EDITION：A DATE: August 19, 2013
EYJLJ017-SJ
EDITION：SPEC-CAH201308
DATE：2013-08-31
EYANG TECHNOLOGY DEVELOPMENT CO.,LTD
High-voltage Multi-layer Ceramic Chip
Capacitor
SPECIFICATION
Drawn by
Checked by
Approved by（Cachet）
ADD：EYANG Building, 3 Qimin Street, No.2 Langshan Road, North Area,
High-Tech Industrial Park, Nanshan District, Shenzhen, Guangdong, P.R.C
Postcode:518057
TEL：86-0755-86252188
FAX：86-0755-86278303
宇阳科技发展有限公司
EYANG TECHNOLOGY DEVELOPMENT CO.,LTD
1. Scope:
The specifications are applicable to High-voltage Multilayer Ceramic Chip Capacitor (MLCC) as follows
：
Type of Dielectrics：C0G(NP0)、X7R；
Chip Size：0603、0805、1206；
Capacitance：1.5pF~470nF
2. Part Number System:
C 0805 X7R 103 K 101 N T Y
Product
Code:
the
Size Code
（EIA）
0603、
0805、
1206
Type
of
Rated
Capacitance
Eg.：
0R5=0.5pF
103=10000pF
Rated Voltage
101=100V；201=200V；
501=500V；631=630V；
102=1000V；
202=2000V
Termination Type
“N” represents Ag (or Cu)
/Ni/Sn structure
“C” represents Copper
Dielectrics
C0G、X7R
Thickness Code
Details are shown in
Table
1
，
sign of "C"
is
multi-layer
ceramic chip
capacitor
(MLCC)
Capacitance Tolerance
A：±
0.05pF B：±
0.1pF
C：±
0.25 pF
D：±
0.5pF
F：±
1%
G：±
2%
J：±
5%
K：±
10%
L：±
15%
M：±
20%
Z：+80/-20%
Packing Code
Details are shown in
Table 4.
MLCC
L
1
W
L
2
T
L
Figure 1 Configuration and Dimension of MLCC
Table 1
Length（L）
Size of MLCC (Unit: mm)
End width
（L1、L2）
Thickness（T） Thickness of
the code
0603
1.60±
0.10
+0.20
1.60
-0
2.00±
0.10
2.00±
0.20
2.00
+0.2-0.3
3.20±
0.20
3.20±
0.20
3.20±
0.20
0.80±
0.10
+0.20
0.80
-0
1.25±
0.10
1.25±
0.20
1.25
+0.2-0.3
1.60±
0.20
1.60±
0.20
1.60±
0.20
0.15½0.60
0.15½0.60
0.20½0.75
0.20½0.75
0.20½0.75
0.25½0.75
0.25½0.75
0.25½0.75
0.80±
0.10
+0.20
0.80
-0
0.60±
0.10
0.85±
0.15
1.25
+0.2-0.3
0.85±
0.15
1.15±
0.20
1.60±
0.20
D
K
C
Y
H
Y
O
L
Size Code
Width（W）
0805
1206
Table 2
Dielectric characteristics of product category
Type of Dielectrics
Operating Temperature Range Temperature Coefficient or Characteristic
C0G(NP0)
-55℃½+125℃
±
30ppm/℃
X7R
±
15%
-55℃½+125℃
宇阳科技发展有限公司
EYANG TECHNOLOGY DEVELOPMENT CO.,LTD
Size
0603
0805
1206
Table 3 Rated Voltage and Rated Capacitance
Rate Voltage
Capacitance
/U
R
C0G
X7R
2.0pF~1.0nF
—
100V
—
100pF~10nF
2.0pF~220pF
—
200V
270pF~680pF
—
2.0pF~220pF
—
250V
270pF~680pF
—
10pF~330pF
—
100V
390pF~1.8nF
100pF~22nF
2.2nF~4.7nF
27nF~100nF
2.0pF~120pF
—
200V
150pF~220pF
100pF~4.7nF
270pF~2.2nF
5.6pF~22nF
2.0pF~120pF
—
250V
150pF~220pF
100pF~4.7nF
270pF~2.2nF
5.6pF~22nF
—
