HI-SINCERITY
MICROELECTRONICS CORP.
Spec. No. : HE9101-B
Issued Date : 1996.03.27
Revised Date : 2000.05.01
Page No. : 1/2
H1N400X Series
General Purpose Rectifiers
Features
•
High Reliability
•
Low Cost
•
Low Leakage
•
Low forward voltage drop
•
High Current Capability
•
Glass Passivated Junction
Maximum Ratings & Electrical Characteristics
Ratings at 25°C ambient temperature unless otherwise specified. Single phase, half wave, 60
Hz, resistive or inductive load. For capacitive load. Drate current by 20%.
Ratings
Maximum recurrent peak reverse voltage
Maximum RMS voltage
Maximum DC blocking voltage
Maximum average forward recitified current
.375”(9.5mm) lead length (Ta=75°C)
Peak forward surge current 8.3ms single half
sine-wave superimposed on rated load
Typical thermal resistance
(Note2)
Typical junction capacitance
(Note1)
Operating & storage temperature Tj
Maximum instantaceous forward voltage at
1.0A DC
Maximum DC reverse current at rated DC
blocking voltage @Ta=25°C
@Ta=100°C
Maximum full load reverse current average
full cycle .375”(9.5mm) lead at Tj=75°C
Note 1 : Measured at 1MHz and applied reverse voltage of 4.0 volts.
Note 2 : Thermal resistance from junction to ambient 9.5mm lead length.
Symbol
V
RRM
V
RMS
V
DC
I
O
I
FSM
R
θJA
C
J
T
stg
V
F
I
R
4001
50
35
50
4002
100
70
100
1
30
50
30
4004
400
280
400
4007
1000
700
1000
Unit
V
V
V
A
A
°C/W
pF
°C
V
-50 to +175
1.1
5
50
30
uA
uA
HSMC Product Specification
HI-SINCERITY
MICROELECTRONICS CORP.
DO-41 Dimension
Spec. No. : HE9101-B
Issued Date : 1996.03.27
Revised Date : 2000.05.01
Page No. : 2/2
E
A
B
C
D
DO-41 Molded Plastic Package
HSMC Package Code : L
*:Typical
DIM
A
B
C
Inches
Min.
Max.
0.0280 0.0340
1.0000
-
0.1600 0.2050
Millimeters
Min.
Max.
0.71
0.86
25.40
-
4.10
5.20
DIM
D
E
Inches
Min.
Max.
1.0000
-
0.0800 0.1070
Millimeters
Min.
Max.
25.40
-
2.00
2.70
Notes :
1.Dimension and tolerance based on our Spec. dated May 28,1998.a
2.Controlling dimension : millimeters.
3.Maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material.
4.If there is any question with packing specification or packing method, please contact your local HSMC sales office.
Material :
•
Lead : 42 Alloy ; solder plating
•
Mold Compound : Epoxy resin family, flammability solid burning class:UL94V-0
Important Notice:
•
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of HSMC.
•
HSMC reserves the right to make changes to its products without notice.
•
HSMC semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems.
•
HSMC assumes no liability for any consequence of customer product design, infringement of patents, or application assistance.
Head Office And Factory :
•
Head Office
(Hi-Sincerity Microelectronics Corp.) : 10F.,No. 61, Sec. 2, Chung-Shan N. Rd. Taipei Taiwan R.O.C.
Tel : 886-2-25212056 Fax : 886-2-25632712, 25368454
•
Factory 1 :
No. 38, Kuang Fu S. Rd., Fu-Kou Hsin-Chu Industrial Park Hsin-Chu Taiwan. R.O.C
Tel : 886-3-5983621~5 Fax : 886-3-5982931
•
Factory 2 :
No. 17-1, Ta-Tung Rd., Fu-Kou Hsin-Chu Industrial Park Hsin-Chu Taiwan. R.O.C
Tel : 886-3-5977061 Fax : 886-3-5979220
HSMC Product Specification
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