PPJX8808
20V N-Channel Enhancement Mode MOSFET
Voltage
Features
20 V
Current
500mA
SOT-563
Unit : inch(mm)
Low Voltage Drive (1.2V).
Advanced Trench Process Technology
Specially Designed for Switch Load, PWM Application, etc.
ESD Protected
Lead free in compliance with EU RoHS 2011/65/EU
directive.
Green molding compound as per IEC61249 Std.
(Halogen Free)
Mechanical Data
Case: SOT-563 Package
Terminals : Solderable per MIL-STD-750, Method 2026
Approx. Weight: 0.00009 ounces, 0.0026 grams
Marking: X08
Maximum Ratings and Thermal Characteristics
(T
A
=25 C unless otherwise noted)
o
PARAMETER
Drain-Source Voltage
Gate-Source Voltage
Continuous Drain Current
Pulsed Drain Current
Power Dissipation
T
A
=25
o
C
Derate above 25
o
C
SYMBOL
V
DS
V
GS
I
D
I
DM
PD
T
J
,T
STG
R
θJA
LIMIT
UNITS
V
V
mA
mA
mW
mW/
o
C
o
20
+10
500
1000
300
2.8
-55~150
417
o
Operating Junction and Storage Temperature Range
Typical Thermal resistance
-
Junction to Ambient
(Note 3)
C
C/W
May 6,2016-REV.02
Page 1
PPJX8808
Electrical Characteristics
(T
A
=25 C unless otherwise noted)
PARAMETER
Static
Drain-Source Breakdown Voltage
Gate Threshold Voltage
BV
DSS
V
GS(th)
V
GS
=0V,I
D
=250uA
V
DS
=V
GS
,I
D
=250uA
V
GS
=4.5V, I
D
=500mA
V
GS
=2.5V, I
D
=200mA
Drain-Source On-State Resistance
R
DS(on)
V
GS
=1.8V, I
D
=100mA
V
GS
=1.5V, I
D
=50mA
V
GS
=1.2V, I
D
=20mA
Zero Gate Voltage Drain Current
Gate-Source Leakage Current
Dynamic
(Note 5)
o
SYMBOL
TEST CONDITION
MIN.
20
0.3
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
TYP.
-
0.64
310
360
430
510
710
-
+0.5
1.4
0.22
0.21
67
19
6
2.8
20
23
23
MAX.
-
0.9
400
650
800
1200
3000
1
+10
-
-
-
-
-
-
-
-
-
-
UNITS
V
V
mΩ
I
DSS
I
GSS
Q
g
Q
gs
Q
gd
Ciss
Coss
Crss
td
(on)
tr
td
(off)
tf
V
DS
=16V, V
GS
=0V
V
GS
=+8V, V
DS
=0V
uA
uA
Total Gate Charge
Gate-Source Charge
Gate-Drain Charge
Input Capacitance
Output Capacitance
Reverse Transfer Capacitance
Turn-On Delay Time
Turn-On Rise Time
Turn-Off Delay Time
Turn-Off Fall Time
Drain-Source Diode
Maximum Continuous Drain-Source
Diode Forward Current
Diode Forward Voltage
V
DS
=10V, I
D
=500mA,
V
GS
=4.5V
(Note 1,2)
V
DS
=10V, V
GS
=0V,
f=1.0MHZ
V
DD
=10V, I
D
=150mA,
V
GS
=4.0V,
R
G
=10Ω
(Note 1,2)
nC
pF
ns
I
S
V
SD
---
I
S
=500mA, V
GS
=0V
-
-
-
0.87
500
1.3
mA
V
NOTES :
1. Pulse width<300us, Duty cycle<2%
2. Essentially independent of operating temperature typical characteristics.
3. R
JA
is the sum of the junction-to-case and case-to-ambient thermal resistance where the case thermal reference is
defined as the solder mounting surface of the drain pins mounted on a 1 inch FR-4 with 2oz. square pad of copper.
4. The maximum current rating is package limited.
5. Guaranteed by design, not subject to production testing.
May 6,2016-REV.02
Page 2
PPJX8808
TYPICAL CHARACTERISTIC CURVES
Fig.1 On-Region Characteristics
Fig.2 Transfer Characteristics
Fig.3 On-Resistance vs. Drain Current
Fig.4 On-Resistance vs. Junction temperature
Fig.5 On-Resistance Variation with VGS.
Fig.6 Body Diode Characteristics
May 6,2016-REV.02
Page 3
PPJX8808
TYPICAL CHARACTERISTIC CURVES
Fig.7 Gate-Charge Characteristics
Fig.8 Breakdown Voltage Variation vs. Temperature
Fig.9 Threshold Voltage Variation with Temperature
May 6,2016-REV.02
Page 4
PPJX8808
PART NO PACKING CODE VERSION
PART NO PACKING CODE
Package Type
SOT-563
SOT-563
Packing type
8K pcs / 7” reel
20K pcs / 13” reel
Marking
X08
X08
Version
Halogen free
Halogen free
PJX8808_R1_00002
PJX8808_R2_00002
MOUNTING PAD LAYOUT
May 6,2016-REV.02
Page 5
嵌入式系统
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