SCOPE：
This specification applies to the Pb Free Wound Chip Inductors for
MLSF-201212-SERIES
PRODUCT INDENTIFICATION
MLSF- 201212 - 100 K
①
②
③ ④
①
Product Code
②
Dimensions Code
③
Inductance Code
④
Tolerance Code
(1) SHAPES AND DIMENSIONS
B
C
E
A: 2.40 Max.
mm
mm
mm
mm
mm
D
B: 1.65 Max.
C: 1.45 Max.
D: 0.65 Typ.
E: 0.44 Typ.
A
(2) ELECTRICAL SPECIFICATIONS
SEE TABLE 1
TEST INSTRUMENTS
L,Q,SRF : HP 4291B IMPEDANCE ANALYZER (or equivalent)
RDC : CHROMA MODEL 16502 MILLIOHMMETER (or equivalent)
(3) CHARACTERISTICS
(3)-1 Operate temperature range ......
－40℃½＋125℃
(Including self temp. rise)
(3)-2 Storage temperature range ......
－40℃½＋125℃
MAG.LAYERS
MLSF-201212-SERIES
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TABLE 1
MAGLAYERS
PT/NO.
MLSF-201212-R10□
MLSF-201212-R11□
MLSF-201212-R12□
MLSF-201212-R15□
MLSF-201212-R18□
MLSF-201212-R22□
MLSF-201212-R27□
MLSF-201212-R33□
MLSF-201212-R39□
MLSF-201212-R47□
MLSF-201212-R56□
MLSF-201212-R62□
MLSF-201212-R68□
MLSF-201212-R82□
MLSF-201212-R91□
MLSF-201212-1R0□
MLSF-201212-1R2□
MLSF-201212-1R5□
MLSF-201212-1R8□
MLSF-201212-2R2□
MLSF-201212-2R7□
MLSF-201212-3R3□
MLSF-201212-3R9□
MLSF-201212-4R7□
MLSF-201212-5R6□
MLSF-201212-6R8□
MLSF-201212-8R2□
MLSF-201212-100□
MLSF-201212-120□
MLSF-201212-150□
MLSF-201212-180□
MLSF-201212-220□
MLSF-201212-270□
MLSF-201212-330□
MLSF-201212-390□
MLSF-201212-470□
Inductance
L(μH)
0.10
0.11
0.12
0.15
0.18
0.22
0.27
0.33
0.39
0.47
0.56
0.62
0.68
0.82
0.91
1.0
1.2
1.5
1.8
2.2
2.7
3.3
3.9
4.7
5.6
6.8
8.2
10
12
15
18
22
27
33
39
47
Percent
Tolerance
K
K
J,K
J,K
J,K
J,K
J,K
J,K
J,K
J,K
J,K
J,K
J,K
J,K
J,K
J,K
J,K
J,K
J,K
J,K
J,K
J,K
J,K
J,K
J,K
J,K
J,K
J,K
J,K
J,K
J,K
J,K
J,K
J,K
J,K
J,K
Quality
Min.
20
25
25
25
30
30
30
30
30
30
30
30
30
30
30
20
20
25
25
25
25
25
25
25
25
25
25
16
16
16
16
16
16
16
15
13
L,Q Freq.
(MHz)
25
25
25
25
25
25
25
25
25
25
25
25
25
25
25
7.9
7.9
7.9
7.9
7.9
7.9
7.9
7.9
7.9
7.9
7.9
7.9
2.5
2.5
2.5
2.5
2.5
2.5
2.5
2.5
2.5
SRF
(MHz)Min.
1400
1200
1000
1000
1000
830
800
750
700
690
640
640
510
500
500
470
400
400
230
200
130
160
130
120
90
55
40
40
37
30
23
20
19
18
16
13
DCR
(Ω) Max.
0.10
0.10
0.18
0.18
0.20
0.25
0.38
0.35
0.35
0.40
0.40
0.45
0.50
0.50
0.55
0.50
0.75
1.00
1.00
1.05
1.18
1.26
1.75
1.87
2.00
2.15
2.37
2.55
2.80
3.80
4.48
6.30
6.85
7.60
8.20
13.10
Rated DC Current
IDC1(mA)
1700
1700
1500
1400
1400
1350
1300
1200
1160
1100
1040
980
900
900
900
840
800
720
660
600
500
480
440
390
340
300
280
260
220
200
180
160
140
120
100
60
1st
Color
Coding
White
White
Violet
Gray
Black
Brown
Red
Orange
Yellow
Green
Blue
Brown
Violet
Gray
Yellow
White
Black
Brown
Red
Orange
Yellow
Green
Blue
Violet
Gray
White
Black
Brown
Red
Orange
Yellow
Green
Blue
Violet
Gray
White
IDC2(mA)
1150
1150
1020
1000
900
880
770
770
770
610
610
610
550
550
550
550
450
450
420
400
400
400
320
320
270
270
270
250
220
200
180
140
140
120
100
60
※
1.