100pF~3.9nF
500V
—
4.7nF~10nF
—
100pF~3.9nF
630V
—
4.7nF~10nF
2.0pF~4.7nF
150pF~68nF
100V
5.6nF~10nF
82nF~120nF
—
150nF~1.0μF
10pF~1.2nF
—
200V
1.5nF~2.2nF
150pF~27nF
—
33nF~100nF
10pF~1.2nF
—
250V
1.5nF~2.2nF
150pF~27nF
—
33nF~100nF
10pF~470pF
—
500V
560pF~2.2nF
150pF~18nF
—
22nF~33nF
10pF~470pF
—
630V
560pF~2.2nF
150pF~18nF
—
22nF~33nF
10pF~68pF
150pF~4.7nF
1000V
82pF~150pF
5.6nF~10nF
180pF~470pF
—
1.5pF~47pF
150pF~1.0nF
2000V
56pF~100pF
—
120pF~220pF
1.0nF~1.8nF
Thickness code
D
K
D
K
D
K
C
Y
H
C
Y
H
C
Y
H
Y
H
Y
H
Y
O
L
Y
O
L
Y
O
L
Y
O
L
Y
O
L
Y
O
L
Y
O
L
Type of Packing：
Reel Packaging (standard carrier tape disc packaging), single disc smallest package are shown in Table 4.
Table 4
Chip Size
Thickness code
Packing code
Disc size
Carrier Tape type
QTY (Kpcs)
Restricted
Specification
0603
D/K
T
7〃
Paper tape
4
H
P
7〃
Plastic tape
2
0805
H
R
7〃
Plastic tape
3
10nF(103)
22nF(223)
68nF(683)
Packing type
C/Y
T
7〃
Paper tape
4
L
P
7〃
Plastic tape
2
1206
O
R
7〃
Plastic
tape
3
Y
T
7〃
Paper
tape
4
2
宇阳科技发展有限公司
EYANG TECHNOLOGY DEVELOPMENT CO.,LTD
Firstly, putting 5 reels into 1 box,
Secondly, putting 12 boxes maximum into 1 carton . Each carton most outfit 12 boxes
，the
remaining gap site with
the use of lightweight complementary material filled.
The style of packing may be designed according to the
customers’ demands.
3. Specifications and Test Methods:
3.1 Visual Inspection:
3.1.1 Requirement:
no obvious defects on ceramic body and termination.
3.1.2 Test Method:
Microscope 10
×.
3.2 Size:
3.2.1 Requirement:
Configuration and dimension of MLCC are shown in Figure 1 and Table 1.
3.2.2 Test Method:
Gauge, which accuracy is higher than 0.01 mm.
3.3 Operating Environment:
C0G(NP0)、X7R
Temperature: -55℃½+125℃; RH: ≤95%（25℃）
Barometric
pressure:
KPa
½106KPa
86
3.43.4 Electrical Parameters and Test Methods:
Table 5 Specifications and Test Methods of MLCC Electrical Parameter
Table 5 The
No.
1
Item
Capacitance
Specification
Within the specified tolerance
C0G(NP0)：
C≥30pF，tgδ≤10×10
-4
；
C < 30pF，tgδ≤1.0/(400 +20C)；
X7R:
tgδ≤250×10
-4
Test Method
Temperature:18½28℃;
Humidity:
≤RH 80%;
Test Frequency:
（C）
2
Tangent of
Loss Angle/
(tgδ)
C0G(NP0)、
：
C≤1000pF，f=1MHz±
10%；
C>1000pF，f=1KHz±
10%
X7R：
C≤100pF， f=1MHz±
10%；
C>100pF， f=1KHz±
10%
Test voltage:
1.0±
0.2Vrms；
Temperature:
18½28℃；
Humidity:
≤RH 80%；
Voltage:
U
R
≥500V：500V
U
R
＜500V：1.0×
U
R
Duration:
60 ± 5S
100V≤U
R
＜500V：2.0×
U
R
500V≤U
R
≤1000V：1.5× U
R
U
R
＞1000V：1.2×
U
R
Duration:
1 min.
