型号 |
24C02A-E/P |
24C02A-E/SM |
24C02A-E/SN |
24C02A-I/P |
24C02A-I/SM |
24C02A-I/SN |
24C02AT-E/SM |
24C02AT-E/SN |
24C02AT-I/SM |
24C02AT-I/SN |
描述 |
256 X 8 I2C/2-WIRE SERIAL EEPROM, PDIP8, PLASTIC, DIP-8 |
256 X 8 I2C/2-WIRE SERIAL EEPROM, PDSO8, 0.207 INCH, PLASTIC, SOIC-8 |
256 X 8 I2C/2-WIRE SERIAL EEPROM, PDSO8, 0.150 INCH, PLASTIC, SOIC-8 |
256 X 8 I2C/2-WIRE SERIAL EEPROM, PDIP8, PLASTIC, DIP-8 |
256 X 8 I2C/2-WIRE SERIAL EEPROM, PDSO8, 0.207 INCH, PLASTIC, SOIC-8 |
256 X 8 I2C/2-WIRE SERIAL EEPROM, PDSO8, 0.150 INCH, PLASTIC, SOIC-8 |
256 X 8 I2C/2-WIRE SERIAL EEPROM, PDSO8, 0.207 INCH, PLASTIC, SOIC-8 |
256 X 8 I2C/2-WIRE SERIAL EEPROM, PDSO8, 0.150 INCH, PLASTIC, SOIC-8 |
256 X 8 I2C/2-WIRE SERIAL EEPROM, PDSO8, 0.207 INCH, PLASTIC, SOIC-8 |
256 X 8 I2C/2-WIRE SERIAL EEPROM, PDSO8, 0.150 INCH, PLASTIC, SOIC-8 |
是否Rohs认证 |
符合 |
不符合 |
符合 |
符合 |
不符合 |
符合 |
不符合 |
不符合 |
不符合 |
符合 |
零件包装代码 |
DIP |
SOIC |
SOIC |
DIP |
SOIC |
SOIC |
SOIC |
SOIC |
SOIC |
SOIC |
包装说明 |
PLASTIC, DIP-8 |
0.207 INCH, PLASTIC, SOIC-8 |
0.150 INCH, PLASTIC, SOIC-8 |
PLASTIC, DIP-8 |
SOP, SOP8,.3 |
0.150 INCH, PLASTIC, SOIC-8 |
0.207 INCH, PLASTIC, SOIC-8 |
0.150 INCH, PLASTIC, SOIC-8 |
SOP, SOP8,.3 |
0.150 INCH, PLASTIC, SOIC-8 |
针数 |
8 |
8 |
8 |
8 |
8 |
8 |
8 |
8 |
8 |
8 |
Reach Compliance Code |
compli |
compli |
compli |
compli |
compli |
compli |
compli |
compli |
compli |
compli |
其他特性 |
10K ERASE/WRITE CYCLES MIN; DATA RETENTION > 40 YEARS |
10K ERASE/WRITE CYCLES MIN; DATA RETENTION > 40 YEARS |
10K ERASE/WRITE CYCLES MIN; DATA RETENTION > 40 YEARS |
DATA RETENTION > 40 YEARS |
DATA RETENTION > 40 YEARS |
DATA RETENTION > 40 YEARS |
10K ERASE/WRITE CYCLES MIN; DATA RETENTION > 40 YEARS |
10K ERASE/WRITE CYCLES MIN; DATA RETENTION > 40 YEARS |
DATA RETENTION > 40 YEARS |
DATA RETENTION > 40 YEARS |
最大时钟频率 (fCLK) |
0.1 MHz |
0.1 MHz |
0.1 MHz |
0.1 MHz |
0.1 MHz |
0.1 MHz |
0.1 MHz |
0.1 MHz |
0.1 MHz |
0.1 MHz |
数据保留时间-最小值 |
200 |
200 |
200 |
200 |
200 |
200 |
200 |
200 |
200 |
200 |
耐久性 |
1000000 Write/Erase Cycles |
1000000 Write/Erase Cycles |
1000000 Write/Erase Cycles |
1000000 Write/Erase Cycles |
1000000 Write/Erase Cycles |
1000000 Write/Erase Cycles |
1000000 Write/Erase Cycles |
1000000 Write/Erase Cycles |
1000000 Write/Erase Cycles |
1000000 Write/Erase Cycles |