□
specify the inductance tolerance,J(±5%),K(±10%)
※
2. IDC1： Based on inductance change (△L/L0: drop 10% Max.)@ ambient temp. 25℃
IDC2： Based on temperature rise
(△T：20℃ TYP.)
Rated DC Current： The less value which is IDC1 or IDC2.
3. Color coding is not necessarily same position,
and Color coding non-directional printing
COLOR CODING
MAG.LAYERS
MLSF-201212-SERIES
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(4) RELIABILITY TEST METHOD
MECHANICAL
Item
Solderability
Specifications
The metalized area must have 90%
minimum solder coverage.
Resistance to
soldering heat
There must be no case deformation
or change in dimensions.
Inductance must not change more
than the stated tolerance.
Test conditions
Dip pads in flux and dip in solder pot
(96.5 Sn/3.5 Ag solder) at 255°C ±5°C.
Inductors shall be reflowed onto a PC board
using 96.5 Sn/3.5 Ag solder paste.
Solder process shall be at a maximum
temperature of 260°C.
For 96.5 Sn/3.5 Ag solder paste:>217°C for
90 seconds
Vibration
There must be no case deformation
or change in dimensions.
Inductance must not change more
than the stated tolerance.
Solder specimen inductor on the test printed
circuit board.
Apply vibrations in each of the x,y and z
directions for 2 house for a total of 6 hours.
Frequency
Amplitude
High
temperature
resistance
There must be no case deformation
or change in dimensions.
Inductance must not change more
than the stated tolerance.
: 10~50 Hz
: 1.5mm
Inductors shall be subjected to temperature
125±2℃ for 50±12 hours.
Measure the test items after leaving the
inductors at room temperature and humidity
for 2 hours.
Static
Humidity
Inductors must not have a shorted
or open winding.
Inductors shall be subjected to temperature
85±2℃ and 90 to 95%RH. for ten 24-hours.
Measure the test items after leaving the
inductors at room temperature and humidity
for 2 hours.
Component
adhesion
(push test)
Inductors shall be subjected to
1.8Kg
Inductors shall be reflow soldered (255°C
±5°C for 10 seconds) to a tinned copper
substrate. A force gauge shall be applied
to the side of the component.
The device must withstand the stated force
without a failure of the termination.
MAG.LAYERS
MLSF-201212-SERIES
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MECHANICAL
Item
Low
temperature
storage
Specifications
There must be no case deformation
or change in dimensions.
Inductance must not change more
than the stated tolerance.
Test conditions
Inductors shall be subjected to temperature
-40±2℃ for 48±12 hours.
Measure the test items after leaving the
inductors at room temperature and humidity
for 1 to 2 hours.
Resistance to
solvent
There must be no case deformation,
change in dimensions, or
obliteration of marking.
Thermal
shock
There must be no case deformation
or change in dimensions.
Inductance must not change more
than the stated tolerance.
Inductors shall be subjected to 10 cycles
to the the following temperature cycle:
Inductors must withstand 6 minutes of
alcohol or water.
1 cycle
+125℃
30 min.
30 sec
-40℃
30 min.
Measure the test items after leaving the
inductors at room temperature and humidity
for 2 hours.
MAG.LAYERS
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MLSF-201212-SERIES
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(5) RECOMMENDED SOLDERING CONDITIONS
(Please use this product by reflow soldering)
(5)-1 RECOMMENDED FOOTPRINT
1.02
0.76
1.02
Unit: mm
(5)-2 RECOMMENDED REFLOW PATTERN
Temperature(℃)
300
260
200
150
100
50
Time
1 to 4 min.
10 sec
more than 2 min.
Preheating
Solding
260℃
Natural Cooling
(5)-3 IRON SOLDERING
Use a solder iron of less than 30W when soldering ,do not allow the soldering
iron tip directly touch the Ferrite body outside of terminal electrode.
3 seconds max. at 260℃.
MAG.LAYERS
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