Analog Transmission Interface
参数名称 | 属性值 |
是否Rohs认证 | 符合 |
厂商名称 | Microchip(微芯科技) |
包装说明 | TQFP-48 |
Reach Compliance Code | compli |
Factory Lead Time | 8 weeks |
JESD-30 代码 | S-PQFP-G48 |
JESD-609代码 | e3 |
长度 | 7 mm |
功能数量 | 1 |
端子数量 | 48 |
最高工作温度 | 85 °C |
最低工作温度 | -40 °C |
封装主体材料 | PLASTIC/EPOXY |
封装代码 | HTFQFP |
封装形状 | SQUARE |
封装形式 | FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH |
座面最大高度 | 1.2 mm |
标称供电电压 | 3.3 V |
表面贴装 | YES |
电信集成电路类型 | SLIC |
温度等级 | INDUSTRIAL |
端子面层 | Matte Tin (Sn) |
端子形式 | GULL WING |
端子节距 | 0.5 mm |
端子位置 | QUAD |
宽度 | 7 mm |
LE9530CETCT | LE9530DPQC | LE9530DETC | LE9530CETC | LE9530DETCT | LE9530CPQC | LE9530DPQCT | LE9530CPQCT | |
---|---|---|---|---|---|---|---|---|
描述 | Analog Transmission Interface | Analog Transmission Interface | Analog Transmission Interface | Analog Transmission Interface | Analog Transmission Interface | Analog Transmission Interface | Analog Transmission Interface | Analog Transmission Interface |
是否Rohs认证 | 符合 | 符合 | 符合 | 符合 | 符合 | 符合 | 符合 | 符合 |
厂商名称 | Microchip(微芯科技) | Microchip(微芯科技) | Microchip(微芯科技) | Microchip(微芯科技) | Microchip(微芯科技) | Microchip(微芯科技) | Microchip(微芯科技) | Microchip(微芯科技) |
包装说明 | TQFP-48 | HVQCCN, | HTFQFP, | HTFQFP, | HTFQFP, | HVQCCN, | HVQCCN, | HVQCCN, |
Reach Compliance Code | compli | compliant | compliant | compliant | compliant | compliant | compliant | compliant |
JESD-30 代码 | S-PQFP-G48 | S-XQCC-N48 | S-PQFP-G48 | S-PQFP-G48 | S-PQFP-G48 | S-XQCC-N48 | S-XQCC-N48 | S-XQCC-N48 |
JESD-609代码 | e3 | e3 | e3 | e3 | e3 | e3 | e3 | e3 |
长度 | 7 mm | 7 mm | 7 mm | 7 mm | 7 mm | 7 mm | 7 mm | 7 mm |
功能数量 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
端子数量 | 48 | 48 | 48 | 48 | 48 | 48 | 48 | 48 |
最高工作温度 | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C |
最低工作温度 | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C |
封装主体材料 | PLASTIC/EPOXY | UNSPECIFIED | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | UNSPECIFIED | UNSPECIFIED | UNSPECIFIED |
封装代码 | HTFQFP | HVQCCN | HTFQFP | HTFQFP | HTFQFP | HVQCCN | HVQCCN | HVQCCN |
封装形状 | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE |
封装形式 | FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH | FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH | FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
座面最大高度 | 1.2 mm | 1 mm | 1.2 mm | 1.2 mm | 1.2 mm | 1 mm | 1 mm | 1 mm |
标称供电电压 | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V |
表面贴装 | YES | YES | YES | YES | YES | YES | YES | YES |
电信集成电路类型 | SLIC | SLIC | SLIC | SLIC | SLIC | SLIC | SLIC | SLIC |
温度等级 | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL |
端子面层 | Matte Tin (Sn) | Matte Tin (Sn) | Matte Tin (Sn) | Matte Tin (Sn) | Matte Tin (Sn) | Matte Tin (Sn) | Matte Tin (Sn) | Matte Tin (Sn) |
端子形式 | GULL WING | NO LEAD | GULL WING | GULL WING | GULL WING | NO LEAD | NO LEAD | NO LEAD |
端子节距 | 0.5 mm | 0.5 mm | 0.5 mm | 0.5 mm | 0.5 mm | 0.5 mm | 0.5 mm | 0.5 mm |
端子位置 | QUAD | QUAD | QUAD | QUAD | QUAD | QUAD | QUAD | QUAD |
宽度 | 7 mm | 7 mm | 7 mm | 7 mm | 7 mm | 7 mm | 7 mm | 7 mm |
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