科技) | 8K X 8 SPI BUS SERIAL EEPROM, PDSO8 | 下载 |
25LC640A | Microchip(微芯科技) | 8KX8 SPI BUS SERIAL EEPROM, PDSO8 | 下载 |
25LC640A-E/MF | Microchip(微芯科技) | 8K X 8 SPI BUS SERIAL EEPROM, PDSO8 | 下载 |
25LC640A-E/MNY | Microchip(微芯科技) | 8K X 8 SPI BUS SERIAL EEPROM, PDSO8 | 下载 |
25LC640A-E/MS | Microchip(微芯科技) | 8K X 8 SPI BUS SERIAL EEPROM, PDSO8 | 下载 |
25LC640A-E-MS | Microchip(微芯科技) | EEPROM 64K 8K X 8 25V SER EE EXT | 下载 |
25LC640A-E/P | Microchip(微芯科技) | 电可擦除可编程只读存储器 64K 8K X 8 25V SER EE EXT | 下载 |
25LC640A-E/SN | Microchip(微芯科技) | 电可擦除可编程只读存储器 64K 8K X 8 25V SER EE EXT | 下载 |
25LC640A-E/SN16KVAO | Microchip(微芯科技) | EEPROM, 8KX8, Serial, CMOS, PDSO8 | 下载 |
25LC640A-E/ST | Microchip(微芯科技) | 8K X 8 SPI BUS SERIAL EEPROM, PDSO8 | 下载 |
25LC640A-E-ST | Microchip(微芯科技) | Tantalum Capacitors - Solid SMD 1.00UF 50.0V | 下载 |
25LC640A-E/ST16KVAO | Microchip(微芯科技) | EEPROM, 8KX8, Serial, CMOS, PDSO8 | 下载 |
25LC640A-H/SN | Microchip(微芯科技) | 电可擦除可编程只读存储器 64K 8K X 8 2.5V SER EE 150C | 下载 |
25LC640A-I/MF | Microchip(微芯科技) | 8K X 8 SPI BUS SERIAL EEPROM, PDSO8 | 下载 |
25LC640A-I/MNY | Microchip(微芯科技) | 8K X 8 SPI BUS SERIAL EEPROM, PDSO8 | 下载 |
25LC640A-I/MS | Microchip(微芯科技) | 8K X 8 SPI BUS SERIAL EEPROM, PDSO8 | 下载 |
25LC640A-I-MS | Microchip(微芯科技) | EEPROM 64K 8K X 8 25V SER EE IND | 下载 |
25LC640A-I/P | Microchip(微芯科技) | 电可擦除可编程只读存储器 64K 8KX8 2.5V SER EE IND | 下载 |
25LC640A-I/SN | Microchip(微芯科技) | 存储器接口类型:SPI 存储器容量:64Kb (8K x 8) 工作电压:2.5V ~ 5.5V 存储器类型:Non-Volatile | 下载 |
25LC640A-I/ST | Microchip(微芯科技) | EEPROM 64K 8K X 8 25V SER EE IND | 下载 |
25LC640A-M/SN | Microchip(微芯科技) | 8K X 8 SPI BUS SERIAL EEPROM, PDSO8 | 下载 |
25LC640A-M-SN | Microchip(微芯科技) | Tactile Switches Top Actuated w/o boss w/o ground | 下载 |
25LC640AT-E/MF | Microchip(微芯科技) | 8K X 8 SPI BUS SERIAL EEPROM, PDSO8 | 下载 |
25LC640AT-E/MNY | Microchip(微芯科技) | 电可擦除可编程只读存储器 64K 8K X 8 2.5V SER EE EXT | 下载 |
25LC640AT-E/MS | Microchip(微芯科技) | 8K X 8 SPI BUS SERIAL EEPROM, PDSO8 | 下载 |
25LC640AT-E-MS | Microchip(微芯科技) | EEPROM 64K 8K X 8 25V SER EE EXT | 下载 |
25LC640AT-E/P | Microchip(微芯科技) | 8K X 8 SPI BUS SERIAL EEPROM, PDSO8 | 下载 |
25LC640AT-E/SN | Microchip(微芯科技) | 8K X 8 SPI BUS SERIAL EEPROM, PDSO8 | 下载 |
25LC640AT-E-SN | Microchip(微芯科技) | EEPROM 64K 8K X 8 25V SER EE EXT | 下载 |
25LC640AT-E/SN16KVAO | Microchip(微芯科技) | EEPROM, 8KX8, Serial, CMOS, PDSO8 | 下载 |
对应元器件 | pdf文档资料下载 |
