Storage Temperature ............................................................................................................................. -50~+150
°C
Junction Temperature ................................................................................................................... +150
°C
Maximum
•
Maximum Power Dissipation
Total Power Dissipation (T
A
=25°C) .................................................................................................................... 1.5 W
Total Power Dissipation (T
C
=25°C) ..................................................................................................................... 10 W
•
Maximum Voltages and Currents
BV
CBO
Collector to Base Voltage......................................................................................................................... -60 V
BV
CEO
Collector to Emitter Voltage..................................................................................................................... -50 V
BV
EBO
Emitter to Base Voltage............................................................................................................................. -5 V
I
C
Collector Current .............................................................................................................................................. -3 A
I
CP
Collector Current (I
C
Peak) .......................................................................................................................... -4.5 A
Electrical Characteristics
(T
A
=25°C)
Symbol
BV
CBO
BV
CEO
BV
EBO
I
CBO
I
CEO
I
EBO
*V
CE(sat)
*V
BE(sat)
*h
FE
f
T
Min.
-60
-50
-5
-
-
-
-
-
170
-
Typ.
-
-
-
-
-
-
-0.3
-
-
15
Max.
-
-
-
-1
-1
-1
-1
-1.5
400
-
MHz
Unit
V
V
V
uA
uA
uA
V
V
I
C
=-50uA
I
C
=-1mA
I
E
=-50uA
V
CB
=-50V
V
CE
=-40V
V
EB
=-4V
I
C
=-2A, I
B
=-0.2A
I
C
=-2A, I
B
=-0.2A
I
C
=-500mA, V
CE
=-3V
V
CE
=-5V, I
C
=-500mA, f=100MHz
*Pulse Test: Pulse Width
≤380us,
Duty Cycle≤2%
Test Conditions
HSB857D
HSMC Product Specification
HI-SINCERITY
MICROELECTRONICS CORP.
Characteristics Curve
Current Gain & Collector Current
1000
125 C
o
Spec. No. : HE6705
Issued Date : 1995.01.27
Revised Date : 2005.08.18
Page No. : 2/4
Saturation Voltage & Collector Current
1000
V
CE(sat)
@ I
C
=10I
B
75 C
o
25 C
o
Saturation Voltage (mV)
hFE
100
100
75 C
o
hFE @ V
CE
=3V
125 C
o
25 C
o
10
1
10
100
1000
10000
10
1
10
100
1000
10000
Collector Current-I
C
(mA)
Collector Current-I
C
(mA)
Saturation Voltage & Collector Current
10000
V
BE(sat)
@ I
C
=10I
B
Capacitance & Reverse-Biased Voltage
1000
Saturation Voltage (mV)
75 C
1000
25 C
o
o
Capacitance (pF)
100
Cob
125 C
o
100
1
10
100
1000
10000
10
1
10
100
Collector Current-I
C
(mA)
Reverse Biased Voltage (V)
Safe Operating Area
10
PT=1ms
PD - Ta
1.6
1.4
PD(W) , Power Dissipation
Collector Current-I
C
(A)
1.2
1
0.8
0.6
0.4
0.2
1
PT=100ms
PT=1s
0.1
1
10
100
1000
0
0
50
100
o
150
200
Forward Voltage-V
CE
(V)
Ambient Temperature-Ta ( C )
HSB857D
HSMC Product Specification
HI-SINCERITY
MICROELECTRONICS CORP.
Spec. No. : HE6705
Issued Date : 1995.01.27
Revised Date : 2005.08.18
Page No. : 3/4
PD - Tc
12
10
PD(W), Power Dissipation
8
6
4
2
0
0
50
100
o
150
200
Ambient Temperature-Tc ( C)
TO-126ML Dimension
A
C
D
E
H
SB
8 5 7D
Marking:
L
Pb Free Mark
Pb-Free: "
.
"
(Note)
Normal: None
I
B
1
F
H
G
M
2
3
Date Code
Control Code
Note: Green label is used for pb-free packing
Pin Style: 1.Emitter 2.Collector 3.Base
Material:
•
Lead solder plating: Sn60/Pb40 (Normal),
Sn/3.0Ag/0.5Cu or Pure-Tin (Pb-free)
•
Mold Compound: Epoxy resin family,
flammability solid burning class: UL94V-0
DIM
A
B
C
D
E
F
G
H
I
J
K
L
M
N
Min.
7.74
10.87
0.88
1.28
3.50
2.61
13
1.18
2.88
0.68
-
3.44
1.88
0.50
Max.
8.24
11.37
1.12
1.52
3.75
3.37
-
1.42
3.12
0.84
2.30
3.70
2.14
0.51
*: Typical, Unit: mm
K
J
N
3-Lead TO-126ML
Plastic Package
HSMC Package Code: D
Important Notice:
•
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of HSMC.
•
HSMC reserves the right to make changes to its products without notice.
•
HSMC semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems.
•
HSMC assumes no liability for any consequence of customer product design, infringement of patents, or application assistance.
Head Office And Factory:
•
Head Office
(Hi-Sincerity Microelectronics Corp.): 10F.,No. 61, Sec. 2, Chung-Shan N. Rd. Taipei Taiwan R.O.C.
Tel: 886-2-25212056 Fax: 886-2-25632712, 25368454
•
Factory 1:
No. 38, Kuang Fu S. Rd., Fu-Kou Hsin-Chu Industrial Park Hsin-Chu Taiwan. R.O.C
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