型号 |
25LC160B-E/MS |
25LC160B-E/MSG |
25LC160B-E/P |
25LC160B-E/PG |
25LC160B-E/SNG |
25LC160B-E/STG |
描述 |
2K X 8 SPI BUS SERIAL EEPROM, PDSO8 |
2K X 8 SPI BUS SERIAL EEPROM, PDSO8 |
2K X 8 SPI BUS SERIAL EEPROM, PDSO8 |
2K X 8 SPI BUS SERIAL EEPROM, PDSO8 |
2K X 8 SPI BUS SERIAL EEPROM, PDSO8 |
2K X 8 SPI BUS SERIAL EEPROM, PDSO8 |
是否无铅 |
不含铅 |
不含铅 |
不含铅 |
不含铅 |
不含铅 |
不含铅 |
是否Rohs认证 |
符合 |
符合 |
符合 |
符合 |
符合 |
符合 |
零件包装代码 |
MSOP |
MSOP |
DIP |
DIP |
SOIC |
SOIC |
包装说明 |
TSSOP, TSSOP8,.19 |
3 X 3 MM, PLASTIC, MSOP-8 |
DIP, DIP8,.3 |
0.300 INCH, ROHS COMPLIANT, PLASTIC, DIP-8 |
SOP, SOP8,.25 |
TSSOP, TSSOP8,.25 |
针数 |
8 |
8 |
8 |
8 |
8 |
8 |
Reach Compliance Code |
compli |
compli |
compli |
compli |
compli |
compli |
ECCN代码 |
EAR99 |
EAR99 |
EAR99 |
EAR99 |
EAR99 |
EAR99 |
最大时钟频率 (fCLK) |
10 MHz |
10 MHz |
10 MHz |
10 MHz |
10 MHz |
10 MHz |
数据保留时间-最小值 |
200 |
200 |
200 |
200 |
200 |
200 |
耐久性 |
1000000 Write/Erase Cycles |
1000000 Write/Erase Cycles |
1000000 Write/Erase Cycles |
1000000 Write/Erase Cycles |
1000000 Write/Erase Cycles |
1000000 Write/Erase Cycles |
JESD-30 代码 |
S-PDSO-G8 |
S-PDSO-G8 |
R-PDIP-T8 |
R-PDIP-T8 |
R-PDSO-G8 |
R-PDSO-G8 |
JESD-609代码 |
e3 |
e3 |
e3 |
e3 |
e3 |
e3 |
长度 |
3 mm |
3 mm |
9.271 mm |
9.271 mm |
4.9 mm |
4.4 mm |
内存密度 |
16384 bi |
16384 bi |
16384 bi |
16384 bi |
16384 bi |
16384 bi |
内存集成电路类型 |
EEPROM |
EEPROM |
EEPROM |
EEPROM |
EEPROM |
EEPROM |
内存宽度 |
8 |
8 |
8 |
8 |
8 |
8 |
功能数量 |
1 |
1 |
1 |
1 |
1 |
1 |
端子数量 |
8 |
8 |
8 |
8 |
8 |
8 |
字数 |
2048 words |
2048 words |
2048 words |
2048 words |
2048 words |
2048 words |
字数代码 |
2000 |
2000 |
2000 |
2000 |
2000 |
2000 |
工作模式 |
SYNCHRONOUS |
SYNCHRONOUS |
SYNCHRONOUS |
SYNCHRONOUS |
SYNCHRONOUS |
SYNCHRONOUS |
最高工作温度 |
125 °C |
125 °C |
125 °C |
125 °C |
125 °C |
125 °C |
最低工作温度 |
-40 °C |
-40 °C |
-40 °C |
-40 °C |
-40 °C |
-40 °C |
组织 |
2KX8 |
2KX8 |
2KX8 |
2KX8 |
2KX8 |
2KX8 |
封装主体材料 |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
封装代码 |
TSSOP |
TSSOP |
DIP |
DIP |
SOP |
TSSOP |
封装等效代码 |
TSSOP8,.19 |
TSSOP8,.19 |
DIP8,.3 |
DIP8,.3 |
SOP8,.25 |
TSSOP8,.25 |
封装形状 |
SQUARE |
SQUARE |
RECTANGULAR |
RECTANGULAR |
RECTANGULAR |
RECTANGULAR |
封装形式 |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
IN-LINE |
IN-LINE |
SMALL OUTLINE |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
并行/串行 |
SERIAL |
SERIAL |
SERIAL |
SERIAL |
SERIAL |
SERIAL |
峰值回流温度(摄氏度) |
260 |
260 |
NOT APPLICABLE |
NOT SPECIFIED |
260 |
260 |
电源 |
3/5 V |
3/5 V |
3/5 V |
3/5 V |
3/5 V |
3/5 V |
认证状态 |
Not Qualified |
Not Qualified |
Not Qualified |
Not Qualified |
Not Qualified |
Not Qualified |
座面最大高度 |
1.1 mm |
1.1 mm |
5.334 mm |
5.334 mm |
1.75 mm |
1.2 mm |
串行总线类型 |
SPI |
SPI |
SPI |
SPI |
SPI |
SPI |
最大待机电流 |
0.000005 A |
0.000005 A |
0.000005 A |
0.000005 A |
0.000005 A |
0.000005 A |
最大压摆率 |
0.006 mA |
0.006 mA |
0.006 mA |
0.006 mA |
0.006 mA |
0.006 mA |
最大供电电压 (Vsup) |
5.5 V |
5.5 V |
5.5 V |
5.5 V |
5.5 V |
5.5 V |
最小供电电压 (Vsup) |
2.5 V |
2.5 V |
2.5 V |
2.5 V |
2.5 V |
2.5 V |
标称供电电压 (Vsup) |
5 V |
5 V |
5 V |
5 V |
5 V |
5 V |
表面贴装 |
YES |
YES |
NO |
NO |
YES |
YES |
技术 |
CMOS |
CMOS |
CMOS |
CMOS |
CMOS |
CMOS |
温度等级 |
AUTOMOTIVE |
AUTOMOTIVE |
AUTOMOTIVE |
AUTOMOTIVE |
AUTOMOTIVE |
AUTOMOTIVE |
端子面层 |
Matte Tin (Sn) |
Matte Tin (Sn) |
Matte Tin (Sn) |
Matte Tin (Sn) |
Matte Tin (Sn) |
Matte Tin (Sn) |
端子形式 |
GULL WING |
GULL WING |
THROUGH-HOLE |
THROUGH-HOLE |
GULL WING |
GULL WING |
端子节距 |
0.65 mm |
0.65 mm |
2.54 mm |
2.54 mm |
1.27 mm |
0.65 mm |
端子位置 |
DUAL |
DUAL |
DUAL |
DUAL |
DUAL |
DUAL |
处于峰值回流温度下的最长时间 |
40 |
40 |
NOT APPLICABLE |
NOT SPECIFIED |
40 |
40 |
宽度 |
3 mm |
3 mm |
7.62 mm |
7.62 mm |
3.9 mm |
3 mm |
最长写入周期时间 (tWC) |
5 ms |
5 ms |
5 ms |
5 ms |
5 ms |
5 ms |
写保护 |
HARDWARE/SOFTWARE |
HARDWARE/SOFTWARE |
HARDWARE/SOFTWARE |
HARDWARE/SOFTWARE |
HARDWARE/SOFTWARE |
HARDWARE/SOFTWARE |
Base Number Matches |
1 |
1 |
1 |
1 |
1 |
1 |
湿度敏感等级 |
1 |
1 |
- |
- |
1 |
1 |