Pb Free Product
BLM3050K
N-Channel
Enhancement Mode Power MOSFET
Description
The BLM3050K uses advanced trench technology and
design to provide excellent R
DS(ON)
with low gate charge. It
can be used in a wide variety of applications.
General Features
●
V
DS
=30V,I
D
=50A
R
DS(ON)
< 11mΩ @ V
GS
=10V
R
DS(ON)
< 16mΩ @ V
GS
=5V
●
High density cell design for ultra low Rdson
●
Fully characterized Avalanche voltage and current
●
Good stability and uniformity with high E
AS
●
Excellent package for good heat dissipation
●
Special process technology for high ESD capability
Schematic diagram
Application
●
●
Power switching application
Hard switched and high frequency circuits
Marking and pin assignment
●
Uninterruptible Power Supply
100% UIS TESTED!
TO-252-2L top view
Package Marking And Ordering Information
Device Marking
3050K
Device
BLM3050K
Device Package
TO-252-2L
Reel Size
-
Tape width
-
Quantity
-
Absolute Maximum Ratings (TC=25℃unless otherwise noted)
Parameter
Symbol
Drain-Source Voltage
V
DS
Gate-Source Voltage
V
GS
Drain Current-Continuous
Drain Current-Continuous(T
C
=100℃)
Pulsed Drain Current
Maximum Power Dissipation
Derating factor
Single pulse avalanche energy (Note 5)
Operating Junction and Storage Temperature Range
E
AS
Limit
30
±20
50
35
140
60
0.4
70
-55 To 175
Unit
V
V
A
A
A
W
W/℃
mJ
℃
I
D
I
D
(100℃)
I
DM
P
D
T
J
,T
STG
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Pb Free Product
BLM3050K
Thermal Characteristic
Thermal Resistance,Junction-to-Case(Note 2)
R
θJC
2.5
℃
/W
Electrical Characteristics (TC=25℃unless otherwise noted)
Parameter
Symbol
Condition
Off Characteristics
Drain-Source Breakdown Voltage
Zero Gate Voltage Drain Current
Gate-Body Leakage Current
On Characteristics (Note 3)
Gate Threshold Voltage
Drain-Source On-State Resistance
Forward Transconductance
Dynamic Characteristics (Note4)
Input Capacitance
Output Capacitance
Reverse Transfer Capacitance
Switching Characteristics (Note 4)
Turn-on Delay Time
Turn-on Rise Time
Turn-Off Delay Time
Turn-Off Fall Time
Total Gate Charge
Gate-Source Charge
Gate-Drain Charge
Drain-Source Diode Characteristics
Diode Forward Voltage (Note 3)
Diode Forward Current (Note 2)
Reverse Recovery Time
Reverse Recovery Charge
Forward Turn-On Time
Min
30
-
-
1
-
-
15
-
-
-
-
Typ
33
-
-
1.6
8
10
-
2000
280
160
10
8
30
5
23
7
4.5
0.85
-
22
12
Max
-
1
±100
3
11
16
-
-
-
-
-
-
-
-
-
-
-
1.2
40
35
20
Unit
V
μA
nA
V
mΩ
S
PF
PF
PF
nS
nS
nS
nS
nC
nC
nC
V
A
nS
nC
BV
DSS
I
DSS
I
GSS
V
GS(th)
R
DS(ON)
g
FS
C
lss
C
oss
C
rss
t
d(on)
t
r
t
d(off)
t
f
Q
g
Q
gs
Q
gd
V
SD
I
S
t
rr
Qrr
t
on
V
GS
=0V I
D
=250μA
V
DS
=30V,V
GS
=0V
V
GS
=±20V,V
DS
=0V
V
DS
=V
GS
,I
D
=250μA
V
GS
=10V, I
D
=25A
V
GS
=5V, I
D
=20A
V
DS
=5V,I
D
=20A
V
DS
=15V,V
GS
=0V,
F=1.0MHz
V
DD
=15V,I
D
=20A
V
GS
=10V,R
GEN
=1.8Ω
-
-
-
-
-
-
-
-
-
-
V
DS
=10V,I
D
=25A,
V
GS
=10V
V
GS
=0V,I
S
=25A
TJ = 25°C, IF = 40A
di/dt = 100A/μs(Note3)
Intrinsic turn-on time is negligible (turn-on is dominated by LS+LD)
Notes:
1.
Repetitive Rating: Pulse width limited by maximum junction temperature.
2.
Surface Mounted on FR4 Board, t
≤
10 sec.
3.
Pulse Test: Pulse Width
≤
300μs, Duty Cycle
≤
2%.
4.
Guaranteed by design, not subject to production
5.
EAS condition：Tj=25℃, V
DD
=15V,V
G
=10V,L=1mH, Rg=25Ω
Page2
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V2.0
Pb Free Product
BLM3050K
Test circuit
1）E
AS
test Circuits
2）Gate charge test Circuit:
3）Switch Time Test Circuit：
Page3
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Pb Free Product
BLM3050K
Typical Electrical And Thermal Characteristics (Curves)
Normalized On-Resistance
I
D
- Drain Current (A)
Vds Drain-Source Voltage (V)
T
J
-Junction Temperature(℃)
Figure 1 Output Characteristics
Figure 4 Rdson-JunctionTemperature
Vgs Gate-Source Voltage (V)
Vgs Gate-Source Voltage (V)
I
D
- Drain Current (A)
Qg Gate Charge (nC)
Figure 2 Transfer Characteristics
Rdson On-Resistance Normalized
I
s
- Reverse Drain Current (A)
Figure 5 Gate Charge
I
D
- Drain Current (A)
Vsd Source-Drain Voltage (V)
Figure 3 Rdson-
Drain Current
Figure 6 Source- Drain Diode Forward
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Pb Free Product
BLM3050K
C Capacitance (pF)
Normalized BVdss
Vds Drain-Source Voltage (V)
T
J
-Junction Temperature(℃)
Figure 7 Capacitance vs Vds
Figure 9
BV
DSS
vs Junction Temperature
I
D
- Drain Current (A)
Vds Drain-Source Voltage (V)
T
J
-Junction Temperature(℃)
Figure 8
r(t),Normalized Effective
Transient Thermal Impedance
Safe Operation Area
Figure 10
V
GS(th)
vs Junction Temperature
Square Wave Pluse Duration(sec)
Figure 11 Normalized Maximum Transient Thermal Impedance
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