ESD9B5V
SERIES
ESD PROTECTION DIODE
Features
Small SOD-923 Package
Bi-directional Configurations
Low Leakage
Fast Response Time < 1 ns
Protects One Power or I/O Port
ESD Rating of Class 3 (>16KV) per Human Body Model
ESD Protection to IEC 61000-4-2 Level 4
EFT Protection to IEC 61000-4-4 Level 4
RoHS Compliant in Lead-Free Versions
Applications
Communication Systems & Cellular Phones
Personal Digital Assistant (PDA)
Digital Cameras
Power Supplies
Absolute Maximum Ratings
Parameter
Symbol
Value
Units
IEC 61000-4-2 (ESD)
IEC 61000-4-2 (EFT)
Contact
P
D
R
θJA
T
J
,T
STG
T
L
±8
40
150
400
-55 to 150
260
kV
A
mW
℃/W
℃
℃
Total Power Dissipation on FR-5 Board (Note 1) @ T
A
=25℃
Thermal Resistance, Junction-to-Ambient
Junction and Storage Temperature Range
Lead Solder Temperature – Maximum (10 Second Duration)
Stresses exceeding Maximum Ratings may damage the device. Maximum Rating are stress ratings only.
Functional operation above the Recommended Operating Conditions is not implied. Extended exposure to
stresses above the Recommended Operating Conditions may affect device reliability.
1. FR-5 = 1.0*0.75*0.62 in.
ESD9B5V
Electrical Characteristics
Ratings at 25°C ambient temperature unless otherwise specified.
Symbol
I
PP
V
C
V
RWM
I
R
I
T
V
BR
Parameter
Maximum Reverse Peak Pulse Current
Clamping Voltage @ I
PP
Working Peak Reverse Voltage
Maximum Reverse Leakage Current @ V
RWM
Test Current
Breakdown Voltage @ I
T
Electrical Characteristics
Ratings at 25°C ambient temperature unless otherwise specified.
V
RWM
Device
Device
ESD9B5V
Marking
(V)
Max
5.0
I
R
(uA)
@ V
RWM
Max
1.0
Min
5.8
V
BR
(V) @ I
T
(Note 2)
Max
7.8
1.0
I
T
(mA)
C
(pF)
Max
15
2. V
BR
is measured with a pulse test current IT at an ambient temperature of 25℃
Figure 1. Typical Breakdown Voltage
versus Temperature
Fig 2. Typical Leakage Current versus
Temperature
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