HI-SINCERITY
MICROELECTRONICS CORP.
Spec. No. : HE9305-B
Issued Date : 1994.11.09
Revised Date : 2000.11.01
Page No. : 1/3
HI44H11
NPN EPITAXIAL PLANAR TRANSISTOR
Description
The HI44H11 is designed for various specific and general purpose
applications, such as: output and driver stages of amplifiers opera-
ting at frequencies from DC to greater than 1MHz; series, shunt and
switching regulators; low and high frequency inverters/converters;
and many others.
Absolute Maximum Ratings
(Ta=25°C)
•
Maximum Temperatures
Storage Temperature ............................................................................................ -55 ~ +150
°C
Junction Temperature .................................................................................................... +150
°C
•
Maximum Power Dissipation
Total Power Dissipation (Tc=25°C) .................................................................................... 20 W
•
Maximum Voltages and Currents
BVCEO Collector to Base Voltage ...................................................................................... 80 V
BVCES Collector to Emitter Voltage ................................................................................... 80 V
BVEBO Emitter to Base Voltage ........................................................................................... 5 V
IC Collector Current ............................................................................................................ 10 A
IB Base Current .................................................................................................................... 5 A
Characteristics
(Ta=25°C)
Symbol
BVCEO
BVCES
BVEBO
ICBO
IEBO
*VCE(sat)
*VBE(sat)
*hFE1
*hFE2
Cob
fT
Min.
80
80
5
-
-
-
-
60
40
-
-
Typ.
-
-
-
-
-
-
-
-
-
130
50
Max.
-
-
-
10
50
1
1.5
-
-
-
-
Unit
V
V
V
uA
uA
V
V
Test Conditions
IC=30mA, IB=0
IC=1mA, IB=0
IE=1mA, IC=0
VCB=80V, VEB=0
VEB=5V, IC=0
IC=8A, IB=0.4A
IC=8A, IB=0.8A
VCE=1V, IC=2A
VCE=1V, IC=4A
VCB=10V, f=1MHz
VCE=10V, IC=500mA, f=20MHz
*Pulse Test : Pulse Width
≤380us,
Duty Cycle≤2%
pF
MHz
HSMC Product Specification
HI-SINCERITY
MICROELECTRONICS CORP.
Characteristics Curve
Current Gain & Collector Current
1000
1000
Spec. No. : HE9305-B
Issued Date : 1994.11.09
Revised Date : 2000.11.01
Page No. : 2/3
Saturation Voltage & Collector Current
100
V
CE
=1V
Saturation Voltage (mV)
hFE
100
V
CE(sat)
@ I
C
=20I
B
10
100
10
1000
10000
10
100
1000
10000
Collector Current (mA)
Collector Current (mA)
Saturation Voltage & Collector Current
10000
1000
Capacitance & Reverse-Biased Voltage
Saturation Voltage (mV)
1000
V
BE(sat)
@ I
C
=10I
B
Capacitance (Pf)
100
Cob
100
100
10
1000
10000
1
10
100
Collector Current (mA)
Reverse Biased Voltage (V)
HSMC Product Specification
HI-SINCERITY
MICROELECTRONICS CORP.
TO-251 Dimension
Marking :
HSMC Logo
Spec. No. : HE9305-B
Issued Date : 1994.11.09
Revised Date : 2000.11.01
Page No. : 3/3
A
B
C
D
Product Series
Rank
Part Number
Date Code
Ink Mark
F
3
I
E
K
2
1
G
Style : Pin 1.Base 2.Collector 3.Emitter
H
J
3-Lead TO-251 Plastic Package
HSMC Package Code : I
*:Typical
DIM
A
B
C
D
E
F
Inches
Min.
Max.
0.0177 0.0217
0.0354 0.0591
0.0177 0.0236
0.0866 0.0945
0.2520 0.2677
0.2677 0.2835
Millimeters
Min.
Max.
0.45
0.55
0.90
1.50
0.45
0.60
2.20
2.40
6.40
6.80
6.80
7.20
DIM
G
H
I
J
K
Inches
Min.
Max.
0.2559
-
-
*0.1811
-
0.0354
-
0.0315
0.2047 0.2165
Millimeters
Min.
Max.
6.50
-
-
*4.60
-
0.90
-
0.80
5.20
5.50
Notes :
1.Dimension and tolerance based on our Spec. dated May. 24,1995.
2.Controlling dimension : millimeters.
3.Maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material.
4.If there is any question with packing specification or packing method, please contact your local HSMC sales office.
Material :
•
Lead : 42 Alloy ; solder plating
•
Mold Compound : Epoxy resin family, flammability solid burning class:UL94V-0
Important Notice:
•
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of HSMC.
•
HSMC reserves the right to make changes to its products without notice.
•
HSMC semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems.
•
HSMC assumes no liability for any consequence of customer product design, infringement of patents, or application assistance.
Head Office And Factory :
•
Head Office
(Hi-Sincerity Microelectronics Corp.) : 10F.,No. 61, Sec. 2, Chung-Shan N. Rd. Taipei Taiwan R.O.C.
Tel : 886-2-25212056 Fax : 886-2-25632712, 25368454
•
Factory 1 :
No. 38, Kuang Fu S. Rd., Fu-Kou Hsin-Chu Industrial Park Hsin-Chu Taiwan. R.O.C
Tel : 886-3-5983621~5 Fax : 886-3-5982931
•
Factory 2 :
No. 17-1, Ta-Tung Rd., Fu-Kou Hsin-Chu Industrial Park Hsin-Chu Taiwan. R.O.C
Tel : 886-3-5977061 Fax : 886-3-5979220
HSMC Product Specification
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