HI-SINCERITY
MICROELECTRONICS CORP.
HUN2111 / HUN2112 / HUN2113 / HUN2114 / HUN2115
HUN2116 / HUN2130 / HUN2131 / HUN2132 / HUN2133
HUN2134 / HUN2136 / HUN2137 / HUN2140
PNP Silicon Surface Mount Transistors with Monolithic Bias Resistor Network
Spec. No. : HN200301
Issued Date : 2003.03.01
Revised Date : 2005.01.14
Page No. : 1/5
Description
This new series of digital transistors is designed to replace a single device and its external resistor
bias network. The BRT (Bias Resistor Transistor) contains a single transistor with a monolithic
bias network consisting of two resistors; a series base resistor and a base-emitter resistor. The
BRT eliminates these individual components by integrating them into a single device. The use of a
BRT can reduce both system cost and board space. The device is housed in the SOT-23 package
which is designed for low power surface mount applications.
SOT-23
Symbol:
Pin 1
Base
(Input)
R1
Pin 3
Collector
(Output)
Pin 2
Emitter
(Ground)
•
Simplifies Circuit Design
R2
•
Reduces Board Space
•
Reduces Component Count
•
Moisture Sensitivity Level: 1
•
ESD Rating: Human Body Model: Class1, Machine Model: Class B
•
The SOT-23 package can be soldered using wave or reflow.
The modified gull-winged leads absorb thermal stress during soldering eliminating the possibility of damage to the die.
•
Available in 8mm embossed tape and reel. Use the device number to order the 7 inch / 3,000 unit reel.
Maximum Ratings
(T
A
=25
o
C unless otherwise noted)
Rating
Collector-Base Voltage
Collector-Emitter Voltage
Collector Curretn
Symbol
V
CBO
V
CEO
I
C
Value
-50
-50
-100
Unit
Vdc
Vdc
mAdc
Thermal Characteristics
Rating
Total Power Dissipation @ T
A
=25°C
Derate above 25°C
Thermal Resistance-Junction-to-Ambient
Thermal Resistance-Junction-to-Lead
Operating and Storage Temperature Range
Note1: FR-4 @ Minimum Pad, Note2: FR-4 @ 1.0X1.0 inch Pad
Symbol
P
D
R
θJA
R
θJL
T
J
, T
stg
Value
Note1
246
1.5
508
174
-65 to +150
Note2
400
2.0
311
208
Unit
mW
mW/°C
°C/W
°C/W
°C
Device Marking and Resistor Values
Device
HUN2111
HUN2112
HUN2113
HUN2114
HUN2115
HUN2116
HUN2130
HUN2131
HUN2132
HUN2133
HUN2134
HUN2136
HUN2137
HUN2140
HUN21XX Series
Package
SOT-23
SOT-23
SOT-23
SOT-23
SOT-23
SOT-23
SOT-23
SOT-23
SOT-23
SOT-23
SOT-23
SOT-23
SOT-23
SOT-23
Marking
A6A
A6B
A6C
A6D
A6E
A6F
A6G
A6H
A6J
A6K
A6L
A6N
A6P
A6T
R1(K)
10
22
47
10
10
4.7
1
2.2
4.7
4.7
22
100
47
47
R2(K)
10
22
47
47
∞
∞
1
2.2
4.7
47
47
100
22
∞
Shipping
3000/Tape & Reel
3000/Tape & Reel
3000/Tape & Reel
3000/Tape & Reel
3000/Tape & Reel
3000/Tape & Reel
3000/Tape & Reel
3000/Tape & Reel
3000/Tape & Reel
3000/Tape & Reel
3000/Tape & Reel
3000/Tape & Reel
3000/Tape & Reel
3000/Tape & Reel
HSMC Product Specification
HI-SINCERITY
MICROELECTRONICS CORP.
