EDB101 THRU EDB106
SINGLE-PHASE GLASS PASSIVATED SUPER FAST SILICON BRIDGE RECTIFIER
REVERSE VOLTAGE:
FORWARD CURRENT:
FEATURES
· Plastic material has Underwriters Laboratory
Flammability Classification 94V-0
· High surge overload rating of 50 Amperes peak
· Ideal for printed circuit board
· Superfast recovery times for high efficiency
· Glass passivated chip junction
50 to 400 VOLTS
1.0 AMPERE
DB-1
MECHANICAL DATA
Case: Molded plastic, DB-1
Epoxy: UL 94V-O rate flame retardant
Terminals: Leads solderable per MIL-STD-202,
method 208 guaranteed
Mounting position: Any
Weight: 0.02ounce, 0.4gram
Dimensions in inches and (millimeters)
Maximum Ratings and Electrical Characteristics
Ratings at 25
℃
ambient temperature unless otherwise specified.
Single phase, half wave, 60H
Z
, resistive or inductive load.
For capacitive load, derate current by 20%.
Symbols
Maximum Recurrent Peak Reverse Voltage
Maximum RMS Voltage
Maximum DC Blocking Voltage
Maximum Average Forward
Rectified Current at T
A
=40℃
Peak Forward Surge Current,
8.3ms single half-sine-wave
superimposed on rated load (JEDEC method)
Maximum Forward Voltage at 1.0A DC and 25℃
Maximum Reverse Current
at Rated DC Blocking Voltage
at T
A
=25℃
T
A
=125℃
V
F
I
R
C
J
T
RR
R
θJA
R
θJL
T
J
，Tstg
I
FSM
V
RRM
V
RMS
V
DC
I
(AV)
EDB101
EDB102
EDB103
EDB104
EDB105
EDB106
Units
Volts
Volts
Volts
Amp
50
35
50
100
70
100
150
105
150
1.0
200
140
200
300
210
300
400
280
400
50
1.05
5.0
1000
15
50
38
12
-55 to +150
1.25
Amp
Volts
uAmp
pF
nS
℃/W
℃/W
℃
Typical Junction Capacitance (Note 1)
Maximum Reverse Recovery Time (Note 3)
Typical Thermal Resistance (Note 2)
Typical Thermal Resistance (Note 2)
Operating and Storage Temperature Range
NOTES:
1- Measured at 1 MH
Z
and applied reverse voltage of 4.0 VDC.
2- Thermal resistance from junction to ambient and from junction to lead mounted on P.C.B. with 0.5 x 0.5" (13 x 13mm) copper pads
3- Reverse Recovery Test Conditions：I
F
=.5A，I
R
=1A，I
RR
=.25A.
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