DATA SHEET
MMBD6100
SURFACE MOUNT SWITCHING DIODES
VOLTAGE
FEATURES
• Dual, common cathode configuration
• Very fast reverse recovery ( Trr< 2.0ns typical )
• Low capacitance ( < 2.5pF @ 0V)
• Surface mount package ideally suited for anuomatic insetion
• Lead free in comply with EU RoHS
2011/65/EU
directives.
• Green molding compound as per IEC61249 Std. . (Halogen Free)
0.120(3.04)
0.110(2.80)
80 Volts
POWER
225mWatts
0.056(1.40)
0.047(1.20)
MECHANICAL DATA
Case: SOT-23 plastic
Terminals : Solderable per MIL-STD-750,Method 2026
Approx weight : 0.0084 gram
Marking : T4
0.079(2.00)
0.070(1.80)
0.008(0.20)
0.003(0.08)
0.004(0.10)
0.000(0.00)
0.020(0.50)
0.013(0.35)
0.044(1.10)
0.035(0.90)
ABSOLUTE RATINGS
VALUE
80
80
0.2
4.0
UNITS
V
V
A
A
PARAMETER
Maximum Reverse Voltage
Peak Reverse Voltage
Continuous Forward Current
Non-repetitive Peak Forward Surge Current at t=1.0
µs
SYMBOL
V
R
V
RRM
I
F
I
FSM
THERMAL CHARACTERISTICS
PARAMETER
Power Dissipation
(1 )
Thermal Resistance, Junction to Ambient
Junction Temperature
Storage Temperature
(1 )
SYMBOL
VALUE
225
556
-50 to 150
-50 to 150
UNITS
mW
O
P
TOT
R
ΘJA
T
J
T
STG
C/W
O
O
C
C
COMMON CATHODE
NOTE:
1. FR-4 Board=70 x 60 x 1mm.
REV.0.1-FEB.11.2009
PAGE . 1
ELECTRICAL CHARACTERISTICS
(T =25 C , unless otherwise noted)
J
O
PARAMETER
Reverse Breakdown Voltage
Reverse Current
Forward Voltage
Total Capacitance
Reverse Recovery Time (Figure 1)
SYMBOL
TEST CONDITIONS
I
R
=100
µA
V
R
=50V
I
F
=1mA
I
F
=100mA
V
R
=0V, f =1MHz
I
F
=I
R
=10mA, R
L
=100
Ω
MIN.
80
-
-
-
-
-
TYP.
-
-
-
-
-
MAX.
-
100
0.7
1.1
2.5
4.0
UNITS
V
nA
V
pF
ns
V
BR
I
R
V
F
C
T
trr
REV.0.1-FEB.11.2009
PAGE . 2
ELECTRICAL CHARACTERISTIC CURVES (each diode)
10.000
T
J
= 150 °C
Reverse Leakage Current, I
R
(uA)
100
T
J
= 150 °C
Forward Current, I
F
(mA)
1.000
10
T
J
= 25 °C
T
J
= 75 °C
1
T
J
= -25 °C
0.1
0.100
T
J
= 75 °C
0.010
T
J
= 25 °C
0.001
0
20
40
Reverse Voltage, V
R
(V)
60
80
0.0
0.2
0.4
0.6
0.8
1.0
1.2
Forward Voltage, V
F
(V)
Fig. 2. Reverse Current vs. Reverse Voltage
ig. 3. Forward Current vs. Forward Voltage
2.5
2
Capacitance (pF)
1.5
1
0.5
0
0
10
20
30
40
50
60
70
80
Reverse Voltage, V
R
(V)
Fig. 4. Capacitance vs. Reverse Voltage
REV.0.1-FEB.11.2009
PAGE . 3
MOUNTING PAD LAYOUT
0.031 MIN.
(0.80) MIN.
0.037
(0.95)
0.043
(1.10)
0.106
(2.70)
ORDER INFORMATION
• Packing information
T/R - 12K per 13" plastic Reel
T/R - 3K per 7” plastic Reel
REV.0.1-FEB.11.2009
PAGE . 4
Part No_packing code_Version
MMBD6100_R1_00001
MMBD6100_R2_00001
For example :
RB500V-40_R2_00001
Part No.
Serial number
Version code means HF
Packing size code means 13"
Packing type means T/R
Packing Code
XX
Packing type
Tape and Ammunition Box
(T/B)
Tape and Reel
(T/R)
Bulk Packing
(B/P)
Tube Packing
(T/P)
Tape and Reel (Right Oriented)
(TRR)
Tape and Reel (Left Oriented)
(TRL)
FORMING
1
st
Code
A
R
B
T
S
L
F
Packing size code
N/A
7"
13"
26mm
52mm
PANASERT T/B CATHODE UP
(PBCU)
PANASERT T/B CATHODE DOWN
(PBCD)
Version Code
XXXXX
2
nd
Code
HF or RoHS
1
st
Code 2
nd
~5
th
Code
0
1
2
X
Y
U
D
HF
RoHS
0
1
serial number
serial number
REV.0.1-FEB.11.2009
PAGE . 5
详细参数
全文预览
FPGA/CPLD
京公网安备 11010802033920号
Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved
电子工程世界
