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WL608G3-B02-TR: 产品描述PCB Connector; 产品类别连接器连接器; 文件大小68KB，共1页; 制造商富士康(FOXCONN); 官网地址http://www.fit-foxconn.com/

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WL608G3-B02-TR概述

PCB Connector

WL608G3-B02-TR规格参数

参数名称	属性值
是否无铅	含铅
是否Rohs认证	不符合
厂商名称	富士康(FOXCONN)
Reach Compliance Code	unknow
连接器类型	PCB CONNECTOR
联系完成配合	GOLD (30)
触点材料	COPPER ALLOY
DIN 符合性	NO
IEC 符合性	NO
MIL 符合性	NO
制造商序列号	WL
选件	GENERAL PURPOSE

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SPECIFICATIONS

SIM card Conn.

WL Series

SIM Card, SMT Type

1.50mm [.059”] Height

6 Pos.

Mechanical

Normal Force:

0.3N min

Durability:

5000 Cycles

Electrical

Voltage Rating:

15 V max

Current Rating:

0.5 A

Contact Resistance:

100 m

Ω

max at 10mA.

Dielectric Withstanding Voltage:

540V AC/1 min.

Insulation Resistance:

1000 M

Ω

min (initial), 100 M

Ω

min (final),

Physical

Insert molding:

THERMOPLASTIC UL 94V-0, Color Black

Contact:

Copper Alloy

Plating:

See “ORDERING INFORMATION”

Operating Temperature:

-30

℃

to +85

℃

DRAWING

ORDERING

I N FO R M ATIO N

3- B02 -TR

Package And Solder Tail Type

T = Tray

TR= Tape & Reel

1F= Tray (Lead Free)

7F= Tape & Reel (Lead Free)

PRODUCT NO.: WL 6 15 A

SIM Card Conn.

No. Contact

6= 6 Pin

8= 8 Pin

Modification Code

Code No.: 2 or 3 Code(A~Z or 0~9)

Body Height

05= 2.5mm

06=2.6mm

07=0.7mm

08=2.8mm

10=1.0mm

11=1.1mm

90=9.0mm

Upper Cover Type

Contact Area Plating Thickness

1= Gold Flash

2= 20u" Gold Plating

3= 30u" Gold Plating

6= 10u" Gold Plating

7= 15u" Gold Plating

A= 10u" Pd/Ni +Gold Plating

B= 20u" Pd/Ni +Gold Plating

C= 30u" Pd/Ni +Gold Plating

D= 40u" Pd/Ni +Gold Plating

L= 25u" Pd/Ni +Gold Plating

A= Upper Cover B= Slider In Type

C= Hinge Type

D= Metal Hook or Cover Type

E= Metal Cover with Push-Push F= Pogo Pin Type

G= Metal Cover with Inject&Door H= Compression Type

All specification & dimensions are subject to change, please call your nearest Foxconn sales representative for update information.

WL608G3-B02-TR

WL608G3-B02-TR概述

WL608G3-B02-TR规格参数

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