BZM5221B SERIES
SURFACE MOUNT ZENER DIODES
VOLTAGE
2.4 to 75 Volts
POWER
500 mWatts
MICRO-MELF
Unit : inch (mm)
FEATURES
• Planar Die construction
• 500mW Power Dissipation
• Ideally Suited for Automated Assembly Processes
.040(1.0)
.048(1.2)DIA.
MECHANICAL DATA
• Case: Molded Glass MICRO-MELF
• Terminals: Solderable per MIL-STD-750, Method 2026
• Polarity: See Diagram Below
• Approx. Weight: 0.008 grams
• Mounting Position: Any
• Packing information
T/R - 2.5K per 7" plastic Reel
.079(2.0)
.071(1.8)
.043(1.1)
.008(0.2)
.008(0.2)
MAXIMUM RATINGS AND ELECTRICAL CHARACTERISTICS
Parameter
Power Dissipation at Tamb = 25
Junction Temperature
Storage Temperature Range
Valid provided that leads at a distance of 8mm from case are kept at ambient temperature.
O
Symbol
Value
500
175
-65 to +175
Units
mW
O
C
P
TOT
T
J
T
S
C
C
O
Parameter
Thermal Resi stance Juncti on to Ambi ent Ai r
Forward Voltage at I
F
= 200mA
Symbol
R
θ
J A
V
F
Min.
--
--
Typ.
--
--
Max.
0.3
1
Uni ts
K/mW
V
Vali d provi ded that leads at a di stance of 8mm from case are kept at ambi ent temperature.
STAD-DEC.22.2008
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PAGE . 1
BZM5221B SERIES
RATING AND CHARACTERISTIC CURVES
POWER DISSIPATION, mWatts
500
400
300
200
100
0
50
100
150
200
O
250
AMBIENT TEMPERATURE, C
FIG. 1 POWER DERATING CURVE
Vz (V)
Iz (mA)
50
40
30
20
10
0
5
10
15
20
25
30
Test Current
Iz = 20mA
5242
5241
5245
5239
5235
5234
5232
5231
5230
5229
5250
5252
5228
5224
Fig.2 BREAKDOWN CHARACTERISTICS
STAD-DEC.22.2008
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PAGE . 4
BZM5221B SERIES
MOUNTING PAD LAYOUT
ORDER INFORMATION
• Packing information
T/R - 10K per 13" plastic Reel
T/R - 2.5K per 7" plastic Reel
LEGAL STATEMENT
Copyright PanJit International, Inc 2008
The information presented in this document is believed to be accurate and reliable. The specifications and information herein
are subject to change without notice. Pan Jit makes no warranty, representation or guarantee regarding the suitability of its
products for any particular purpose. Pan Jit products are not authorized for use in life support devices or systems. Pan Jit
does not convey any license under its patent rights or rights of others.
STAD-DEC.22.2008
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