powerpc 440sp embedded processor
| 参数名称 | 属性值 |
| 是否Rohs认证 | 符合 |
| 厂商名称 | Applied Micro Circuits (MACOM) |
| 零件包装代码 | BGA |
| 包装说明 | BGA, BGA783,28X28,40 |
| 针数 | 783 |
| Reach Compliance Code | compliant |
| ECCN代码 | 3A001.A.3 |
| 地址总线宽度 | 32 |
| 位大小 | 32 |
| 边界扫描 | YES |
| 最大时钟频率 | 666.66 MHz |
| 外部数据总线宽度 | 64 |
| 格式 | FIXED POINT |
| 集成缓存 | YES |
| JESD-30 代码 | S-PBGA-B783 |
| 长度 | 29 mm |
| 低功率模式 | YES |
| 端子数量 | 783 |
| 封装主体材料 | PLASTIC/EPOXY |
| 封装代码 | BGA |
| 封装等效代码 | BGA783,28X28,40 |
| 封装形状 | SQUARE |
| 封装形式 | GRID ARRAY |
| 峰值回流温度（摄氏度） | NOT SPECIFIED |
| 电源 | 1.5,1.8,2.5,3.3 V |
| 认证状态 | Not Qualified |
| 座面最大高度 | 3.27 mm |
| 速度 | 667 MHz |
| 最大压摆率 | 3000 mA |
| 最大供电电压 | 1.575 V |
| 最小供电电压 | 1.425 V |
| 标称供电电压 | 1.5 V |
| 表面贴装 | YES |
| 技术 | CMOS |
| 端子形式 | BALL |
| 端子节距 | 1 mm |
| 端子位置 | BOTTOM |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED |
| 宽度 | 29 mm |
| uPs/uCs/外围集成电路类型 | MICROPROCESSOR, RISC |
| Base Number Matches | 1 |
| PPC440SP-ANC667C | PPC440SP | PPC440SP-ANC533C | PPC440SP-RFC667C | PPC440SP-AFC533C | PPC440SP-RNC667C | PPC440SP-AFC667C | PPC440SP-RNC533C | PPC440SP-RFC533C | |
|---|---|---|---|---|---|---|---|---|---|
| 描述 | powerpc 440sp embedded processor | powerpc 440sp embedded processor | powerpc 440sp embedded processor | powerpc 440sp embedded processor | powerpc 440sp embedded processor | powerpc 440sp embedded processor | powerpc 440sp embedded processor | powerpc 440sp embedded processor | powerpc 440sp embedded processor |
| 是否Rohs认证 | 符合 | - | 符合 | 不符合 | 不符合 | 符合 | 不符合 | 符合 | 不符合 |
| 厂商名称 | Applied Micro Circuits (MACOM) | - | Applied Micro Circuits (MACOM) | Applied Micro Circuits (MACOM) | Applied Micro Circuits (MACOM) | Applied Micro Circuits (MACOM) | Applied Micro Circuits (MACOM) | Applied Micro Circuits (MACOM) | Applied Micro Circuits (MACOM) |
| 零件包装代码 | BGA | - | BGA | BGA | BGA | BGA | BGA | BGA | BGA |
| 包装说明 | BGA, BGA783,28X28,40 | - | BGA, BGA783,28X28,40 | BGA, BGA783,28X28,40 | BGA, BGA783,28X28,40 | BGA, BGA783,28X28,40 | BGA, BGA783,28X28,40 | BGA, BGA783,28X28,40 | BGA, BGA783,28X28,40 |
| 针数 | 783 | - | 783 | 783 | 783 | 783 | 783 | 783 | 783 |
| Reach Compliance Code | compliant | - | compliant | compliant | compliant | compliant | unknown | compliant | compliant |
| ECCN代码 | 3A001.A.3 | - | 3A001.A.3 | 3A001.A.3 | 3A001.A.3 | 3A001.A.3 | 3A001.A.3 | 3A001.A.3 | 3A001.A.3 |
| 地址总线宽度 | 32 | - | 32 | 32 | 32 | 32 | 32 | 32 | 32 |
| 位大小 | 32 | - | 32 | 32 | 32 | 32 | 32 | 32 | 32 |
| 边界扫描 | YES | - | YES | YES | YES | YES | YES | YES | YES |
| 最大时钟频率 | 666.66 MHz | - | 666.66 MHz | 666.66 MHz | 666.66 MHz | 666.66 MHz | 666.66 MHz | 666.66 MHz | 666.66 MHz |
| 外部数据总线宽度 | 64 | - | 64 | 64 | 64 | 64 | 64 | 64 | 64 |
