HI-SINCERITY
MICROELECTRONICS CORP.
Spec. No. : HE6423-B
Issued Date : 1992.11.25
Revised Date : 2000.09.20
Page No. : 1/3
HBC557
PNP EPITAXIAL PLANAR TRANSISTOR
Description
The HBC557 is designed for use in driver stage of audio amplifier
applications.
Features
•
High Breakdown Voltage: 45V
•
High AC Current Gain: 75-800 at IC=2mA
Absolute Maximum Ratings
•
Maximum Temperatures
Storage Temperature ............................................................................................ -55 ~ +150
°C
Junction Temperature ................................................................................... +150
°C
Maximum
•
Maximum Power Dissipation
Total Power Dissipation (Ta=25°C) ............................................................................... 500 mW
•
Maximum Voltages and Currents (Ta=25°C)
VCBO Collector to Base Voltage ....................................................................................... -50 V
VCEO Collector to Emitter Voltage .................................................................................... -45 V
VEBO Emitter to Base Voltage ............................................................................................ -5 V
IC Collector Current ..................................................................................................... -100 mA
Characteristics
(Ta=25°C)
Symbol
BVCBO
BVCEO
BVEBO
ICBO
IEBO
VBE(on)1
VBE(on)2
*VCE(sat)1
*VCE(sat)2
*hFE
fT
Cob
Min.
-50
-45
-5
-
-
-600
-
-
-
75
-
-
Typ.
-
-
-
-
-
-
-
-
-
-
300
4.5
Max.
-
-
-
-100
-1
-750
-820
-300
-650
800
-
-
Unit
V
V
V
nA
uA
mV
mV
mV
mV
MHz
PF
Test Conditions
IC=-100uA
IC=-1mA
IE=-10uA
VCB=-20V
VEB=-5V
IC=-2mA, VCE=-5V
IC=-10mA, VCE=-5V
IC=-10mA, IB=-1mA
IC=-100mA, IB=-10mA
VCB=-5V, IC=-2mA
VCE=-5V, IC=-10mA, f=100MHz
VCB=-10V, IE=0, f=1MHz
*Pulse Test : Pulse Width
≤380us,
Duty Cycle≤2%
Classification of hFE
Rank
Range
A
125-260
B
240-500
C
420-800
Normal
75-260
HSMC Product Specification
HI-SINCERITY
MICROELECTRONICS CORP.
Characteristics Curve
Current Gain & Collector Current
1000
100.000
Spec. No. : HE6423-B
Issued Date : 1992.11.25
Revised Date : 2000.09.20
Page No. : 2/3
Saturation Voltage & Collector Current
V
CE
=5V
100
Saturation Voltage (mV)
10.000
hFE
1.000
10
0.100
V
CE(sat)
@ I
C
=10I
B
1
1
10
100
1000
0.010
1
10
100
1000
Collector Current (mA)
Collector Current (mA)
On Voltage & Collector Current
10
1000
Cutoff Frequency & Collector Current
Cutoff Frequency (MHz)
V
CE
=5V
100
On Voltage (mV)
1
V
BE(on)
@ V
CE
=5V
10
0.1
1
10
100
1000
1
1
10
100
1000
Collector Current (mA)
Collector Current (mA)
Capacitance & Reverse-Biased Voltage
10
10
Safe Operating Area
PT=1ms
Collector Current-I
C
(mA)
PT=100ms
1
PT=1s
Capacitance (pF)
0.1
Cob
1
1
10
100
0.01
1
10
100
Reverse Biased Voltage (V)
Forward Voltage-VCE (V)
HSMC Product Specification
HI-SINCERITY
MICROELECTRONICS CORP.
TO-92 Dimension
A
B
1 2
3
Spec. No. : HE6423-B
Issued Date : 1992.11.25
Revised Date : 2000.09.20
Page No. : 3/3
α
2
Marking :
HSMC Logo
Part Number
Date Code
Rank
Product Series
α
3
Laser Mark
HSMC Logo
Product Series
C
D
Part Number
H
I
E
F
G
Ink Mark
Style : Pin 1.Collector 2.Base 3.Emitter
α
1
3-Lead TO-92 Plastic Package
HSMC Package Code : A
*:Typical
DIM
A
B
C
D
E
F
Inches
Min.
Max.
0.1704 0.1902
0.1704 0.1902
0.5000
-
0.0142 0.0220
-
*0.0500
0.1323 0.1480
Millimeters
Min.
Max.
4.33
4.83
4.33
4.83
12.70
-
0.36
0.56
-
*1.27
3.36
3.76
DIM
G
H
I
α1
α2
α3
Inches
Min.
Max.
0.0142 0.0220
-
*0.1000
-
*0.0500
-
*5°
-
*2°
-
*2°
Millimeters
Min.
Max.
0.36
0.56
-
*2.54
-
*1.27
-
*5°
-
*2°
-
*2°
Notes :
1.Dimension and tolerance based on our Spec. dated Apr. 25,1996.
2.Controlling dimension : millimeters.
3.Maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material.
4.If there is any question with packing specification or packing method, please contact your local HSMC sales office.
Material :
•
Lead : 42 Alloy ; solder plating
•
Mold Compound : Epoxy resin family, flammability solid burning class:UL94V-0
Important Notice:
•
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of HSMC.
•
HSMC reserves the right to make changes to its products without notice.
•
HSMC semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems.
•
HSMC assumes no liability for any consequence of customer product design, infringement of patents, or application assistance.
Head Office And Factory :
•
Head Office
(Hi-Sincerity Microelectronics Corp.) : 10F.,No. 61, Sec. 2, Chung-Shan N. Rd. Taipei Taiwan R.O.C.
Tel : 886-2-25212056 Fax : 886-2-25632712, 25368454
•
Factory 1 :
No. 38, Kuang Fu S. Rd., Fu-Kou Hsin-Chu Industrial Park Hsin-Chu Taiwan. R.O.C
Tel : 886-3-5983621~5 Fax : 886-3-5982931
•
Factory 2 :
No. 17-1, Ta-Tung Rd., Fu-Kou Hsin-Chu Industrial Park Hsin-Chu Taiwan. R.O.C
Tel : 886-3-5977061 Fax : 886-3-5979220
HSMC Product Specification
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