Electrical Characteristics
(T
A
=25°C unless otherwise noted)
Characteristic
Off Characteristics
Collector-Base Cutoff Current (V
CB
=-50V, I
E
=0)
Collector-Emitter Cutoff Current (V
CE
=-50V, I
B
=0)
HUN2111
HUN2112
HUN2113
HUN2114
HUN2115
HUN2116
HUN2130
Emitter-Base Cutoff Current
(V
EB
=-6V, I
C
=0)
HUN2131
HUN2132
HUN2133
HUN2134
HUN2136
HUN2137
HUN2140
Collector-Base Breakdown Voltage (I
C
=-10uA, I
E
=0)
Collector-Emitter Breakdown Voltage (I
C
=-2mA, I
B
=0)
*On Characteristics
HUN2111
HUN2112
HUN2113
HUN2114
HUN2115
HUN2116
HUN2130
HUN2131
HUN2132
HUN2133
HUN2134
HUN2136
HUN2137
HUN2140
35
60
80
80
160
160
3
8
15
80
80
80
80
120
I
CBO
I
CEO
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-50
-50
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
Symbol
Min.
Spec. No. : HN200301
Issued Date : 2003.03.01
Revised Date : 2005.01.14
Page No. : 2/5
Typ.
Max.
-100
-500
-0.5
-0.2
-0.1
-0.2
-0.9
-1.9
-4.3
-2.3
-1.5
-0.18
-0.13
-0.05
-0.13
-0.20
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
Unit
nAdc
nAdc
I
EBO
mAdc
V
(BR)CBO
*V
(BR)CEO
Vdc
Vdc
DC Current Gain
(V
CE
=-10V, I
C
=-5mA)
hFE
60
100
140
140
250
250
5
15
27
140
130
150
140
250
Collector-Emitter Saturation Voltage
(I
C
=-10mA, I
B
=-0.3mA) HUN2111/HUN2112/HUN2113/HUN2114
HUN2115/HUN2130/HUN2136/HUN2137
(I
C
=-10mA, I
B
=-5mA) HUN2131
(I
C
=-10mA, I
B
=-1mA) HUN2116/HUN2132/HUN2134/HUN2140
HUN2111
HUN2112
HUN2114
HUN2115
Output Voltage (on)
HUN2116
HUN2130
(V
CC
=-5V, V
B
=-2.5V, R
L
=1kΩ)
HUN2131
HUN2132
HUN2133
HUN2134
HUN2113
(V
CC
=-5V, V
B
=-3.5V, R
L
=1kΩ)
HUN2140
HUN2136
(V
CC
=-5V, V
B
=-5.5V, R
L
=1kΩ)
HUN2137
(V
CC
=-5V, V
B
=-4.0V, R
L
=1kΩ)
V
CE(sat)
-
-
-0.25
Vdc
V
OL
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-0.2
-0.2
-0.2
-0.2
-0.2
-0.2
-0.2
-0.2
-0.2
-0.2
-0.2
-0.2
-0.2
-0.2
Vdc
*Pulse Test: Pulse Width
≤300us,
Duty Cycle≤2%
HUN21XX Series
HSMC Product Specification
HI-SINCERITY
MICROELECTRONICS CORP.
Electrical Characteristics
(T
A
=25°C unless otherwise noted)
Characteristic
*On Characteristics
Output Voltage (off) (V
CC
=-5V, V
B
=-0.5V, R
L
=1kΩ)
HUN2115
HUN2116
HUN2131
(V
CC
=-5V, V
B
=-0.25V, R
L
=1kΩ)
HUN2132
HUN2140
HUN2130
(V
CC
=-5V, V
B
=-0.05V, R
L
=1kΩ)
HUN2111
HUN2112
HUN2113
HUN2114
HUN2115
HUN2116
HUN2130
Input Resistor
HUN2131
HUN2132
HUN2133
HUN2134
HUN2136
HUN2137
HUN2140
Resistor Ratio HUN2111/HUN2112/HUN2113/HUN2136
HUN2114
HUN2115/HUN2116/HUN2140
HUN2130/HUN2131/HUN2132
HUN2133
HUN2134
HUN2137
Symbol
Min.
Spec. No. : HN200301
Issued Date : 2003.03.01
Revised Date : 2005.01.14
Page No. : 3/5
Typ.
Max.
Unit
V
OH
-4.9
-
-
Vdc
R
1
R
1
/R
2
7
15.4
32.9
7
7
3.3
0.7
1.5
3.3
3.3
15.4
70
32.9
32.9
0.8
0.17
-
0.8
0.055
0.38
1.7
10
22
47
10
10
4.7
1
2.2
4.7
4.7
22
100
47
47
1
0.21
-
1
0.1
0.47
2.1
13
28.6
61.1
13
13
6.1
1.3
2.9
6.1
6.1
28.6
130
61.1
61.1
1.2
0.25
-
1.2
0.185
0.56
2.6
kΩ
*Pulse Test: Pulse Width
≤300us,
Duty Cycle≤2%
HUN21XX Series
HSMC Product Specification
HI-SINCERITY
MICROELECTRONICS CORP.