Charge/discharge
exceeds 50mA.
current
not
C0G(NP0):
C≤10nF
时，Ri≥10000MΩ:
3
Insulation
Resistances/
(Ri)
C>10nF
时，Ri×C≥500s；
X7R：
C≤25nF
时，Ri≥10000MΩ
C>25nF
时，Ri×C≥500s
4
Withstanding
Voltage（WV）
No breakdown or flashover during test
Note: Capacitance test instructions of Class 2 ceramic capacitors
When the capacitor initial capacitance is lower than its tolerance value, the test sample need to be heated for 60 ±
5 minutes
at 150
℃
±10
℃.
Recover it, let sit at room temperature for 24± hrs, and then test the capacitance.
2
3
namely to aging test again after its capacitance.
宇阳科技发展有限公司
EYANG TECHNOLOGY DEVELOPMENT CO.,LTD
3.5 Environment Test Specifications and Methods:
Without specific note, the “test method” in Table 6 is based on GB/T 21041/21042 IDT IEC60384-21/22
Table 6
Table 6 Environment Test Specifications and Methods
No.
Item
Temperature
Coefficient of
Capacitance
(α
c
) or
Temperature
Characteristics
Specification
C0G(NP0)：
α
c
≤ ±30ppm/℃ (125℃)；
-72≤α
c
≤+30ppm/℃ ( -55℃)；
(
(It need not be tested for capacitance below 10pF,
as is able to be assured by dielectric materials)
)
X7R：
∆C/C ≤ ±15%
Preliminary
Test Method
Drying
for
16~24hrs
C0G(NP0)，
Special preconditioning for 1hr at 150℃
followed by 24hrs (X7R).
The ranges of capacitance change
compared with the temperature ranges (θ
1
,
25℃, θ
2
) shall be within the specified
ranges.C0G、X7R: θ
1
=-55℃, θ
2
=125℃;
Special preconditioning for 1hr at 150℃
followed by 24hrs (X7R). Preheat the
capacitor at 110 to 140℃for 1 minute.
Immerse the capacitor in an eutectic solder
solution at 260±
5℃ for 10± seconds. The
1
depth of immersion is 10mm.
Recover it, let sit at room temperature for
24±
2hrs C0G(NP0) or 48±
4hrs (X7R), then
observe appearance and measure electrical
characteristics.
1
Visual:
No visible damage and terminations
uncovered shall be less than 25%.
Capacitance Change
:
C0G(NP0):
∆C/C ≤ ±
2.5% or 0.25pF, whichever is
larger;
X7R:
∆C/C≤±
7.5%;
2
Resistance to
Soldering Heat
tgδ and Ri:
meet the initial specification in Table 5
.
Preheat condition (U
R
＞
1000V
products：
Phase
Temperature
Time
1
100-120℃
60 s
2
170-200℃
60 s
Immerse the test capacitor into a methanol
solution containing rosin for 3 to 5 seconds,
preheat it at 80 to 140℃ for 30 to 60
seconds and immerse it into molten solder
of 235±
5℃ for 2± seconds. The depth
0.2
of immersion is 10mm.
Solder the capacitor to the test jig (glass
epoxy boards) shown in Fig. a. Apply a
force in the direction shown in Fig. b.
Bending 1mm at a speed of 1mm/sec and
hold for 5±
1secs, then measure the
capacitance.
b
c
Ø4.5
3
Solderability
75% min. coverage of both terminal electrodes is
soldered evenly and continuously.
外观: 无可见损伤
40
t：0.8mm
Fig: a
4
Bond Strength of
Termination
Capacitance Change:
C0G(NP0):
∆C/C ≤ ±5% or ±0.5pF,witchever is larger；
X7R:
∆C/C ≤ ±12.5%；
20
pressurize
R230
100
50
speed：1.0mm/sec
Flexure≤2
45
45
(Unit: mm)
4
Capacitance meter
metter
Fig. b
MEMS传感器
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