Identity Comparator, FCT Series, 8-Bit, Inverted Output, CMOS, CDFP20, CERPACK-20
参数名称 | 属性值 |
是否Rohs认证 | 不符合 |
零件包装代码 | DFP |
包装说明 | DFP, FL20,.3 |
针数 | 20 |
Reach Compliance Code | not_compliant |
其他特性 | CASCADABLE |
系列 | FCT |
JESD-30 代码 | R-GDFP-F20 |
JESD-609代码 | e0 |
负载电容(CL) | 50 pF |
逻辑集成电路类型 | IDENTITY COMPARATOR |
位数 | 8 |
功能数量 | 1 |
端子数量 | 20 |
最高工作温度 | 125 °C |
最低工作温度 | -55 °C |
输出极性 | INVERTED |
封装主体材料 | CERAMIC, GLASS-SEALED |
封装代码 | DFP |
封装等效代码 | FL20,.3 |
封装形状 | RECTANGULAR |
封装形式 | FLATPACK |
峰值回流温度(摄氏度) | 225 |
电源 | 5 V |
传播延迟(tpd) | 9.5 ns |
认证状态 | Not Qualified |
筛选级别 | MIL-STD-883 |
座面最大高度 | 2.3368 mm |
最大供电电压 (Vsup) | 5.5 V |
最小供电电压 (Vsup) | 4.5 V |
标称供电电压 (Vsup) | 5 V |
表面贴装 | YES |
技术 | CMOS |
温度等级 | MILITARY |
端子面层 | TIN LEAD |
端子形式 | FLAT |
端子节距 | 1.27 mm |
端子位置 | DUAL |
处于峰值回流温度下的最长时间 | 30 |
宽度 | 6.9215 mm |
Base Number Matches | 1 |
5962-9223404MSA | 5962-9223402MSA | 5962-9223408MSA | 5962-9223406MSA | IDT74FCT521TSOT/R | |
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描述 | Identity Comparator, FCT Series, 8-Bit, Inverted Output, CMOS, CDFP20, CERPACK-20 | Identity Comparator, FCT Series, 8-Bit, Inverted Output, CMOS, CDFP20, CERPACK-20 | Identity Comparator, FCT Series, 8-Bit, Inverted Output, CMOS, CDFP20, CERPACK-20 | Identity Comparator, FCT Series, 8-Bit, Inverted Output, CMOS, CDFP20, CERPACK-20 | Identity Comparator, FCT Series, 8-Bit, Inverted Output, CMOS, PDSO20, 0.300 INCH, SOIC-20 |
是否Rohs认证 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 |
零件包装代码 | DFP | DFP | DFP | DFP | SOIC |
包装说明 | DFP, FL20,.3 | CERPACK-20 | DFP, FL20,.3 | DFP, FL20,.3 | 0.300 INCH, SOIC-20 |
针数 | 20 | 20 | 20 | 20 | 20 |
Reach Compliance Code | not_compliant | not_compliant | not_compliant | not_compliant | compliant |
其他特性 | CASCADABLE | CASCADABLE | CASCADABLE | CASCADABLE | CASCADABLE |
系列 | FCT | FCT | FCT | FCT | FCT |
JESD-30 代码 | R-GDFP-F20 | R-GDFP-F20 | R-GDFP-F20 | R-GDFP-F20 | R-PDSO-G20 |
JESD-609代码 | e0 | e0 | e0 | e0 | e0 |
负载电容(CL) | 50 pF | 50 pF | 50 pF | 50 pF | 50 pF |
逻辑集成电路类型 | IDENTITY COMPARATOR | IDENTITY COMPARATOR | IDENTITY COMPARATOR | IDENTITY COMPARATOR | IDENTITY COMPARATOR |
位数 | 8 | 8 | 8 | 8 | 8 |
功能数量 | 1 | 1 | 1 | 1 | 1 |
端子数量 | 20 | 20 | 20 | 20 | 20 |
最高工作温度 | 125 °C | 125 °C | 125 °C | 125 °C | 70 °C |
最低工作温度 | -55 °C | -55 °C | -55 °C | -55 °C | - |
输出极性 | INVERTED | INVERTED | INVERTED | INVERTED | INVERTED |
封装主体材料 | CERAMIC, GLASS-SEALED | CERAMIC, GLASS-SEALED | CERAMIC, GLASS-SEALED | CERAMIC, GLASS-SEALED | PLASTIC/EPOXY |
封装代码 | DFP | DFP | DFP | DFP | SOP |
封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
封装形式 | FLATPACK | FLATPACK | FLATPACK | FLATPACK | SMALL OUTLINE |
峰值回流温度(摄氏度) | 225 | 225 | 225 | 225 | NOT SPECIFIED |
传播延迟(tpd) | 9.5 ns | 15 ns | 5.1 ns | 7.3 ns | 11 ns |
认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
座面最大高度 | 2.3368 mm | 2.3368 mm | 2.3368 mm | 2.3368 mm | 2.65 mm |
最大供电电压 (Vsup) | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.25 V |
最小供电电压 (Vsup) | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.75 V |
标称供电电压 (Vsup) | 5 V | 5 V | 5 V | 5 V | 5 V |
表面贴装 | YES | YES | YES | YES | YES |
技术 | CMOS | CMOS | CMOS | CMOS | CMOS |
温度等级 | MILITARY | MILITARY | MILITARY | MILITARY | COMMERCIAL |
端子面层 | TIN LEAD | TIN LEAD | TIN LEAD | TIN LEAD | Tin/Lead (Sn/Pb) |
端子形式 | FLAT | FLAT | FLAT | FLAT | GULL WING |
端子节距 | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm |
端子位置 | DUAL | DUAL | DUAL | DUAL | DUAL |
处于峰值回流温度下的最长时间 | 30 | 30 | 30 | 30 | NOT SPECIFIED |
宽度 | 6.9215 mm | 6.9215 mm | 6.9215 mm | 6.9215 mm | 7.5 mm |
封装等效代码 | FL20,.3 | FL20,.3 | FL20,.3 | FL20,.3 | - |
电源 | 5 V | 5 V | 5 V | 5 V | - |
筛选级别 | MIL-STD-883 | MIL-STD-883 | MIL-STD-883 | MIL-STD-883 | - |
Base Number Matches | 1 | 1 | 1 | 1 | - |
厂商名称 | - | IDT (Integrated Device Technology) | - | IDT (Integrated Device Technology) | IDT (Integrated Device Technology) |
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