I2C控制字节 |
1010DDDR |
1010DDDR |
1010DDDR |
1010DDDR |
1010DDDR |
1010DDDR |
1010DDDR |
1010DDDR |
1010DDDR |
1010DDDR |
JESD-30 代码 |
R-PDIP-T8 |
R-PDSO-G8 |
R-PDSO-G8 |
R-PDIP-T8 |
R-PDSO-G8 |
R-PDSO-G8 |
R-PDSO-G8 |
R-PDSO-G8 |
R-PDSO-G8 |
R-PDSO-G8 |
JESD-609代码 |
e3 |
e0 |
e3 |
e3 |
e0 |
e3 |
e0 |
e0 |
e0 |
e3 |
长度 |
10.033 mm |
5.28 mm |
4.9 mm |
10.033 mm |
5.28 mm |
4.9 mm |
5.28 mm |
4.9 mm |
5.28 mm |
4.9 mm |
内存密度 |
2048 bi |
2048 bi |
2048 bi |
2048 bi |
2048 bi |
2048 bi |
2048 bi |
2048 bi |
2048 bi |
2048 bi |
内存集成电路类型 |
EEPROM |
EEPROM |
EEPROM |
EEPROM |
EEPROM |
EEPROM |
EEPROM |
EEPROM |
EEPROM |
EEPROM |
内存宽度 |
8 |
8 |
8 |
8 |
8 |
8 |
8 |
8 |
8 |
8 |
功能数量 |
1 |
1 |
1 |
1 |
1 |
1 |
1 |
1 |
1 |
1 |
端子数量 |
8 |
8 |
8 |
8 |
8 |
8 |
8 |
8 |
8 |
8 |
字数 |
256 words |
256 words |
256 words |
256 words |
256 words |
256 words |
256 words |
256 words |
256 words |
256 words |
字数代码 |
256 |
256 |
256 |
256 |
256 |
256 |
256 |
256 |
256 |
256 |
工作模式 |
SYNCHRONOUS |
SYNCHRONOUS |
SYNCHRONOUS |
SYNCHRONOUS |
SYNCHRONOUS |
SYNCHRONOUS |
SYNCHRONOUS |
SYNCHRONOUS |
SYNCHRONOUS |
SYNCHRONOUS |
最高工作温度 |
125 °C |
125 °C |
125 °C |
85 °C |
85 °C |
85 °C |
125 °C |
125 °C |
85 °C |
85 °C |
最低工作温度 |
-40 °C |
-40 °C |
-40 °C |
-40 °C |
-40 °C |
-40 °C |
-40 °C |
-40 °C |
-40 °C |
-40 °C |
组织 |
256X8 |
256X8 |
256X8 |
256X8 |
256X8 |
256X8 |
256X8 |
256X8 |
256X8 |
256X8 |
输出特性 |
OPEN-DRAIN |
OPEN-DRAIN |
OPEN-DRAIN |
OPEN-DRAIN |
OPEN-DRAIN |
OPEN-DRAIN |
OPEN-DRAIN |
OPEN-DRAIN |
OPEN-DRAIN |
OPEN-DRAIN |
封装主体材料 |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
封装代码 |
DIP |
SOP |
SOP |
DIP |
SOP |
SOP |
SOP |
SOP |
SOP |
SOP |
封装等效代码 |
DIP8,.3 |
SOP8,.3 |
SOP8,.25 |
DIP8,.3 |
SOP8,.3 |
SOP8,.25 |
SOP8,.3 |
SOP8,.25 |
SOP8,.3 |
SOP8,.25 |
封装形状 |
RECTANGULAR |
RECTANGULAR |
RECTANGULAR |
RECTANGULAR |
RECTANGULAR |
RECTANGULAR |
RECTANGULAR |
RECTANGULAR |
RECTANGULAR |
RECTANGULAR |
封装形式 |
IN-LINE |
SMALL OUTLINE |
SMALL OUTLINE |
IN-LINE |
SMALL OUTLINE |
SMALL OUTLINE |
SMALL OUTLINE |
SMALL OUTLINE |
SMALL OUTLINE |
SMALL OUTLINE |
并行/串行 |
SERIAL |
SERIAL |
SERIAL |
SERIAL |
SERIAL |
SERIAL |
SERIAL |
SERIAL |
SERIAL |
SERIAL |
峰值回流温度(摄氏度) |
NOT SPECIFIED |
NOT SPECIFIED |
260 |
NOT SPECIFIED |
NOT SPECIFIED |
260 |
NOT SPECIFIED |
NOT SPECIFIED |
