HI-SINCERITY
MICROELECTRONICS CORP.
Spec. No. : HR200201
Issued Date : 1996.03.14
Revised Date : 2002.08.13
Page No. : 1/2
HSC2625
NPN EPITAXIAL PLANAR TRANSISTOR
Description
The HSC2625 is designed for triple diffused planer type high voltage,
high speed switching applications.
Absolute Maximum Ratings
(Ta=25°C)
TO-3P
•
Maximum Temperatures
Storage Temperature ........................................................................................... -55 ~ +150
°C
Junction Temperature.................................................................................... +150
°C
Maximum
•
Maximum Power Dissipation
Total Power Dissipation (Tc=25°C) .................................................................................... 80 W
•
Maximum Voltages and Currents
VCBO Collector to Base Voltage ....................................................................................... 450 V
VCEO Collector to Emitter Voltage.................................................................................... 400 V
VEBO Emitter to Base Voltage.............................................................................................. 7 V
IC Collector Current ............................................................................................................ 10 A
IB Base Current ..................................................................................................................... 3 A
Characteristics
(Ta=25°C)
Symbol
BVCBO
BVCEO
BVEBO
ICBO
IEBO
*VCE(sat)
*VBE(sat)
*hFE1
*hFE2
Min.
450
400
7
-
-
-
-
10
6
Typ.
-
-
-
-
-
-
-
-
-
Max.
-
-
-
1
100
1.2
1.5
30
-
Unit
V
V
mA
uA
V
V
Test Conditions
IC=1mA
IC=10mA
IE=100uA
VCB=450V
VEB=7V
IC=4A, IB=800mA
IC=4A, IB=800mA
IC=0.5A, VCE=5V
IC=4A, VCE=5V
*Pulse Test: Pulse Width
≤380us,
Duty Cycle≤2%
HSC2625
HSMC Product Specification
HI-SINCERITY
MICROELECTRONICS CORP.
TO-3P Dimension
A
B
C
D
a2
G H I
H
a1
1
2
3
J
L
N
O
a1
a1
P
a1 r3
a1
U
M
T
a3
Spec. No. : HR200201
Issued Date : 1996.03.14
Revised Date : 2002.08.13
Page No. : 2/2
Marking:
R
S
r1
r2
E
F
H
2625
Date Code
SC
Control Code
Style: Pin 1.Base 2.Collector 3.Emitter
K
3-Lead TO-3P Plastic Package,
HSMC Package Code: R
Inches
Min.
0.0315
0.2028
0.2028
0.7283
0.1811
0.0571
0.0472
-
-
-
φ3.10
-
-
Max.
0.0472
0.2264
0.2264
0.7441
0.1969
0.0650
0.0630
*3
o
*2
o
*1
o
φ3.30
*φ1.60
*R0.50
*: Typical
Millimeters
Min.
Max.
0.80
1.20
5.15
5.75
5.15
5.75
18.50
18.90
4.60
5.00
1.45
1.65
1.20
1.60
-
*3
o
-
*2
o
-
*1
o
φ3.10
φ3.30
-
*φ1.60
-
*R0.50
DIM
A
B
C
D
E
F
G
H
I
J
K
L
M
Inches
Min.
0.6063
0.5276
0.3701
-
0.1417
0.5394
0.4945
0.7756
0.9134
0.1299
0.0709
0.1102
0.6378
Max.
0.6220
0.5433
0.3858
*0.3150
0.1575
0.5551
0.5102
0.7913
0.9291
0.1457
0.0866
0.1260
0.6614
Millimeters
Min.
Max.
15.40
15.80
13.40
13.80
9.40
9.80
-
*8.00
3.60
4.00
13.70
14.10
12.56
12.96
19.70
20.10
23.20
23.60
3.30
3.70
1.80
2.20
2.80
3.20
16.20
16.80
DIM
N
O
P
Q
R
S
T
a1
a2
a3
r1
r2
r3
Notes:
1.Dimension and tolerance based on our Spec. dated Apr. 25,1996.
2.Controlling dimension: millimeters.
3.Maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material.
4.If there is any question with packing specification or packing method, please contact your local HSMC sales office.
Material:
•
Lead: 42 Alloy; solder plating
•
Mold Compound: Epoxy resin family, flammability solid burning class: UL94V-0
Important Notice:
•
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of HSMC.
•
HSMC reserves the right to make changes to its products without notice.
•
HSMC semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems.
•
HSMC assumes no liability for any consequence of customer product design, infringement of patents, or application assistance.
•
Head Office
(Hi-Sincerity Microelectronics Corp.): 10F.,No. 61, Sec. 2, Chung-Shan N. Rd. Taipei Taiwan R.O.C.
Tel: 886-2-25212056 Fax: 886-2-25632712, 25368454
•
Factory 1:
No. 38, Kuang Fu S. Rd., Fu-Kou Hsin-Chu Industrial Park Hsin-Chu Taiwan. R.O.C
Tel: 886-3-5983621~5 Fax: 886-3-5982931
HSC2625
HSMC Product Specification
Head Office And Factory:
FPGA/CPLD
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