X3 Type
1.65 x 1.25 mm SMD Crystal
FEATURE
- Typical 1.65 x 1.25 x 0.3 mm ultra thin ceramic package.
- 8 mm width Tape & Reel package for automatic assembly.
- Tight tolerance 10 ppm available.
TYPICAL APPLICATION
- Bluetooth, Mobile phone, Wireless LAN.
- Office Automation.
- Audio & Video.
DIMENSION (mm)
[ TOP VIEW ]
1.65
± 0.10
1.25
± 0.10
GND
#4
#3
Actual Size
RoHS Compliant
SOLDER PAD L AYOUT (mm)
1.1
#1
#2
0.3
± 0.10
[ SIDE VIEW ]
GND
[ BOTTOM VIEW ]
#1
0.67
± 0.10
#2
0.37
± 0.10
0.6
#2 and #4 are connected to the cover.
(please connect to ground)
0.7
#4
0.47
± 0.10
#3
ELECTRICAL SPECIFICATION
Parameter
Storage Temp. Range
Standard Frequency
Level of Drive
Shunt Capacitance (C0)
Insulation Resistance
Aging
Min.
-40
Typical
26,40
-
Max.
125
0.8
Unit
C
MHz
μ
W
pF
o
ppm/year
Standard frequencies are frequencies which the crystal has been designed and does not imply a stock position.
EQUIVALENT SERIES RESISTANCE (E. S. R.)
Frequency Range
24 MHz≦ Fo
≦
40 MHz
40 MHz
<
Fo≦54 MHz
-
10
-
-
500MΩ @ DC100V
Ω
-
±
1.0 to
±3.0
200
3.0
-
MODE
A1
A1
E.S.R.
Ω
<150
Ω
<100
Ω
Ω
FREQ. STABILITY vs. TEMP. RANGE
ppm
Temp.( C)
o
FREQ. STABILITY vs. WIDE TEMP. RANGE
±15
ppm
Temp.( C)
o
±5
±10
±15
±20
±30
±50
-10 ~ +60
-20 ~ +70
-40 ~ +85
-40 ~ +105
-40 ~ +125
* O: Available
△:Conditional
X: Not available
* O: Available
△:Conditional
X: Not available
Note: not all combination of options are available. Other specifications may be available upon request.
Specifications subject to change without notice.
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Rev(6)07/2019
13
NXP MCU
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