The HSD1616A is designed for audio frequency power amplifier and medium
speed switching applications.
Absolute Maximum Ratings
TO-92
•
Maximum Temperatures
Storage Temperature ........................................................................................................................... -55 ~ +150
°C
Junction Temperature ..................................................................................................................... 150
°C
Maximum
•
Maximum Power Dissipation
Total Power Dissipation (Ta=25°C) ............................................................................................................... 750 mW
•
Maximum Voltages and Currents (Ta=25°C)
VCBO Collector to Base Voltage ...................................................................................................................... 120 V
VCEO Collector to Emitter Voltage ..................................................................................................................... 60 V
VEBO Emitter to Base Voltage ............................................................................................................................. 6 V
IC Collector Current (DC) ...................................................................................................................................... 1 A
IC Collector Current *(Pulse) ................................................................................................................................. 2 A
Thermal Characteristic
Characteristic
Thermal Resistance, junction to ambient
Symbol
Rθja
Max
167
Unit
o
C/W
Electrical Characteristics
(Ta=25°C)
Symbol
BVCBO
BVCEO
BVEBO
ICBO
IEBO
*VCE(sat)
*VBE(sat)
VBE(on)
*hFE1
*hFE2
fT
Cob
ton
ts
tf
Min.
120
60
6
-
-
-
-
600
135
81
100
-
-
-
-
Typ.
-
-
-
-
-
150
0.9
-
-
-
160
-
0.07
0.95
0.07
Max.
-
-
-
100
100
300
1.2
700
600
-
-
19
-
-
-
Unit
V
V
V
nA
nA
mV
V
mV
Test Conditions
IC=100uA
IC=1mA
IE=10uA
VCB=60V
VEB=6V
IC=1A, IB=50mA
IC=1A, IB=50mA
VCE=2V, IC=50mA
VCE=2V, IC=100mA
VCE=2V, IC=1A
VCE=2V, IC=100mA
IE=0, VCB=10V, f=1MHz
VCE=10V, IC=100mA
IB1=-IB2=10mA
VBE(off)=-2~-3V
*Pulse Test: Pulse Width
≤380us,
Duty Cycle≤2%
MHz
pF
uS
uS
uS
Classification of hFE1
Rank
Range
Y
135-270
G
200-400
L
300-600
HSD1616A
HSMC Product Specification
HI-SINCERITY
MICROELECTRONICS CORP.
Characteristics Curve
Current Gain & Collector Current
1000
Spec. No. : HE6534
Issued Date : 1998.06.01
Revised Date : 2003.05.03
Page No. : 2/5
Saturation Voltage & Collector Current
1000
125 C
o
Saturation Voltage (mV)
100
125 C
o
hFE
100
25 C
o
75 C
o
25 C
10
o
75 C
o
hFE @ V
CE
=2V
V
CE(sat)
@ I
C
=20I
B
10
1
10
100
1000
10000
1
1
10
100
1000
10000
Collector Current-I
C
(mA)
Collector Current-I
C
(mA)
Saturation Voltage & Collector Current
1000
25 C
o
ON Voltage & Collector Current
1000
25 C
o
Saturation Voltage (mV)
ON Voltage (mV)
75 C
125 C
o
o
75 C
125 C
o
o
V
BE(sat)
@ I
C
=20I
B
V
BE(ON)
@ V
CE
=2V
100
1
10
100
1000
10000
100
1
10
100
1000
10000
Collector Current-I
C
(mA)
Collector Current-I
C
(mA)
Capacitance & Reverse-Biased Voltage
100
1000
Cutoff Frequency & Collector Current
Cutoff Frequency (MHz)
..
.
Capacitance (Pf)
Cob
fT @ V
CE
=2V
100
10
0.1
1
10
100
10
1
10
100
1000
Reverse Biased Voltage (V)
Collector Current (mA)
HSD1616A
HSMC Product Specification
HI-SINCERITY
MICROELECTRONICS CORP.
Spec. No. : HE6534
Issued Date : 1998.06.01
Revised Date : 2003.05.03
Page No. : 3/5
Safe Operating Area
10000
P
T
=1ms
Power Derating
800
700
Collector Current (mA)
1000
P
T
=1s
Power Dissipation-PD (mW)
P
T
=100ms
600
500
400
300
200
100
100
10
1
1
10
100
0
0
50
100
o
150
200
Forward Voltage (V)
Ambient Temperature-Ta ( C)
HSD1616A
HSMC Product Specification
HI-SINCERITY
MICROELECTRONICS CORP.
TO-92 Dimension
A
B
1
2
3
Spec. No. : HE6534
Issued Date : 1998.06.01
Revised Date : 2003.05.03
Page No. : 4/5
α
2
Marking:
Pb Free Mark
Pb-Free: "
.
"
(Note)
Normal: None
H
SD
1 6 1 6 A
Control Code
α
3
Date Code
Note: Green label is used for pb-free packing
C
D
Pin Style: 1.Emitter 2.Collector 3.Base
Material:
•
Lead solder plating: Sn60/Pb40 (Normal),
Sn/3.0Ag/0.5Cu or Pure-Tin (Pb-free)
•
Mold Compound: Epoxy resin family,
flammability solid burning class: UL94V-0
DIM
A
B
C
D
E
F
G
H
I
α1
α2
α3
Min.
4.33
4.33
12.70
0.36
-
3.36
0.36
-
-
-
-
-
Max.
4.83
4.83
-
0.56
*1.27
3.76
0.56
*2.54
*1.27
*5°
*2°
*2°
H
I
E
F
G
*: Typical, Unit: mm
α
1
3-Lead TO-92 Plastic Package
HSMC Package Code: A
TO-92 Taping Dimension
DIM
A
D
D1
D2
F1,F2
H
H1
H2
H2A
H3
H4
L
L1
P
P1
P2
T
T1
T2
W
W1
Min.
4.33
3.80
0.36
4.33
2.40
15.50
8.50
-
-
-
-
-
2.50
12.50
5.95
50.30
-
-
0.36
17.50
5.00
Max.
4.83
4.20
0.53
4.83
2.90
16.50
9.50
1
1
27
21
11
-
12.90
6.75
51.30
0.55
1.42
0.68
19.00
7.00
Unit: mm
H2
H2
H2A H2A
D2
A
H3
H4 H
L
L1
H1
F1F2
T2
T
T1
P1
P
P2
D1
D
W1
W
Important Notice:
•
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of HSMC.
•
HSMC reserves the right to make changes to its products without notice.
•
HSMC semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems.
•
HSMC assumes no liability for any consequence of customer product design, infringement of patents, or application assistance.
Head Office And Factory:
•
Head Office
(Hi-Sincerity Microelectronics Corp.): 10F.,No. 61, Sec. 2, Chung-Shan N. Rd. Taipei Taiwan R.O.C.
Tel: 886-2-25212056 Fax: 886-2-25632712, 25368454
•
Factory 1:
No. 38, Kuang Fu S. Rd., Fu-Kou Hsin-Chu Industrial Park Hsin-Chu Taiwan. R.O.C
嵌入式系统
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