Standard SRAM, 64KX16, 25ns, CMOS, PDSO44, 0.400 INCH, PLASTIC, TSOP-50/44
参数名称 | 属性值 |
厂商名称 | Micron Technology |
零件包装代码 | TSOP |
包装说明 | TSOP2, |
针数 | 50/44 |
Reach Compliance Code | unknown |
ECCN代码 | EAR99 |
最长访问时间 | 25 ns |
JESD-30 代码 | R-PDSO-G44 |
JESD-609代码 | e3 |
长度 | 20.96 mm |
内存密度 | 1048576 bit |
内存集成电路类型 | STANDARD SRAM |
内存宽度 | 16 |
功能数量 | 1 |
端口数量 | 1 |
端子数量 | 44 |
字数 | 65536 words |
字数代码 | 64000 |
工作模式 | ASYNCHRONOUS |
最高工作温度 | 70 °C |
最低工作温度 | |
组织 | 64KX16 |
可输出 | YES |
封装主体材料 | PLASTIC/EPOXY |
封装代码 | TSOP2 |
封装形状 | RECTANGULAR |
封装形式 | SMALL OUTLINE, THIN PROFILE |
并行/串行 | PARALLEL |
认证状态 | Not Qualified |
座面最大高度 | 1.2 mm |
最大供电电压 (Vsup) | 3.63 V |
最小供电电压 (Vsup) | 3 V |
标称供电电压 (Vsup) | 3.3 V |
表面贴装 | YES |
技术 | CMOS |
温度等级 | COMMERCIAL |
端子面层 | MATTE TIN |
端子形式 | GULL WING |
端子节距 | 0.8 mm |
端子位置 | DUAL |
宽度 | 10.16 mm |
MT5LC64K16D4TG-25TR | MT5LC64K16D4DJ-20 | MT5LC64K16D4DJ-25TR | MT5LC64K16D4TG-20 | MT5LC64K16D4TG-20TR | MT5LC64K16D4DJ-20TR | MT5LC64K16D4DJ-25 | |
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描述 | Standard SRAM, 64KX16, 25ns, CMOS, PDSO44, 0.400 INCH, PLASTIC, TSOP-50/44 | Standard SRAM, 64KX16, 20ns, CMOS, PDSO44, 0.400 INCH, PLASTIC, SOJ-44 | Standard SRAM, 64KX16, 25ns, CMOS, PDSO44, 0.400 INCH, PLASTIC, SOJ-44 | Standard SRAM, 64KX16, 20ns, CMOS, PDSO44, 0.400 INCH, PLASTIC, TSOP-50/44 | Standard SRAM, 64KX16, 20ns, CMOS, PDSO44, 0.400 INCH, PLASTIC, TSOP-50/44 | Standard SRAM, 64KX16, 20ns, CMOS, PDSO44, 0.400 INCH, PLASTIC, SOJ-44 | Standard SRAM, 64KX16, 25ns, CMOS, PDSO44, 0.400 INCH, PLASTIC, SOJ-44 |
厂商名称 | Micron Technology | Micron Technology | Micron Technology | Micron Technology | Micron Technology | Micron Technology | Micron Technology |
零件包装代码 | TSOP | SOJ | SOJ | TSOP | TSOP | SOJ | SOJ |
包装说明 | TSOP2, | 0.400 INCH, PLASTIC, SOJ-44 | SOJ, | 0.400 INCH, PLASTIC, TSOP-50/44 | TSOP2, | SOJ, | 0.400 INCH, PLASTIC, SOJ-44 |
针数 | 50/44 | 44 | 44 | 50/44 | 50/44 | 44 | 44 |
Reach Compliance Code | unknown | _compli | unknown | unknown | unknown | unknow | _compli |
ECCN代码 | EAR99 | 3A991.B.2.B | EAR99 | 3A991.B.2.B | 3A991.B.2.B | 3A991.B.2.B | EAR99 |
最长访问时间 | 25 ns | 20 ns | 25 ns | 20 ns | 20 ns | 20 ns | 25 ns |
JESD-30 代码 | R-PDSO-G44 | R-PDSO-J44 | R-PDSO-J44 | R-PDSO-G44 | R-PDSO-G44 | R-PDSO-J44 | R-PDSO-J44 |
长度 | 20.96 mm | 28.6 mm | 28.6 mm | 20.96 mm | 20.96 mm | 28.6 mm | 28.6 mm |
内存密度 | 1048576 bit | 1048576 bi | 1048576 bit | 1048576 bit | 1048576 bit | 1048576 bi | 1048576 bi |
内存集成电路类型 | STANDARD SRAM | STANDARD SRAM | STANDARD SRAM | STANDARD SRAM | STANDARD SRAM | STANDARD SRAM | STANDARD SRAM |
内存宽度 | 16 | 16 | 16 | 16 | 16 | 16 | 16 |
功能数量 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
端口数量 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
端子数量 | 44 | 44 | 44 | 44 | 44 | 44 | 44 |
字数 | 65536 words | 65536 words | 65536 words | 65536 words | 65536 words | 65536 words | 65536 words |
字数代码 | 64000 | 64000 | 64000 | 64000 | 64000 | 64000 | 64000 |
工作模式 | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS |
最高工作温度 | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C |
组织 | 64KX16 | 64KX16 | 64KX16 | 64KX16 | 64KX16 | 64KX16 | 64KX16 |
可输出 | YES | YES | YES | YES | YES | YES | YES |
封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
封装代码 | TSOP2 | SOJ | SOJ | TSOP2 | TSOP2 | SOJ | SOJ |
封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
封装形式 | SMALL OUTLINE, THIN PROFILE | SMALL OUTLINE | SMALL OUTLINE | SMALL OUTLINE, THIN PROFILE | SMALL OUTLINE, THIN PROFILE | SMALL OUTLINE | SMALL OUTLINE |
并行/串行 | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL |
认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
座面最大高度 | 1.2 mm | 3.76 mm | 3.76 mm | 1.2 mm | 1.2 mm | 3.76 mm | 3.76 mm |
最大供电电压 (Vsup) | 3.63 V | 3.63 V | 3.63 V | 3.63 V | 3.63 V | 3.63 V | 3.63 V |
最小供电电压 (Vsup) | 3 V | 3 V | 3 V | 3 V | 3 V | 3 V | 3 V |
标称供电电压 (Vsup) | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V |
表面贴装 | YES | YES | YES | YES | YES | YES | YES |
技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
温度等级 | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL |
端子形式 | GULL WING | J BEND | J BEND | GULL WING | GULL WING | J BEND | J BEND |
端子节距 | 0.8 mm | 1.27 mm | 1.27 mm | 0.8 mm | 0.8 mm | 1.27 mm | 1.27 mm |
端子位置 | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL |
宽度 | 10.16 mm | 10.21 mm | 10.21 mm | 10.16 mm | 10.16 mm | 10.21 mm | 10.21 mm |
JESD-609代码 | e3 | e0 | - | e0 | e3 | - | e0 |
端子面层 | MATTE TIN | Tin/Lead (Sn/Pb) | - | Tin/Lead (Sn/Pb) | MATTE TIN | - | Tin/Lead (Sn/Pb) |
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