HI-SINCERITY
MICROELECTRONICS CORP.
Spec. No. : HE6519
Issued Date : 1993.01.15
Revised Date : 2001.10.15
Page No. : 1/3
HSB564A
PNP EPITAXIAL PLANAR TRANSISTOR
Description
The HSB564A is designed for general purpose low frequency power
amplifier applications.
Absolute Maximum Ratings
•
Maximum Temperatures
Storage Temperature ............................................................................................ -55 ~ +150
°C
Junction Temperature .................................................................................... +150
°C
Maximum
•
Maximum Power Dissipation
Total Power Dissipation (Ta=25°C) ................................................................................ 800 mW
•
Maximum Voltages and Currents (Ta=25°C)
VCBO Collector to Base Voltage ........................................................................................ -30 V
VCEO Collector to Emitter Voltage ..................................................................................... -25 V
VEBO Emitter to Base Voltage ............................................................................................ -5 V
IC Collector Current ............................................................................................................. -1 A
Characteristics
(Ta=25°C)
Symbol
BVCBO
BVCEO
BVEBO
ICBO
*VCE(sat)
*VBE(sat)
*hFE
fT
Cob
Min.
-30
-25
-5
-
-
-
70
-
-
Typ.
-
-
-
-
-
-
-
110
18
Max.
-
-
-
-100
-0.5
-1.2
400
-
-
Unit
V
V
V
nA
V
V
MHz
pF
Test Conditions
IC=-100uA, IE=0
IC=-10mA. IB=0
IE=-100uA, IC=0
VCB=-30V, IE=0
IC=-1A, IB=-100mA
IC=-1A, IB=-100mA
VCE=-1V, IC=-100mA
VCE=-6V, IC=-10mA, f=100MHz
VCB=-6V, f=1MHz
*Pulse Test : Pulse Width
≤380us,
Duty Cycle≤2%
Classification Of hFE
Rank
Range
O
70-140
Y
120-240
GR
200-400
HSB564A
HSMC Product Specification
HI-SINCERITY
MICROELECTRONICS CORP.
Characteristics Curve
Current Gain & Collector Current
1000
10000
Spec. No. : HE6519
Issued Date : 1993.01.15
Revised Date : 2001.10.15
Page No. : 2/3
Saturation Voltage & Collector Current
Saturation Voltage (mV)
1000
V
BE(sat)
@ I
C
=10I
B
100
V
CE
=1V
hFE
100
10
V
CE(sat)
@ I
C
=10I
B
10
0.1
1
10
100
1000
1
0.1
1
10
100
1000
Collector Current (mA)
Collector Current (mA)
Capcitance & Reverse-Biased Voltage
100
1000
Cutoff Frequency & Collector Current
Cutoff Frequency (MHz)
Capacitance (pF)
Cob
10
V
CE
=6V
100
1
0.1
1
10
100
10
1
10
100
1000
Reverse Biased Voltage (V)
Collector Current (mA)
Safe Operating Area
10000
P
T
=1ms
Power Derating
900
800
P
T
=100ms
1000
Power Dissipation-PD(mW)
700
600
500
400
300
200
100
Collector Current (mA)
P
T
=1s
100
10
1
1
10
100
0
0
50
100
o
150
200
Forward Voltage (V)
Ambient Temperature-Ta( C)
HSB564A
HSMC Product Specification
HI-SINCERITY
MICROELECTRONICS CORP.
TO-92 Dimension
A
B
1
2
3
Spec. No. : HE6519
Issued Date : 1993.01.15
Revised Date : 2001.10.15
Page No. : 3/3
α
2
Marking:
HSMC Logo
Part Number
Date Code
Rank
Product Series
α
3
Laser Mark
HSMC Logo
Product Series
C
D
Part Number
H
I
E
F
G
Ink Mark
α
1
3-Lead TO-92 Plastic Package
HSMC Package Code: A
Style: Pin 1.Emitter 2.Collector 3.Base
*: Typical
DIM
A
B
C
D
E
F
Inches
Min.
Max.
0.1704 0.1902
0.1704 0.1902
0.5000
-
0.0142 0.0220
-
*0.0500
0.1323 0.1480
Millimeters
Min.
Max.
4.33
4.83
4.33
4.83
12.70
-
0.36
0.56
-
*1.27
3.36
3.76
DIM
G
H
I
α1
α2
α3
Inches
Min.
Max.
0.0142 0.0220
-
*0.1000
-
*0.0500
-
*5°
-
*2°
-
*2°
Millimeters
Min.
Max.
0.36
0.56
-
*2.54
-
*1.27
-
*5°
-
*2°
-
*2°
Notes:
1.Dimension and tolerance based on our Spec. dated Apr. 25,1996.
2.Controlling dimension: millimeters.
3.Maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material.
4.If there is any question with packing specification or packing method, please contact your local HSMC sales office.
Material:
•
Lead: 42 Alloy ; solder plating
•
Mold Compound: Epoxy resin family, flammability solid burning class: UL94V-0
Important Notice:
•
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of HSMC.
•
HSMC reserves the right to make changes to its products without notice.
•
HSMC semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems.
•
HSMC assumes no liability for any consequence of customer product design, infringement of patents, or application assistance.
Head Office And Factory:
•
Head Office
(Hi-Sincerity Microelectronics Corp.): 10F.,No. 61, Sec. 2, Chung-Shan N. Rd. Taipei Taiwan R.O.C.
Tel: 886-2-25212056 Fax: 886-2-25632712, 25368454
•
Factory 1:
No. 38, Kuang Fu S. Rd., Fu-Kou Hsin-Chu Industrial Park Hsin-Chu Taiwan. R.O.C
Tel: 886-3-5983621~5 Fax: 886-3-5982931
HSB564A
HSMC Product Specification
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