Fast Page DRAM, 1MX4, 50ns, CMOS, PDSO20, 0.300 INCH, SOJ-26/20
参数名称 | 属性值 |
是否Rohs认证 | 不符合 |
厂商名称 | Integrated Silicon Solution ( ISSI ) |
包装说明 | 0.300 INCH, SOJ-26/20 |
Reach Compliance Code | compli |
ECCN代码 | EAR99 |
访问模式 | FAST PAGE |
最长访问时间 | 50 ns |
其他特性 | RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH |
I/O 类型 | COMMON |
JESD-30 代码 | R-PDSO-J20 |
JESD-609代码 | e0 |
内存密度 | 4194304 bi |
内存集成电路类型 | FAST PAGE DRAM |
内存宽度 | 4 |
功能数量 | 1 |
端口数量 | 1 |
端子数量 | 20 |
字数 | 1048576 words |
字数代码 | 1000000 |
工作模式 | SYNCHRONOUS |
最高工作温度 | 70 °C |
最低工作温度 | |
组织 | 1MX4 |
输出特性 | 3-STATE |
封装主体材料 | PLASTIC/EPOXY |
封装代码 | SOJ |
封装等效代码 | SOJ20/26,.34 |
封装形状 | RECTANGULAR |
封装形式 | SMALL OUTLINE |
电源 | 2.6 V |
认证状态 | Not Qualified |
刷新周期 | 1024 |
自我刷新 | NO |
最大待机电流 | 0.0005 A |
最大压摆率 | 0.075 mA |
最大供电电压 (Vsup) | 2.8 V |
最小供电电压 (Vsup) | 2.4 V |
标称供电电压 (Vsup) | 2.6 V |
表面贴装 | YES |
技术 | CMOS |
温度等级 | COMMERCIAL |
端子面层 | Tin/Lead (Sn/Pb) |
端子形式 | J BEND |
端子节距 | 1.27 mm |
端子位置 | DUAL |
IC41UV4105-50J | IC41UV4105-70J | IC41UV4105-50T | IC41UV4105-100J | IC41UV4105-100T | IC41UV4105-70T | |
---|---|---|---|---|---|---|
描述 | Fast Page DRAM, 1MX4, 50ns, CMOS, PDSO20, 0.300 INCH, SOJ-26/20 | Fast Page DRAM, 1MX4, 70ns, CMOS, PDSO20, 0.300 INCH, SOJ-26/20 | Fast Page DRAM, 1MX4, 50ns, CMOS, PDSO20, 0.300 INCH, TSOP2-26/20 | Fast Page DRAM, 1MX4, 100ns, CMOS, PDSO20, 0.300 INCH, SOJ-26/20 | Fast Page DRAM, 1MX4, 100ns, CMOS, PDSO20, 0.300 INCH, TSOP2-26/20 | Fast Page DRAM, 1MX4, 70ns, CMOS, PDSO20, 0.300 INCH, TSOP2-26/20 |
是否Rohs认证 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 |
厂商名称 | Integrated Silicon Solution ( ISSI ) | Integrated Silicon Solution ( ISSI ) | Integrated Silicon Solution ( ISSI ) | Integrated Silicon Solution ( ISSI ) | Integrated Silicon Solution ( ISSI ) | Integrated Silicon Solution ( ISSI ) |
包装说明 | 0.300 INCH, SOJ-26/20 | 0.300 INCH, SOJ-26/20 | 0.300 INCH, TSOP2-26/20 | 0.300 INCH, SOJ-26/20 | 0.300 INCH, TSOP2-26/20 | 0.300 INCH, TSOP2-26/20 |
Reach Compliance Code | compli | compliant | compliant | compli | compli | compli |
访问模式 | FAST PAGE | FAST PAGE | FAST PAGE | FAST PAGE | FAST PAGE | FAST PAGE |
最长访问时间 | 50 ns | 70 ns | 50 ns | 100 ns | 100 ns | 70 ns |
其他特性 | RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH | RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH | RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH | RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH | RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH | RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH |
I/O 类型 | COMMON | COMMON | COMMON | COMMON | COMMON | COMMON |
JESD-30 代码 | R-PDSO-J20 | R-PDSO-J20 | R-PDSO-G20 | R-PDSO-J20 | R-PDSO-G20 | R-PDSO-G20 |
JESD-609代码 | e0 | e0 | e0 | e0 | e0 | e0 |
内存密度 | 4194304 bi | 4194304 bit | 4194304 bit | 4194304 bi | 4194304 bi | 4194304 bi |
内存集成电路类型 | FAST PAGE DRAM | FAST PAGE DRAM | FAST PAGE DRAM | FAST PAGE DRAM | FAST PAGE DRAM | FAST PAGE DRAM |
内存宽度 | 4 | 4 | 4 | 4 | 4 | 4 |
功能数量 | 1 | 1 | 1 | 1 | 1 | 1 |
端口数量 | 1 | 1 | 1 | 1 | 1 | 1 |
端子数量 | 20 | 20 | 20 | 20 | 20 | 20 |
字数 | 1048576 words | 1048576 words | 1048576 words | 1048576 words | 1048576 words | 1048576 words |
字数代码 | 1000000 | 1000000 | 1000000 | 1000000 | 1000000 | 1000000 |
工作模式 | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS |
最高工作温度 | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C |
组织 | 1MX4 | 1MX4 | 1MX4 | 1MX4 | 1MX4 | 1MX4 |
输出特性 | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE |
封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
封装代码 | SOJ | SOJ | SOP | SOJ | SOP | SOP |
封装等效代码 | SOJ20/26,.34 | SOJ20/26,.34 | TSOP20/26,.36 | SOJ20/26,.34 | TSOP20/26,.36 | TSOP20/26,.36 |
封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
封装形式 | SMALL OUTLINE | SMALL OUTLINE | SMALL OUTLINE | SMALL OUTLINE | SMALL OUTLINE | SMALL OUTLINE |
电源 | 2.6 V | 2.6 V | 2.6 V | 2.6 V | 2.6 V | 2.6 V |
认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
刷新周期 | 1024 | 1024 | 1024 | 1024 | 1024 | 1024 |
自我刷新 | NO | NO | NO | NO | NO | NO |
最大待机电流 | 0.0005 A | 0.0005 A | 0.0005 A | 0.0005 A | 0.0005 A | 0.0005 A |
最大压摆率 | 0.075 mA | 0.065 mA | 0.075 mA | 0.055 mA | 0.055 mA | 0.065 mA |
最大供电电压 (Vsup) | 2.8 V | 2.8 V | 2.8 V | 2.8 V | 2.8 V | 2.8 V |
最小供电电压 (Vsup) | 2.4 V | 2.4 V | 2.4 V | 2.4 V | 2.4 V | 2.4 V |
标称供电电压 (Vsup) | 2.6 V | 2.6 V | 2.6 V | 2.6 V | 2.6 V | 2.6 V |
表面贴装 | YES | YES | YES | YES | YES | YES |
技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
温度等级 | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL |
端子面层 | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
端子形式 | J BEND | J BEND | GULL WING | J BEND | GULL WING | GULL WING |
端子节距 | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm |
端子位置 | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL |
ECCN代码 | EAR99 | - | - | EAR99 | EAR99 | EAR99 |
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