HI-SINCERITY
MICROELECTRONICS CORP.
Spec. No. : HE6830
Issued Date : 1994.01.25
Revised Date : 2002.10.24
Page No. : 1/3
HBC807
PNP EPITAXIAL PLANAR TRANSISTOR
Description
The HBC807 is designed for switching and AF amplifier amplification
suitable for driver stages and low power output stages.
Absolute Maximum Ratings
SOT-23
•
Maximum Temperatures
Storage Temperature .......................................................................................... -55 to +150
°C
Junction Temperature.................................................................................................... +150
°C
•
Maximum Power Dissipation
Total Power Dissipation (Ta=25°C) ............................................................................... 225 mW
•
Maximum Voltages and Currents (Ta=25°C)
VCES Collector to Base Voltage ........................................................................................ -50 V
VCEO Collector to Emitter Voltage..................................................................................... -45 V
VEBO Emitter to Base Voltage............................................................................................. -5 V
IC Collector Current....................................................................................................... -800 mA
Characteristics
(Ta=25°C)
Symbol
BVCEO
BVCES
BVEBO
ICES
IEBO
*VCE(sat)
VBE(on)
*hFE
fT
Cob
Min.
-45
-50
-5
-
-
-
-
100
-
-
Typ.
-
-
-
-
-
-
-
-
100
-
Max.
-
-
-
-100
-100
-700
-1.2
630
-
12
Unit
V
V
V
nA
nA
mV
V
MHz
pF
Test Conditions
IC=-10mA
IC=-100uA
IE=-100uA
VCE=-25V
VEB=-4V
IC=-500mA, IB=-50mA
VCE=-1V, IC=-300mA
VCE=-1V, IC=-100mA
VCE=-5V, IC=-10mA, f=100MHz
VCB=-10V, f=1MHz, IE=0
*Pulse Test: Pulse Width
≤380us,
Duty Cycle≤2%
Classification Of hFE
Rank
hFE
9FA(16)
100-250
9FB(25)
160-400
9FC(40)
250-630
HBC807
HSMC Product Specification
HI-SINCERITY
MICROELECTRONICS CORP.
Characteristics Curve
Current Gain & Collector Current
1000
Spec. No. : HE6830
Issued Date : 1994.01.25
Revised Date : 2002.10.24
Page No. : 2/3
Saturation Voltage & Collector Current
1000
V
CE
=1V
Saturation Voltage (mV)
hFE
100
100
V
CE(sat)
@ I
C
=10IB
10
0.1
1
10
100
1000
10
1
10
100
1000
Collector Current(mA)
Collector Current (mA)
On Voltage & Collector Current
10000
1000
Cutoff Frequency & Collector Current
Cutoff Frequency (MHz)
V
CE
=5V
On Voltage (mV)
1000
V
BE(on)
@ V
CE
=1V
100
100
0.1
1
10
100
1000
10
1
10
100
1000
Collector Current (mA)
Collector Current (mA)
Capacitance & Reverse-Biased Voltage
100
10
Safe Operating Area
PT=1ms
Collector Current-IC (mA)
1
PT=100ms
Capacitance (pF)
Cob
10
0.1
PT=1s
0.01
1
0.1
1
10
100
0.001
1
10
100
Reverse Biased Voltage (V)
Forward Voltage Vce (V)
HBC807
HSMC Product Specification
HI-SINCERITY
MICROELECTRONICS CORP.
SOT-23 Dimension
A
L
Spec. No. : HE6830
Issued Date : 1994.01.25
Revised Date : 2002.10.24
Page No. : 3/3
Marking:
3
B S
1
V
G
2
9 F
Rank Code
Control Code
3-Lead SOT-23 Plastic
Surface Mounted Package
HSMC Package Code: N
C
D
H
K
J
Style: Pin 1.Base 2.Emitter 3.Collector
*: Typical
DIM
A
B
C
D
G
H
Inches
Min.
Max.
0.1102
0.1204
0.0472
0.0630
0.0335
0.0512
0.0118
0.0197
0.0669
0.0910
0.0005
0.0040
Millimeters
Min.
Max.
2.80
3.04
1.20
1.60
0.89
1.30
0.30
0.50
1.70
2.30
0.013
0.10
DIM
J
K
L
S
V
Inches
Min.
Max.
0.0034
0.0070
0.0128
0.0266
0.0335
0.0453
0.0830
0.1083
0.0098
0.0256
Millimeters
Min.
Max.
0.085
0.177
0.32
0.67
0.85
1.15
2.10
2.75
0.25
0.65
Notes:
1.Dimension and tolerance based on our Spec. dated Sep. 07,1997.
2.Controlling dimension: millimeters.
3.Maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material.
4.If there is any question with packing specification or packing method, please contact your local HSMC sales office.
Material:
•
Lead: 42 Alloy; solder plating
•
Mold Compound: Epoxy resin family, flammability solid burning class: UL94V-0
Important Notice:
•
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of HSMC.
•
HSMC reserves the right to make changes to its products without notice.
•
HSMC semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems.
•
HSMC assumes no liability for any consequence of customer product design, infringement of patents, or application assistance.
Head Office And Factory:
•
Head Office
(Hi-Sincerity Microelectronics Corp.): 10F.,No. 61, Sec. 2, Chung-Shan N. Rd. Taipei Taiwan R.O.C.
Tel: 886-2-25212056 Fax: 886-2-25632712, 25368454
•
Factory 1:
No. 38, Kuang Fu S. Rd., Fu-Kou Hsin-Chu Industrial Park Hsin-Chu Taiwan. R.O.C
Tel: 886-3-5983621~5 Fax: 886-3-5982931
HBC807
HSMC Product Specification
FPGA/CPLD
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