ABS202
THRU
ABS210
Single Phase
2.0
AMP. Glass Passivated Bridge Rectifiers
VOLTAGE RANGE
Thin Mini-Dip
200
to 1000 Volts
CURRENT
2.0
Ampere
Features
Glass passivated junction
Ideal for printed circuit board
Reliable low cost construction utilizing
molded plastic technique
High temperature soldering guaranteed:
260℃ / 10 seconds / 0.375” ( 9.5mm )
lead length at 5 lbs., ( 2.3 kg ) tension
Small size, simple installation
Leads solderable per MIL-STD-202,
Method 208
High surge current capability
ABS
0.252(6.4)
0.177(4.5)
0.169(4.3)
0.236(6.0)
0.010(0.25)
0.006(0.15)
0.002(0.05)
0.006(0.15)
0.059(1.5)
0.008(0.2)
0.174(4.4)
0.150(3.8)
0.059(1.50) MAX.
0.056(1.42)
0.048(1.22)
-----
DETAIL "A", SCALE=20/1
0.006(0.15)
0.002(0.05)
0.21(5.4)
0.193(4.9)
A
0.033(0.85)
0.022(0.55)
Dimensions in inches and (millimeters)
Maximum Ratings and Electrical Characteristics
Rating at 25℃ambient temperature unless otherwise specified.
Single phase, half wave, 60 Hz, resistive or inductive load.
For capacitive load, derate current by 20%
Symbol
ABS202 ABS204 ABS206 ABS208 ABS210
Units
Type Number
Maximum Recurrent Peak Reverse Voltage
Maximum RMS Voltage
Maximum DC Blocking Voltage
Maximum Average Forward Rectified Current
On glass-epoxy P.C.B.
On aluminum substrate
Peak Forward Surge Current, 8.3 ms Single
Half Sine-wave Superimposed on Rated
Load (JEDEC method )
Maximum Instantaneous Forward Voltage
@
1.0A
Maximum DC Reverse Current @ T
A
=25℃
at Rated DC Blocking Voltage
Typical Thermal resistance Junction to Lead
On aluminum substrate
On Glass-Epoxy substrate
Operating Temperature Range
Storage Temperature Range
V
RRM
V
RMS
V
DC
I
(AV)
I
FSM
V
F
I
R
Rθ
JL
Rθ
JA
T
J
T
STG
200
140
200
400
280
400
600
420
600
2.0
48
0.95
5
18
57.5
80
-55 to +150
-55 to +150
800
560
800
1000
700
1000
V
V
V
A
A
V
uA
℃/W
℃
℃
m
m
0~10
O
RATINGS AND CHARACTERISTIC CURVES (ABS202 THRU ABS210)
FIG.1- MAXIMUM FORWARD CURRENT DERATING
CURVE
3.2
2.8
100
FIG.2- TYPICAL REVERSE CHARACTERISTICS
PER BRIDGE ELEMENT
AVERAGE FORWARD CURRENT. (A)
2.4
SIN
2.0
1.6
1.2
0.8
0.4
0
0
20
40
ALUMINA SUBSTRATE
50.8mm X 50.8mm
SOLDERING LAND 1mm X 1mm
CONDUCTOR LAYER 20 mm
SUBSTRATE THICKNESS 0.64mm
INSTANTANEOUS REVERSE CURRENT. ( A)
10
Tj=100
0
C
1
Tj=75
0
C
0.1
Tj=25
0
C
60
80
100
O
120
140
160
AMBIENT TEMPERATURE. ( C)
FIG.3- MAXIMUM NON-REPETITIVE FORWARD
SURGE CURRENT
56
0.01
0
20
40
60
80
100
120
140
PERCENT OF RATED PEAK REVERSE VOLTAGE. (%)
PEAK FORWARD SURGE CURRENT. (A)
48
1000
40
600
32
24
JUNCTION CAPACITANCE.(pF)
FIG.4- TYPICAL JUNCTION CAPACITANCE
I
FSM
10ms 10ms
500
Tj=25
0
C
16
8
0
1 Cycle
Ta=40 C
NON-REPETITIVE,
Single Half Sine-Wave
SINE WAVE,
Method)
(JEDEC
Tj = 25
O
C BEFORE
SURGE CURRENT IS APPLIED
1
10
NUMBER OF CYCLES (CYCLE)
100
400
300
200
100
0
0.1
FIG.5- TYPICAL FORWARD CHARACTERISTICS
50
0.5
1
2
10
50 100
5
20
REVERSE VOLTAGE. (V)
200
500 800
INSTANTANEOUS FORWARD CURRENT. (A)
10
1
0.1
0.0
0.2
0.4
0.6
0.8
1.0
1.2
1.4
1.6
FORWARD VOLTAGE. (V)
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