| 格式 | FIXED POINT | - | FIXED POINT | FIXED POINT | FIXED POINT | FIXED POINT | FIXED POINT | FIXED POINT | FIXED POINT |
| 集成缓存 | YES | - | YES | YES | YES | YES | YES | YES | YES |
| JESD-30 代码 | S-PBGA-B783 | - | S-PBGA-B783 | S-PBGA-B783 | S-PBGA-B783 | S-PBGA-B783 | S-PBGA-B783 | S-PBGA-B783 | S-PBGA-B783 |
| 长度 | 29 mm | - | 29 mm | 29 mm | 29 mm | 29 mm | 29 mm | 29 mm | 29 mm |
| 低功率模式 | YES | - | YES | YES | YES | YES | YES | YES | YES |
| 端子数量 | 783 | - | 783 | 783 | 783 | 783 | 783 | 783 | 783 |
| 封装主体材料 | PLASTIC/EPOXY | - | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| 封装代码 | BGA | - | BGA | BGA | BGA | BGA | BGA | BGA | BGA |
| 封装等效代码 | BGA783,28X28,40 | - | BGA783,28X28,40 | BGA783,28X28,40 | BGA783,28X28,40 | BGA783,28X28,40 | BGA783,28X28,40 | BGA783,28X28,40 | BGA783,28X28,40 |
| 封装形状 | SQUARE | - | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE |
| 封装形式 | GRID ARRAY | - | GRID ARRAY | GRID ARRAY | GRID ARRAY | GRID ARRAY | GRID ARRAY | GRID ARRAY | GRID ARRAY |
| 峰值回流温度（摄氏度） | NOT SPECIFIED | - | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
| 电源 | 1.5,1.8,2.5,3.3 V | - | 1.5,1.8,2.5,3.3 V | 1.5,1.8,2.5,3.3 V | 1.5,1.8,2.5,3.3 V | 1.5,1.8,2.5,3.3 V | 1.5,1.8,2.5,3.3 V | 1.5,1.8,2.5,3.3 V | 1.5,1.8,2.5,3.3 V |
| 认证状态 | Not Qualified | - | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 座面最大高度 | 3.27 mm | - | 3.27 mm | 3.27 mm | 3.27 mm | 3.27 mm | 3.27 mm | 3.27 mm | 3.27 mm |
| 速度 | 667 MHz | - | 533 MHz | 667 MHz | 533 MHz | 667 MHz | 667 MHz | 533 MHz | 533 MHz |
| 最大压摆率 | 3000 mA | - | 3000 mA | 3000 mA | 3000 mA | 3000 mA | 3000 mA | 3000 mA | 3000 mA |
| 最大供电电压 | 1.575 V | - | 1.6 V | 1.575 V | 1.6 V | 1.575 V | 1.575 V | 1.6 V | 1.6 V |
| 最小供电电压 | 1.425 V | - | 1.4 V | 1.425 V | 1.4 V | 1.425 V | 1.425 V | 1.4 V | 1.4 V |
| 标称供电电压 | 1.5 V | - | 1.5 V | 1.5 V | 1.5 V | 1.5 V | 1.5 V | 1.5 V | 1.5 V |
| 表面贴装 | YES | - | YES | YES | YES | YES | YES | YES | YES |
| 技术 | CMOS | - | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
| 端子形式 | BALL | - | BALL | BALL | BALL | BALL | BALL | BALL | BALL |
| 端子节距 | 1 mm | - | 1 mm | 1 mm | 1 mm | 1 mm | 1 mm | 1 mm | 1 mm |
| 端子位置 | BOTTOM | - | BOTTOM | BOTTOM | BOTTOM | BOTTOM | BOTTOM | BOTTOM | BOTTOM |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED | - | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
| 宽度 | 29 mm | - | 29 mm | 29 mm | 29 mm | 29 mm | 29 mm | 29 mm | 29 mm |
| uPs/uCs/外围集成电路类型 | MICROPROCESSOR, RISC | - | MICROPROCESSOR, RISC | MICROPROCESSOR, RISC | MICROPROCESSOR, RISC | MICROPROCESSOR, RISC | MICROPROCESSOR, RISC | MICROPROCESSOR, RISC | MICROPROCESSOR, RISC |
| Base Number Matches | 1 | - | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
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