Microprocessor, 32-Bit, 100MHz, CMOS, CPGA168, PGA-168
参数名称 | 属性值 |
是否Rohs认证 | 不符合 |
厂商名称 | AMD(超微) |
零件包装代码 | PGA |
包装说明 | PGA-168 |
针数 | 168 |
Reach Compliance Code | unknown |
ECCN代码 | 3A991.A.2 |
地址总线宽度 | 32 |
位大小 | 32 |
边界扫描 | YES |
最大时钟频率 | 33.33 MHz |
外部数据总线宽度 | 32 |
格式 | FLOATING POINT |
集成缓存 | YES |
JESD-30 代码 | S-CPGA-P168 |
JESD-609代码 | e0 |
长度 | 44.45 mm |
低功率模式 | YES |
DMA 通道数量 | |
外部中断装置数量 | 3 |
串行 I/O 数 | |
端子数量 | 168 |
片上数据RAM宽度 | |
最高工作温度 | 85 °C |
最低工作温度 | |
封装主体材料 | CERAMIC, METAL-SEALED COFIRED |
封装代码 | PGA |
封装等效代码 | PGA168,17X17 |
封装形状 | SQUARE |
封装形式 | GRID ARRAY |
峰值回流温度(摄氏度) | NOT SPECIFIED |
电源 | 3.3 V |
认证状态 | Not Qualified |
RAM(字数) | 0 |
座面最大高度 | 4.572 mm |
速度 | 100 MHz |
最大压摆率 | 700 mA |
最大供电电压 | 3.6 V |
最小供电电压 | 3 V |
标称供电电压 | 3.3 V |
表面贴装 | NO |
技术 | CMOS |
温度等级 | OTHER |
端子面层 | Tin/Lead (Sn/Pb) |
端子形式 | PIN/PEG |
端子节距 | 2.54 mm |
端子位置 | PERPENDICULAR |
处于峰值回流温度下的最长时间 | NOT SPECIFIED |
宽度 | 44.45 mm |
uPs/uCs/外围集成电路类型 | MICROPROCESSOR |
Base Number Matches | 1 |
AM486DX4-100V16BGC | AM486DX4-100V16BGI | AM486DX5-133W16BGC | AM486DX5-133V16BHC | AM486DX2-66V16BHI | AM486DX2-66V16BHC | AM486DX4-100V16BHI | AM486DX2-66V16BGC | |
---|---|---|---|---|---|---|---|---|
描述 | Microprocessor, 32-Bit, 100MHz, CMOS, CPGA168, PGA-168 | Microprocessor, 32-Bit, 100MHz, CMOS, CPGA168, PGA-168 | Microprocessor, 32-Bit, 133MHz, CMOS, CPGA168, PGA-168 | Microprocessor, 32-Bit, 133MHz, CMOS, PQFP208, SHRINK, QFP-208 | Microprocessor, 32-Bit, 66MHz, CMOS, PQFP208, SHRINK, QFP-208 | Microprocessor, 32-Bit, 66MHz, CMOS, PQFP208, SHRINK, QFP-208 | Microprocessor, 32-Bit, 100MHz, CMOS, PQFP208, SHRINK, QFP-208 | Microprocessor, 32-Bit, 66MHz, CMOS, CPGA168, PGA-168 |
是否Rohs认证 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 |
零件包装代码 | PGA | PGA | PGA | QFP | QFP | QFP | QFP | PGA |
包装说明 | PGA-168 | PGA-168 | PGA-168 | SHRINK, QFP-208 | SHRINK, QFP-208 | SHRINK, QFP-208 | SHRINK, QFP-208 | PGA-168 |
针数 | 168 | 168 | 168 | 208 | 208 | 208 | 208 | 168 |
Reach Compliance Code | unknown | unknown | unknown | unknown | unknown | unknown | unknown | unknown |
ECCN代码 | 3A991.A.2 | 3A991.A.2 | 3A991.A.2 | 3A991.A.2 | 3A991.A.2 | 3A991.A.2 | 3A991.A.2 | 3A991.A.2 |
地址总线宽度 | 32 | 32 | 32 | 32 | 32 | 32 | 32 | 32 |
位大小 | 32 | 32 | 32 | 32 | 32 | 32 | 32 | 32 |
边界扫描 | YES | YES | YES | YES | YES | YES | YES | YES |
最大时钟频率 | 33.33 MHz | 33.33 MHz | 33.33 MHz | 33.33 MHz | 33.33 MHz | 33.33 MHz | 33.33 MHz | 33.33 MHz |
外部数据总线宽度 | 32 | 32 | 32 | 32 | 32 | 32 | 32 | 32 |
格式 | FLOATING POINT | FLOATING POINT | FLOATING POINT | FLOATING POINT | FLOATING POINT | FLOATING POINT | FLOATING POINT | FLOATING POINT |
集成缓存 | YES | YES | YES | YES | YES | YES | YES | YES |