SOT-23 Dimension
Marking:
A
L
Series Code
(See Page 1)
Spec. No. : HN200301
Issued Date : 2003.03.01
Revised Date : 2005.01.14
Page No. : 4/5
A 6
3
Pb Free Mark
B S
1
2
Pb-Free: " "
(Note)
Normal: None
V
G
Note: Pb-free product can distinguish by the green
label or the extra description on the right
side of the label.
Pin Style: 1.Base 2.Emitter 3.Collector
Material:
•
Lead solder plating: Sn60/Pb40 (Normal),
Sn/3.0Ag/0.5Cu or Pure-Tin (Pb-free)
•
Mold Compound: Epoxy resin family,
flammability solid burning class: UL94V-0
DIM
A
B
C
D
G
H
J
K
L
S
V
Min.
2.80
1.20
0.89
0.30
1.70
0.013
0.085
0.32
0.85
2.10
0.25
Max.
3.04
1.60
1.30
0.50
2.30
0.10
0.177
0.67
1.15
2.75
0.65
*: Typical, Unit: mm
C
D
H
3-Lead SOT-23 Plastic
Surface Mounted Package
HSMC Package Code: N
K
J
Important Notice:
•
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of HSMC.
•
HSMC reserves the right to make changes to its products without notice.
•
HSMC semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems.
•
HSMC assumes no liability for any consequence of customer product design, infringement of patents, or application assistance.
Head Office And Factory:
•
Head Office
(Hi-Sincerity Microelectronics Corp.): 10F.,No. 61, Sec. 2, Chung-Shan N. Rd. Taipei Taiwan R.O.C.
Tel: 886-2-25212056 Fax: 886-2-25632712, 25368454
•
Factory 1:
No. 38, Kuang Fu S. Rd., Fu-Kou Hsin-Chu Industrial Park Hsin-Chu Taiwan. R.O.C
Tel: 886-3-5983621~5 Fax: 886-3-5982931
HUN21XX Series
HSMC Product Specification
HI-SINCERITY
MICROELECTRONICS CORP.
Soldering Methods for HSMC’s Products
1. Storage environment: Temperature=10
o
C~35
o
C Humidity=65%±15%
2. Reflow soldering of surface-mount devices
Figure 1: Temperature profile
t
P
T
P
Ramp-up
T
L
Ts
max
Temperature
t
L
Spec. No. : HN200301
Issued Date : 2003.03.01
Revised Date : 2005.01.14
Page No. : 5/5
Critical Zone
T
L
to T
P
Ts
min
t
S
Preheat
Ramp-down
25
t 25
o
C to Peak
Time
Profile Feature
Average ramp-up rate (T
L
to T
P
)
Preheat
- Temperature Min (Ts
min
)
- Temperature Max (Ts
max
)
- Time (min to max) (ts)
Tsmax to T
L
- Ramp-up Rate
Time maintained above:
- Temperature (T
L
)
- Time (t
L
)
Peak Temperature (T
P
)
Time within 5
o
C of actual Peak
Temperature (t
P
)
Ramp-down Rate
Time 25
o
C to Peak Temperature
3. Flow (wave) soldering (solder dipping)
Products
Pb devices.
Pb-Free devices.
Sn-Pb Eutectic Assembly
<3
o
C/sec
100
o
C
150
o
C
60~120 sec
<3
o
C/sec
183
o
C
60~150 sec
240
o
C +0/-5
o
C
10~30 sec
<6
o
C/sec
<6 minutes
Pb-Free Assembly
<3
o
C/sec
150
o
C
200
o
C
60~180 sec
<3
o
C/sec
217
o
C
60~150 sec
260
o
C +0/-5
o
C
20~40 sec
<6
o
C/sec
<8 minutes
Peak temperature
245
o
C
±5
o
C
260
o
C +0/-5
o
C
Dipping time
5sec
±1sec
5sec
±1sec
HUN21XX Series
HSMC Product Specification
嵌入式系统
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