型号 |
24FC128-I/MC |
24FC128-I/MS |
24FC128-I/OT |
24FC128-I/SM |
24FC128-I/ST |
描述 |
16K X 8 I2C/2-WIRE SERIAL EEPROM, PDIP8 |
16K X 8 I2C/2-WIRE SERIAL EEPROM, PDSO8 |
16K X 8 I2C/2-WIRE SERIAL EEPROM, PDIP8 |
16K X 8 I2C/2-WIRE SERIAL EEPROM, PDIP8 |
16K X 8 I2C/2-WIRE SERIAL EEPROM, PDSO8 |
功能数量 |
1 |
1 |
1 |
1 |
1 |
端子数量 |
8 |
8 |
8 |
8 |
8 |
端子形式 |
THROUGH-HOLE |
GULL WING |
THROUGH-HOLE |
GULL WING |
GULL WING |
端子位置 |
DUAL |
DUAL |
DUAL |
DUAL |
DUAL |
温度等级 |
INDUSTRIAL |
INDUSTRIAL |
INDUSTRIAL |
INDUSTRIAL |
INDUSTRIAL |
内存宽度 |
8 |
8 |
8 |
8 |
8 |
组织 |
16K X 8 |
16KX8 |
16K X 8 |
16KX8 |
16KX8 |
是否无铅 |
- |
不含铅 |
- |
不含铅 |
不含铅 |
是否Rohs认证 |
- |
符合 |
- |
符合 |
符合 |
零件包装代码 |
- |
MSOP |
- |
SOIC |
SOIC |
包装说明 |
- |
ROHS COMPLIANT, PLASTIC, MSOP-8 |
- |
ROHS COMPLIANT, PLASTIC, SOIC-8 |
ROHS COMPLIANT, PLASTIC, TSSOP-8 |
针数 |
- |
8 |
- |
8 |
8 |
Reach Compliance Code |
- |
compli |
- |
compli |
compli |
ECCN代码 |
- |
EAR99 |
- |
EAR99 |
EAR99 |
Factory Lead Time |
- |
8 weeks |
- |
5 weeks |
7 weeks |
其他特性 |
- |
1000000 ERASE/WRITE CYCLES, HARDWARE WRITE PROTECT, DATA RETENTION > 200 YEARS |
- |
1000000 ERASE/WRITE CYCLES, HARDWARE WRITE PROTECT, DATA RETENTION > 200 YEARS |
1000000 ERASE/WRITE CYCLES, HARDWARE WRITE PROTECT, DATA RETENTION > 200 YEARS |
最大时钟频率 (fCLK) |
- |
1 MHz |
- |
1 MHz |
1 MHz |
数据保留时间-最小值 |
- |
200 |
- |
200 |
200 |
耐久性 |
- |
1000000 Write/Erase Cycles |
- |
1000000 Write/Erase Cycles |
1000000 Write/Erase Cycles |
I2C控制字节 |
- |
1010DDDR |
- |
1010DDDR |
1010DDDR |
JESD-30 代码 |
- |
S-PDSO-G8 |
- |
R-PDSO-G8 |
R-PDSO-G8 |
JESD-609代码 |
- |
e3 |
- |
e3 |
e3 |
长度 |
- |
3 mm |
- |
5.26 mm |
4.4 mm |
内存密度 |
- |
131072 bi |
- |
131072 bi |
131072 bi |
内存集成电路类型 |
- |
EEPROM |
- |
EEPROM |
EEPROM |
湿度敏感等级 |
- |
1 |
- |
3 |
1 |
字数 |
- |
16384 words |
- |
16384 words |
16384 words |
字数代码 |
- |
16000 |
- |
16000 |
16000 |
工作模式 |
- |
SYNCHRONOUS |
- |
SYNCHRONOUS |
SYNCHRONOUS |
最高工作温度 |
- |
85 °C |
- |
85 °C |
85 °C |
最低工作温度 |
- |
-40 °C |
- |
-40 °C |
-40 °C |
封装主体材料 |
- |
PLASTIC/EPOXY |
- |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
封装代码 |
- |
TSSOP |
- |
SOP |
TSSOP |
封装等效代码 |
- |
TSSOP8,.19 |
- |
SOP8,.3 |
TSSOP8,.25 |
封装形状 |
- |
SQUARE |
- |
RECTANGULAR |
RECTANGULAR |
封装形式 |
- |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
- |
SMALL OUTLINE |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
并行/串行 |
- |
SERIAL |
- |
SERIAL |
SERIAL |
峰值回流温度(摄氏度) |
- |
260 |
- |
260 |
260 |
电源 |
- |
2/5 V |
- |
2/5 V |
2/5 V |
认证状态 |
- |
Not Qualified |
- |
Not Qualified |
Not Qualified |
座面最大高度 |
- |
1.1 mm |
- |
2.03 mm |
1.2 mm |
串行总线类型 |
- |
I2C |
- |
I2C |
I2C |
最大待机电流 |
- |
0.000001 A |
- |
0.000001 A |
0.000001 A |
最大压摆率 |
- |
0.003 mA |
- |
0.003 mA |
0.003 mA |
最大供电电压 (Vsup) |
- |
5.5 V |
- |
5.5 V |
5.5 V |
最小供电电压 (Vsup) |
- |
1.7 V |
- |
1.7 V |
1.7 V |
标称供电电压 (Vsup) |
- |
2.5 V |
- |
2.5 V |
2.5 V |
表面贴装 |
- |
YES |
- |
YES |
YES |
技术 |
- |
CMOS |
- |
CMOS |
CMOS |
端子面层 |
- |
Matte Tin (Sn) |
- |
Matte Tin (Sn) |
Matte Tin (Sn) |
端子节距 |
- |
0.65 mm |
- |
1.27 mm |
0.65 mm |
处于峰值回流温度下的最长时间 |
- |
40 |
- |
40 |
40 |
宽度 |
- |
3 mm |
- |
5.25 mm |
3 mm |
最长写入周期时间 (tWC) |
- |
5 ms |
- |
5 ms |
5 ms |
写保护 |
- |
HARDWARE |
- |
HARDWARE |
HARDWARE |
Base Number Matches |
- |
1 |
- |
1 |
1 |