JESD-30 代码 | S-CPGA-P168 | S-CPGA-P168 | S-CPGA-P168 | S-PQFP-G208 | S-PQFP-G208 | S-PQFP-G208 | S-PQFP-G208 | S-CPGA-P168 |
JESD-609代码 | e0 | e0 | e0 | e0 | e0 | e0 | e0 | e0 |
长度 | 44.45 mm | 44.45 mm | 44.45 mm | 28 mm | 28 mm | 28 mm | 28 mm | 44.45 mm |
低功率模式 | YES | YES | YES | YES | YES | YES | YES | YES |
外部中断装置数量 | 3 | 3 | 3 | 3 | 3 | 3 | 3 | 3 |
端子数量 | 168 | 168 | 168 | 208 | 208 | 208 | 208 | 168 |
最高工作温度 | 85 °C | 100 °C | 85 °C | 85 °C | 100 °C | 85 °C | 100 °C | 85 °C |
封装主体材料 | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | CERAMIC, METAL-SEALED COFIRED |
封装代码 | PGA | PGA | PGA | FQFP | FQFP | FQFP | FQFP | PGA |
封装等效代码 | PGA168,17X17 | PGA168,17X17 | PGA168,17X17 | QFP208,1.2SQ,20 | QFP208,1.2SQ,20 | QFP208,1.2SQ,20 | QFP208,1.2SQ,20 | PGA168,17X17 |
封装形状 | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE |
封装形式 | GRID ARRAY | GRID ARRAY | GRID ARRAY | FLATPACK, FINE PITCH | FLATPACK, FINE PITCH | FLATPACK, FINE PITCH | FLATPACK, FINE PITCH | GRID ARRAY |
峰值回流温度(摄氏度) | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
电源 | 3.3 V | 3.3 V | 3.45 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V |
认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
座面最大高度 | 4.572 mm | 4.572 mm | 4.572 mm | 3.7 mm | 3.7 mm | 3.7 mm | 3.7 mm | 4.572 mm |
速度 | 100 MHz | 100 MHz | 133 MHz | 133 MHz | 66 MHz | 66 MHz | 100 MHz | 66 MHz |
最大压摆率 | 700 mA | 700 mA | 931 mA | 931 mA | 462 mA | 462 mA | 700 mA | 462 mA |
最大供电电压 | 3.6 V | 3.6 V | 3.6 V | 3.6 V | 3.6 V | 3.6 V | 3.6 V | 3.6 V |
最小供电电压 | 3 V | 3 V | 3.3 V | 3 V | 3 V | 3 V | 3 V | 3 V |
标称供电电压 | 3.3 V | 3.3 V | 3.45 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V |
表面贴装 | NO | NO | NO | YES | YES | YES | YES | NO |
技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
温度等级 | OTHER | INDUSTRIAL | OTHER | OTHER | INDUSTRIAL | OTHER | INDUSTRIAL | OTHER |
端子形式 | PIN/PEG | PIN/PEG | PIN/PEG | GULL WING | GULL WING | GULL WING | GULL WING | PIN/PEG |
端子节距 | 2.54 mm | 2.54 mm | 2.54 mm | 0.5 mm | 0.5 mm | 0.5 mm | 0.5 mm | 2.54 mm |
端子位置 | PERPENDICULAR | PERPENDICULAR | PERPENDICULAR | QUAD | QUAD | QUAD | QUAD | PERPENDICULAR |
处于峰值回流温度下的最长时间 | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
宽度 | 44.45 mm | 44.45 mm | 44.45 mm | 28 mm | 28 mm | 28 mm | 28 mm | 44.45 mm |
uPs/uCs/外围集成电路类型 | MICROPROCESSOR | MICROPROCESSOR | MICROPROCESSOR | MICROPROCESSOR | MICROPROCESSOR | MICROPROCESSOR | MICROPROCESSOR | MICROPROCESSOR |
Base Number Matches | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
厂商名称 | AMD(超微) | - | AMD(超微) | AMD(超微) | AMD(超微) | AMD(超微) | AMD(超微) | AMD(超微) |
端子面层 | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | - |
电子工程世界版权所有 京B2-20211791 京ICP备10001474号-1 电信业务审批[2006]字第258号函 京公网安备 11010802033920号 Copyright © 2005-2024 EEWORLD.com.cn, Inc. All rights reserved