F/FAST SERIES, DUAL 4 LINE TO 1 LINE MULTIPLEXER, INVERTED OUTPUT, CQCC20, CERAMIC, LCC-20
参数名称 | 属性值 |
是否无铅 | 含铅 |
是否Rohs认证 | 不符合 |
厂商名称 | Texas Instruments(德州仪器) |
零件包装代码 | QLCC |
包装说明 | QCCN, LCC20,.35SQ |
针数 | 20 |
Reach Compliance Code | unknown |
系列 | F/FAST |
JESD-30 代码 | S-CQCC-N20 |
JESD-609代码 | e0 |
长度 | 8.89 mm |
负载电容(CL) | 50 pF |
逻辑集成电路类型 | MULTIPLEXER |
最大I(ol) | 0.02 A |
功能数量 | 2 |
输入次数 | 4 |
输出次数 | 1 |
端子数量 | 20 |
最高工作温度 | 125 °C |
最低工作温度 | -55 °C |
输出特性 | 3-STATE |
输出极性 | INVERTED |
封装主体材料 | CERAMIC, METAL-SEALED COFIRED |
封装代码 | QCCN |
封装等效代码 | LCC20,.35SQ |
封装形状 | SQUARE |
封装形式 | CHIP CARRIER |
峰值回流温度(摄氏度) | NOT SPECIFIED |
电源 | 5 V |
最大电源电流(ICC) | 20 mA |
Prop。Delay @ Nom-Sup | 14 ns |
传播延迟(tpd) | 11 ns |
认证状态 | Not Qualified |
座面最大高度 | 1.905 mm |
最大供电电压 (Vsup) | 5.5 V |
最小供电电压 (Vsup) | 4.5 V |
标称供电电压 (Vsup) | 5 V |
表面贴装 | YES |
技术 | TTL |
温度等级 | MILITARY |
端子面层 | Tin/Lead (Sn/Pb) |
端子形式 | NO LEAD |
端子节距 | 1.27 mm |
端子位置 | QUAD |
处于峰值回流温度下的最长时间 | NOT SPECIFIED |
宽度 | 8.89 mm |
Base Number Matches | 1 |
54F353LM | 54F353FM | 74F353SJX | 74F353SCX | 74F353SJ | 74F353SC | |
---|---|---|---|---|---|---|
描述 | F/FAST SERIES, DUAL 4 LINE TO 1 LINE MULTIPLEXER, INVERTED OUTPUT, CQCC20, CERAMIC, LCC-20 | F/FAST SERIES, DUAL 4 LINE TO 1 LINE MULTIPLEXER, INVERTED OUTPUT, CDFP16, CERAMIC, FP-16 | F/FAST SERIES, DUAL 4 LINE TO 1 LINE MULTIPLEXER, INVERTED OUTPUT, PDSO16, EIAJ, SOIC-16 | F/FAST SERIES, DUAL 4 LINE TO 1 LINE MULTIPLEXER, INVERTED OUTPUT, PDSO16, SOIC-16 | F/FAST SERIES, DUAL 4 LINE TO 1 LINE MULTIPLEXER, INVERTED OUTPUT, PDSO16, EIAJ, SOIC-16 | IC F/FAST SERIES, DUAL 4 LINE TO 1 LINE MULTIPLEXER, INVERTED OUTPUT, PDSO16, SOIC-16, Multiplexer/Demultiplexer |
厂商名称 | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) |
零件包装代码 | QLCC | DFP | SOIC | SOIC | SOIC | SOIC |
包装说明 | QCCN, LCC20,.35SQ | DFP, FL16,.3 | SOP, | SOP, | SOP, | SOP, SOP16,.25 |
针数 | 20 | 16 | 16 | 16 | 16 | 16 |
Reach Compliance Code | unknown | unknown | unknown | unknown | unknown | unknown |
系列 | F/FAST | F/FAST | F/FAST | F/FAST | F/FAST | F/FAST |
JESD-30 代码 | S-CQCC-N20 | R-GDFP-F16 | R-PDSO-G16 | R-PDSO-G16 | R-PDSO-G16 | R-PDSO-G16 |
负载电容(CL) | 50 pF | 50 pF | 50 pF | 50 pF | 50 pF | 50 pF |
逻辑集成电路类型 | MULTIPLEXER | MULTIPLEXER | MULTIPLEXER | MULTIPLEXER | MULTIPLEXER | MULTIPLEXER |
功能数量 | 2 | 2 | 2 | 2 | 2 | 2 |
输入次数 | 4 | 4 | 4 | 4 | 4 | 4 |
输出次数 | 1 | 1 | 1 | 1 | 1 | 1 |
端子数量 | 20 | 16 | 16 | 16 | 16 | 16 |
最高工作温度 | 125 °C | 125 °C | 70 °C | 70 °C | 70 °C | 70 °C |
输出特性 | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE |
输出极性 | INVERTED | INVERTED | INVERTED | INVERTED | INVERTED | INVERTED |
封装主体材料 | CERAMIC, METAL-SEALED COFIRED | CERAMIC, GLASS-SEALED | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
封装代码 | QCCN | DFP | SOP | SOP | SOP | SOP |
封装形状 | SQUARE | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
封装形式 | CHIP CARRIER | FLATPACK | SMALL OUTLINE | SMALL OUTLINE | SMALL OUTLINE | SMALL OUTLINE |
最大电源电流(ICC) | 20 mA | 20 mA | 20 mA | 20 mA | 20 mA | 20 mA |
传播延迟(tpd) | 11 ns | 11 ns | 9.5 ns | 9.5 ns | 9.5 ns | 9.5 ns |
认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
最大供电电压 (Vsup) | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V |
最小供电电压 (Vsup) | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V |
标称供电电压 (Vsup) | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
表面贴装 | YES | YES | YES | YES | YES | YES |
技术 | TTL | TTL | TTL | TTL | TTL | TTL |
温度等级 | MILITARY | MILITARY | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL |
端子形式 | NO LEAD | FLAT | GULL WING | GULL WING | GULL WING | GULL WING |
端子位置 | QUAD | DUAL | DUAL | DUAL | DUAL | DUAL |
长度 | 8.89 mm | 9.6645 mm | 10.11 mm | - | 10.11 mm | - |
座面最大高度 | 1.905 mm | 2.032 mm | 2.108 mm | - | 2.108 mm | - |
端子节距 | 1.27 mm | 1.27 mm | 1.27 mm | - | 1.27 mm | 1.27 mm |
宽度 | 8.89 mm | 6.604 mm | 5.3 mm | - | 5.3 mm | - |
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