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25LC640-I/PREL 、 25LC640-I/PRELG 、 25LC640-I/STG 、 25LC640/S 、 25LC640/W 、 25LC640/WF | 下载文档 |
25LC640 、 25LC640-E/P 、 25LC640-E/SN 、 25LC640-E/ST 、 25LC640-I/P 、 25LC640-I/ST | 下载文档 |
25LC640A-E-MS 、 25LC640A-E-ST 、 25LC640AT-I-MS 、 25LC640AT-I-ST 、 25LC640AXT-E-ST | 下载文档 |
25LC640-E-SN 、 25LC640-I-P 、 25LC640-I/SN 、 25LC640-S 、 25LC640-WF | 下载文档 |
25LC640-E/PG 、 25LC640-E/SNVAO 、 25LC640-E/STG 、 25LC640-I/PG | 下载文档 |
25LC640A-E/SN16KVAO 、 25LC640A-E/ST16KVAO 、 25LC640AT-E/SN16KVAO 、 25LC640AT-E/ST16KVAO | 下载文档 |
25LC640/PG 、 25LC640/SNG 、 25LC640/STG | 下载文档 |
25LC640A 、 25LC640AT-H/SN | 下载文档 |
25LC640-E-PG 、 25LC640-I-PG | 下载文档 |
25LC640-E-P 、 25LC640-W | 下载文档 |
型号 | 25LC640 | 25LC640-E/P | 25LC640-E/SN | 25LC640-E/ST | 25LC640-I/P | 25LC640-I/ST |
---|---|---|---|---|---|---|
描述 | 8K X 8 SPI BUS SERIAL EEPROM, PDSO8 | 8K X 8 SPI BUS SERIAL EEPROM, PDSO8 | 8K X 8 SPI BUS SERIAL EEPROM, PDSO8 | 8K X 8 SPI BUS SERIAL EEPROM, PDSO8 | 8K X 8 SPI BUS SERIAL EEPROM, PDIP8 | Evaluation Kit for the MAX1873 |
功能数量 | 1 | 1 | 1 | 1 | 1 | 1 |
端子数量 | 8 | 8 | 8 | 8 | 8 | 8 |
表面贴装 | Yes | NO | YES | YES | NO | YES |
端子形式 | GULL WING | THROUGH-HOLE | GULL WING | GULL WING | THROUGH-HOLE | GULL WING |
端子位置 | 双 | DUAL | DUAL | DUAL | DUAL | DUAL |
温度等级 | INDUSTRIAL | AUTOMOTIVE | AUTOMOTIVE | AUTOMOTIVE | INDUSTRIAL | INDUSTRIAL |
内存宽度 | 8 | 8 | 8 | 8 | 8 | 8 |
组织 | 8K × 8 | 8KX8 | 8KX8 | 8KX8 | 8KX8 | 8KX8 |
是否无铅 | - | 不含铅 | 不含铅 | 不含铅 | 不含铅 | 不含铅 |
是否Rohs认证 | - | 符合 | 符合 | 符合 | 符合 | 符合 |
零件包装代码 | - | DIP | SOIC | TSSOP | DIP | SOIC |
包装说明 | - | DIP, DIP8,.3 | SOP, SOP8,.25 | 4.40 MM, PLASTIC, MO-153, TSSOP-8 | DIP, DIP8,.3 | 4.40 MM, PLASTIC, TSSOP-8 |
针数 | - | 8 | 8 | 8 | 8 | 8 |
Reach Compliance Code | - | compli | compli | compli | compli | compli |
ECCN代码 | - | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 |
其他特性 | - | 1000K ERASE/WRITE CYCLES; DATA RETENTION > 200 YEARS | 1000K ERASE/WRITE CYCLES; DATA RETENTION > 200 YEARS | 1000K ERASE/WRITE CYCLES; DATA RETENTION > 200 YEARS | 1000K ERASE/WRITE CYCLES; DATA RETENTION > 200 YEARS | 1000K ERASE/WRITE CYCLES; DATA RETENTION > 200 YEARS |
最大时钟频率 (fCLK) | - | 3 MHz | 3 MHz | 3 MHz | 2 MHz | 2 MHz |
数据保留时间-最小值 | - | 200 | 200 | 200 | 200 | 200 |
耐久性 | - | 100000 Write/Erase Cycles | 100000 Write/Erase Cycles | 100000 Write/Erase Cycles | 100000 Write/Erase Cycles | 100000 Write/Erase Cycles |
