Synchronous DRAM Module, 64MX72, 6ns, CMOS, DIMM-168
参数名称 | 属性值 |
厂商名称 | Mosel Vitelic Corporation ( MVC ) |
零件包装代码 | DIMM |
包装说明 | DIMM, DIMM168 |
针数 | 168 |
Reach Compliance Code | unknow |
ECCN代码 | EAR99 |
访问模式 | SINGLE BANK PAGE BURST |
最长访问时间 | 6 ns |
其他特性 | AUTO/SELF REFRESH |
最大时钟频率 (fCLK) | 100 MHz |
I/O 类型 | COMMON |
JESD-30 代码 | R-XDMA-N168 |
内存密度 | 4831838208 bi |
内存集成电路类型 | SYNCHRONOUS DRAM MODULE |
内存宽度 | 72 |
功能数量 | 1 |
端口数量 | 1 |
端子数量 | 168 |
字数 | 67108864 words |
字数代码 | 64000000 |
工作模式 | SYNCHRONOUS |
最高工作温度 | 70 °C |
最低工作温度 | |
组织 | 64MX72 |
输出特性 | 3-STATE |
封装主体材料 | UNSPECIFIED |
封装代码 | DIMM |
封装等效代码 | DIMM168 |
封装形状 | RECTANGULAR |
封装形式 | MICROELECTRONIC ASSEMBLY |
电源 | 3.3 V |
认证状态 | Not Qualified |
刷新周期 | 8192 |
自我刷新 | YES |
最大压摆率 | 3.96 mA |
最大供电电压 (Vsup) | 3.6 V |
最小供电电压 (Vsup) | 3 V |
标称供电电压 (Vsup) | 3.3 V |
表面贴装 | NO |
技术 | CMOS |
温度等级 | COMMERCIAL |
端子形式 | NO LEAD |
端子节距 | 1.27 mm |
端子位置 | DUAL |
V437464Q24VATG-10PC | V437464Q24VBTG-10PC | V437464Q24VBTG-75 | V437464Q24VBTG-75PC | V437464Q24VATG-75 | V437464Q24VATG-75PC | |
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描述 | Synchronous DRAM Module, 64MX72, 6ns, CMOS, DIMM-168 | Synchronous DRAM Module, 64MX72, 6ns, CMOS, DIMM-168 | Synchronous DRAM Module, 64MX72, 5.4ns, CMOS, DIMM-168 | Synchronous DRAM Module, 64MX72, 5.4ns, CMOS, DIMM-168 | Synchronous DRAM Module, 64MX72, 5.4ns, CMOS, DIMM-168 | Synchronous DRAM Module, 64MX72, 5.4ns, CMOS, DIMM-168 |
厂商名称 | Mosel Vitelic Corporation ( MVC ) | Mosel Vitelic Corporation ( MVC ) | Mosel Vitelic Corporation ( MVC ) | Mosel Vitelic Corporation ( MVC ) | Mosel Vitelic Corporation ( MVC ) | Mosel Vitelic Corporation ( MVC ) |
零件包装代码 | DIMM | DIMM | DIMM | DIMM | DIMM | DIMM |
包装说明 | DIMM, DIMM168 | DIMM, DIMM168 | DIMM, DIMM168 | DIMM, DIMM168 | DIMM, DIMM168 | DIMM, DIMM168 |
针数 | 168 | 168 | 168 | 168 | 168 | 168 |
Reach Compliance Code | unknow | unknown | unknown | unknown | unknown | unknow |
ECCN代码 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 |
访问模式 | SINGLE BANK PAGE BURST | SINGLE BANK PAGE BURST | SINGLE BANK PAGE BURST | SINGLE BANK PAGE BURST | SINGLE BANK PAGE BURST | SINGLE BANK PAGE BURST |
最长访问时间 | 6 ns | 6 ns | 5.4 ns | 5.4 ns | 5.4 ns | 5.4 ns |
其他特性 | AUTO/SELF REFRESH | AUTO/SELF REFRESH | AUTO/SELF REFRESH | AUTO/SELF REFRESH | AUTO/SELF REFRESH | AUTO/SELF REFRESH |
最大时钟频率 (fCLK) | 100 MHz | 100 MHz | 133 MHz | 133 MHz | 133 MHz | 133 MHz |
I/O 类型 | COMMON | COMMON | COMMON | COMMON | COMMON | COMMON |
JESD-30 代码 | R-XDMA-N168 | R-XDMA-N168 | R-XDMA-N168 | R-XDMA-N168 | R-XDMA-N168 | R-XDMA-N168 |
内存密度 | 4831838208 bi | 4831838208 bit | 4831838208 bit | 4831838208 bit | 4831838208 bit | 4831838208 bi |
内存集成电路类型 | SYNCHRONOUS DRAM MODULE | SYNCHRONOUS DRAM MODULE | SYNCHRONOUS DRAM MODULE | SYNCHRONOUS DRAM MODULE | SYNCHRONOUS DRAM MODULE | SYNCHRONOUS DRAM MODULE |
内存宽度 | 72 | 72 | 72 | 72 | 72 | 72 |
功能数量 | 1 | 1 | 1 | 1 | 1 | 1 |
端口数量 | 1 | 1 | 1 | 1 | 1 | 1 |
端子数量 | 168 | 168 | 168 | 168 | 168 | 168 |
字数 | 67108864 words | 67108864 words | 67108864 words | 67108864 words | 67108864 words | 67108864 words |
字数代码 | 64000000 | 64000000 | 64000000 | 64000000 | 64000000 | 64000000 |
工作模式 | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS |
最高工作温度 | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C |
组织 | 64MX72 | 64MX72 | 64MX72 | 64MX72 | 64MX72 | 64MX72 |
输出特性 | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE |
封装主体材料 | UNSPECIFIED | UNSPECIFIED | UNSPECIFIED | UNSPECIFIED | UNSPECIFIED | UNSPECIFIED |
封装代码 | DIMM | DIMM | DIMM | DIMM | DIMM | DIMM |
封装等效代码 | DIMM168 | DIMM168 | DIMM168 | DIMM168 | DIMM168 | DIMM168 |
封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
封装形式 | MICROELECTRONIC ASSEMBLY | MICROELECTRONIC ASSEMBLY | MICROELECTRONIC ASSEMBLY | MICROELECTRONIC ASSEMBLY | MICROELECTRONIC ASSEMBLY | MICROELECTRONIC ASSEMBLY |
电源 | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V |
认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
刷新周期 | 8192 | 8192 | 8192 | 8192 | 8192 | 8192 |
自我刷新 | YES | YES | YES | YES | YES | YES |
最大压摆率 | 3.96 mA | 3.96 mA | 4.32 mA | 4.32 mA | 4.32 mA | 4.32 mA |
最大供电电压 (Vsup) | 3.6 V | 3.6 V | 3.6 V | 3.6 V | 3.6 V | 3.6 V |
最小供电电压 (Vsup) | 3 V | 3 V | 3 V | 3 V | 3 V | 3 V |
标称供电电压 (Vsup) | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V |
表面贴装 | NO | NO | NO | NO | NO | NO |
技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
温度等级 | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL |
端子形式 | NO LEAD | NO LEAD | NO LEAD | NO LEAD | NO LEAD | NO LEAD |
端子节距 | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm |
端子位置 | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL |
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