NOT SPECIFIED |
260 |
电源 |
5 V |
5 V |
5 V |
5 V |
5 V |
5 V |
5 V |
5 V |
5 V |
5 V |
认证状态 |
Not Qualified |
Not Qualified |
Not Qualified |
Not Qualified |
Not Qualified |
Not Qualified |
Not Qualified |
Not Qualified |
Not Qualified |
Not Qualified |
座面最大高度 |
4.064 mm |
2.03 mm |
1.75 mm |
4.064 mm |
2.03 mm |
1.75 mm |
2.03 mm |
1.75 mm |
2.03 mm |
1.75 mm |
串行总线类型 |
I2C |
I2C |
I2C |
I2C |
I2C |
I2C |
I2C |
I2C |
I2C |
I2C |
最大待机电流 |
0.0001 A |
0.0001 A |
0.0001 A |
0.0001 A |
0.0001 A |
0.0001 A |
0.0001 A |
0.0001 A |
0.0001 A |
0.0001 A |
最大压摆率 |
0.00425 mA |
0.00425 mA |
0.00425 mA |
0.00425 mA |
0.00425 mA |
0.00425 mA |
0.00425 mA |
0.00425 mA |
0.00425 mA |
0.00425 mA |
最大供电电压 (Vsup) |
5.5 V |
5.5 V |
5.5 V |
5.5 V |
5.5 V |
5.5 V |
5.5 V |
5.5 V |
5.5 V |
5.5 V |
最小供电电压 (Vsup) |
4.5 V |
4.5 V |
4.5 V |
4.5 V |
4.5 V |
4.5 V |
4.5 V |
4.5 V |
4.5 V |
4.5 V |
标称供电电压 (Vsup) |
5 V |
5 V |
5 V |
5 V |
5 V |
5 V |
5 V |
5 V |
5 V |
5 V |
表面贴装 |
NO |
YES |
YES |
NO |
YES |
YES |
YES |
YES |
YES |
YES |
技术 |
CMOS |
CMOS |
CMOS |
CMOS |
CMOS |
CMOS |
CMOS |
CMOS |
CMOS |
CMOS |
温度等级 |
AUTOMOTIVE |
AUTOMOTIVE |
AUTOMOTIVE |
INDUSTRIAL |
INDUSTRIAL |
INDUSTRIAL |
AUTOMOTIVE |
AUTOMOTIVE |
INDUSTRIAL |
INDUSTRIAL |
端子面层 |
MATTE TIN |
Tin/Lead (Sn/Pb) |
MATTE TIN |
MATTE TIN |
Tin/Lead (Sn/Pb) |
MATTE TIN |
Tin/Lead (Sn/Pb) |
Tin/Lead (Sn/Pb) |
Tin/Lead (Sn/Pb) |
MATTE TIN |
端子形式 |
THROUGH-HOLE |
GULL WING |
GULL WING |
THROUGH-HOLE |
GULL WING |
GULL WING |
GULL WING |
GULL WING |
GULL WING |
GULL WING |
端子节距 |
2.54 mm |
1.27 mm |
1.27 mm |
2.54 mm |
1.27 mm |
1.27 mm |
1.27 mm |
1.27 mm |
1.27 mm |
1.27 mm |
端子位置 |
DUAL |
DUAL |
DUAL |
DUAL |
DUAL |
DUAL |
DUAL |
DUAL |
DUAL |
DUAL |
处于峰值回流温度下的最长时间 |
NOT SPECIFIED |
NOT SPECIFIED |
40 |
NOT SPECIFIED |
NOT SPECIFIED |
40 |
NOT SPECIFIED |
NOT SPECIFIED |
NOT SPECIFIED |
40 |
宽度 |
7.62 mm |
5.207 mm |
3.9 mm |
7.62 mm |
5.207 mm |
3.9 mm |
5.207 mm |
3.9 mm |
5.207 mm |
3.9 mm |
最长写入周期时间 (tWC) |
1 ms |
1 ms |
1 ms |
1 ms |
1 ms |
1 ms |
1 ms |
1 ms |
1 ms |
1 ms |
写保护 |
HARDWARE |
HARDWARE |
HARDWARE |
HARDWARE |
HARDWARE |
HARDWARE |
HARDWARE |
HARDWARE |
HARDWARE |
HARDWARE |
Base Number Matches |
1 |
1 |
1 |
1 |
1 |
1 |
1 |
1 |
1 |
1 |
是否无铅 |
- |
含铅 |
不含铅 |
- |
含铅 |
不含铅 |
含铅 |
含铅 |
含铅 |
不含铅 |