JESD-30 代码 | - | R-PDIP-T8 | R-PDSO-G8 | R-PDSO-G8 | R-PDIP-T8 | R-PDSO-G8 |
JESD-609代码 | - | e3 | e3 | e3 | e3 | e3 |
长度 | - | 9.46 mm | 4.9 mm | 4.4 mm | 9.27 mm | 4.4 mm |
内存密度 | - | 65536 bi | 65536 bi | 65536 bi | 65536 bi | 65536 bi |
内存集成电路类型 | - | EEPROM | EEPROM | EEPROM | EEPROM | EEPROM |
字数 | - | 8192 words | 8192 words | 8192 words | 8192 words | 8192 words |
字数代码 | - | 8000 | 8000 | 8000 | 8000 | 8000 |
工作模式 | - | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS |
最高工作温度 | - | 125 °C | 125 °C | 125 °C | 85 °C | 85 °C |
最低工作温度 | - | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C |
封装主体材料 | - | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
封装代码 | - | DIP | SOP | TSSOP | DIP | TSSOP |
封装等效代码 | - | DIP8,.3 | SOP8,.25 | TSSOP8,.25 | DIP8,.3 | TSSOP8,.25 |
封装形状 | - | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
封装形式 | - | IN-LINE | SMALL OUTLINE | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | IN-LINE | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
并行/串行 | - | SERIAL | SERIAL | SERIAL | SERIAL | SERIAL |
峰值回流温度(摄氏度) | - | NOT APPLICABLE | 260 | 260 | NOT SPECIFIED | 260 |
电源 | - | 5 V | 5 V | 5 V | 3/5 V | 3/5 V |
认证状态 | - | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
座面最大高度 | - | 4.32 mm | 1.75 mm | 1.1 mm | 5.334 mm | 1.2 mm |
串行总线类型 | - | SPI | SPI | SPI | SPI | SPI |
最大待机电流 | - | 0.000001 A | 0.000001 A | 0.000001 A | 0.000001 A | 0.000001 A |
最大压摆率 | - | 0.005 mA | 0.005 mA | 0.005 mA | 0.005 mA | 0.005 mA |
最大供电电压 (Vsup) | - | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V |
最小供电电压 (Vsup) | - | 4.5 V | 4.5 V | 4.5 V | 2.5 V | 2.5 V |
标称供电电压 (Vsup) | - | 5 V | 5 V | 5 V | 5 V | 5 V |
技术 | - | CMOS | CMOS | CMOS | CMOS | CMOS |
端子面层 | - | Matte Tin (Sn) - annealed | Matte Tin (Sn) | Matte Tin (Sn) | Matte Tin (Sn) - annealed | Matte Tin (Sn) |
端子节距 | - | 2.54 mm | 1.27 mm | 0.65 mm | 2.54 mm | 0.65 mm |
处于峰值回流温度下的最长时间 | - | NOT APPLICABLE | 40 | 40 | NOT SPECIFIED | 40 |
宽度 | - | 7.62 mm | 3.9 mm | 3 mm | 7.62 mm | 3 mm |
最长写入周期时间 (tWC) | - | 5 ms | 5 ms | 5 ms | 5 ms | 5 ms |
写保护 | - | HARDWARE/SOFTWARE | HARDWARE/SOFTWARE | HARDWARE/SOFTWARE | HARDWARE/SOFTWARE | HARDWARE/SOFTWARE |
Base Number Matches | - | 1 | 1 | 1 | 1 | 1 |
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