2.5V single data rate 1:10 clock buffer Terabuffer
参数名称 | 属性值 |
厂商名称 | PulseCore Semiconductor Corporation |
包装说明 | 6.10 MM, GREEN, MO-153ED, TSSOP-48 |
Reach Compliance Code | unknown |
系列 | 907 |
输入调节 | DIFFERENTIAL |
JESD-30 代码 | R-PDSO-G48 |
长度 | 12.5 mm |
逻辑集成电路类型 | LOW SKEW CLOCK DRIVER |
功能数量 | 1 |
反相输出次数 | |
端子数量 | 48 |
实输出次数 | 10 |
最高工作温度 | 85 °C |
最低工作温度 | -40 °C |
封装主体材料 | PLASTIC/EPOXY |
封装代码 | TSSOP |
封装形状 | RECTANGULAR |
封装形式 | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
传播延迟(tpd) | 2.5 ns |
认证状态 | Not Qualified |
Same Edge Skew-Max(tskwd) | 0.025 ns |
座面最大高度 | 1.2 mm |
最大供电电压 (Vsup) | 2.6 V |
最小供电电压 (Vsup) | 2.4 V |
标称供电电压 (Vsup) | 2.5 V |
表面贴装 | YES |
技术 | CMOS |
温度等级 | INDUSTRIAL |
端子形式 | GULL WING |
端子节距 | 0.5 mm |
端子位置 | DUAL |
宽度 | 6.1 mm |
最小 fmax | 250 MHz |
PCS2I5T907AG-48TT | PCS2P5T907AG-48TR | PCS2P5T907AG-48TT | PCS2P5T907A | |
---|---|---|---|---|
描述 | 2.5V single data rate 1:10 clock buffer Terabuffer | 2.5V single data rate 1:10 clock buffer Terabuffer | 2.5V single data rate 1:10 clock buffer Terabuffer | 2.5V single data rate 1:10 clock buffer Terabuffer |
厂商名称 | PulseCore Semiconductor Corporation | PulseCore Semiconductor Corporation | PulseCore Semiconductor Corporation | - |
包装说明 | 6.10 MM, GREEN, MO-153ED, TSSOP-48 | 6.10 MM, GREEN, MO-153ED, TSSOP-48 | 6.10 MM, GREEN, MO-153ED, TSSOP-48 | - |
Reach Compliance Code | unknown | unknown | unknown | - |
系列 | 907 | 907 | 907 | - |
输入调节 | DIFFERENTIAL | DIFFERENTIAL | DIFFERENTIAL | - |
JESD-30 代码 | R-PDSO-G48 | R-PDSO-G48 | R-PDSO-G48 | - |
长度 | 12.5 mm | 12.5 mm | 12.5 mm | - |
逻辑集成电路类型 | LOW SKEW CLOCK DRIVER | LOW SKEW CLOCK DRIVER | LOW SKEW CLOCK DRIVER | - |
功能数量 | 1 | 1 | 1 | - |
端子数量 | 48 | 48 | 48 | - |
实输出次数 | 10 | 10 | 10 | - |
最高工作温度 | 85 °C | 70 °C | 70 °C | - |
封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | - |
封装代码 | TSSOP | TSSOP | TSSOP | - |
封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | - |
封装形式 | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | - |
传播延迟(tpd) | 2.5 ns | 2.5 ns | 2.5 ns | - |
认证状态 | Not Qualified | Not Qualified | Not Qualified | - |
Same Edge Skew-Max(tskwd) | 0.025 ns | 0.025 ns | 0.025 ns | - |
座面最大高度 | 1.2 mm | 1.2 mm | 1.2 mm | - |
最大供电电压 (Vsup) | 2.6 V | 2.6 V | 2.6 V | - |
最小供电电压 (Vsup) | 2.4 V | 2.4 V | 2.4 V | - |
标称供电电压 (Vsup) | 2.5 V | 2.5 V | 2.5 V | - |
表面贴装 | YES | YES | YES | - |
技术 | CMOS | CMOS | CMOS | - |
温度等级 | INDUSTRIAL | COMMERCIAL | COMMERCIAL | - |
端子形式 | GULL WING | GULL WING | GULL WING | - |
端子节距 | 0.5 mm | 0.5 mm | 0.5 mm | - |
端子位置 | DUAL | DUAL | DUAL | - |
宽度 | 6.1 mm | 6.1 mm | 6.1 mm | - |
最小 fmax | 250 MHz | 250 MHz | 250 MHz | - |
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