BZM55-C2V4 SERIES
SURFACE MOUNT ZENER DIODES
VOLTAGE
2.4 to 75 Volts
POWER
500 mWatts
FEATURES
• Planar Die construction
• 500mW Power Dissipation
• Ideally Suited for Automated Assembly Processes
• Lead free in compliance with EU RoHS 2.0
0.043(1.1)
MECHANICAL DATA
• Case: Molded Glass MICRO-MELF
• Terminals: Solderable per MIL-STD-750, Method 2026
• Polarity: See Diagram Below
• Approx. Weight: 0.011 grams
• Mounting Position: Any
• Packing information
T/R - 2.5K per 7" plastic Reel
0.079(2.0)
0.071(1.8)
0.008(0.2)
0.008(0.2)
MAXIMUM RATINGS AND ELECTRICAL CHARACTERISTICS
Parameter
Power Dissipation at T
A
= 25
O
C
Junction Temperature
Storage Temperature Range
Symbol
Value
500
175
-65 to +175
Units
mW
O
P
TOT
T
J
T
S
C
C
O
Valid provided that leads at a distance of 8mm from case are kept at ambient temperature.
Parameter
Thermal Resistance Junction to Ambient Air
Forward Voltage at I
F
= 200mA
Symbol
R
JA
V
F
Min.
--
--
Typ.
--
--
Max.
0.3
1.5
o
Units
C/mW
V
Valid provided that leads at a distance of 8mm from case are kept at ambient temperature.
0.048(1.2)DIA.
0.040(1.0)
September 20,2018-REV.06
PAGE . 1
BZM55-C2V4 SERIES
RATING AND CHARACTERISTIC CURVES
POWER DISSIPATION, mWatts
500
400
300
200
100
0
50
100
150
200
O
250
AMBIENT TEMPERATURE, C
FIG. 1 POWER DERATING CURVE
Iz (mA)
50
40
30
20
10
0
5
10
15
20
25
Vz (V)
30
Test Current
Iz = 5mA
27
24
22
20
15
12
11
9V1
6V8
5V6
5V1
4V7
4V3
3V9
3V3
2V4
Fig.2 BREAKDOWN CHARACTERISTICS
September 20,2018-REV.06
PAGE . 4
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