Inverter, CMOS, PDSO14,
参数名称 | 属性值 |
是否Rohs认证 | 不符合 |
厂商名称 | RCA |
包装说明 | SOP, SOP14,.25 |
Reach Compliance Code | unknown |
JESD-30 代码 | R-PDSO-G14 |
JESD-609代码 | e0 |
负载电容(CL) | 50 pF |
逻辑集成电路类型 | INVERTER |
最大I(ol) | 0.004 A |
端子数量 | 14 |
最高工作温度 | 85 °C |
最低工作温度 | -40 °C |
封装主体材料 | PLASTIC/EPOXY |
封装代码 | SOP |
封装等效代码 | SOP14,.25 |
封装形状 | RECTANGULAR |
封装形式 | SMALL OUTLINE |
电源 | 2/6 V |
Prop。Delay @ Nom-Sup | 34 ns |
认证状态 | Not Qualified |
施密特触发器 | YES |
表面贴装 | YES |
技术 | CMOS |
温度等级 | INDUSTRIAL |
端子面层 | Tin/Lead (Sn/Pb) |
端子形式 | GULL WING |
端子节距 | 1.27 mm |
端子位置 | DUAL |
CD74HC14M | CD74HCT14H | CD54HC14F | CD54HC14H | CD74HC14H | CD54HCT14F | CD74HC14E | CD54HCT14H | CD74HCT14E | CD74HCT14M | |
---|---|---|---|---|---|---|---|---|---|---|
描述 | Inverter, CMOS, PDSO14, | Inverter, CMOS, | Inverter, CMOS, CDIP14, | Inverter, CMOS, | Inverter, CMOS, | Inverter, CMOS, CDIP14, | Inverter, CMOS, PDIP14, | Inverter, CMOS, | Inverter, CMOS, PDIP14, | Inverter, CMOS, PDSO14, |
厂商名称 | RCA | RCA | RCA | RCA | RCA | RCA | RCA | RCA | RCA | RCA |
包装说明 | SOP, SOP14,.25 | , DIE OR CHIP | DIP, DIP14,.3 | , DIE OR CHIP | , DIE OR CHIP | DIP, DIP14,.3 | DIP, DIP14,.3 | , DIE OR CHIP | DIP, DIP14,.3 | SOP, SOP14,.25 |
Reach Compliance Code | unknown | unknown | unknown | unknown | unknown | unknown | unknown | unknow | unknow | unknow |
负载电容(CL) | 50 pF | 50 pF | 50 pF | 50 pF | 50 pF | 50 pF | 50 pF | 50 pF | 50 pF | 50 pF |
逻辑集成电路类型 | INVERTER | INVERTER | INVERTER | INVERTER | INVERTER | INVERTER | INVERTER | INVERTER | INVERTER | INVERTER |
最大I(ol) | 0.004 A | 0.004 A | 0.004 A | 0.004 A | 0.004 A | 0.004 A | 0.004 A | 0.004 A | 0.004 A | 0.004 A |
最高工作温度 | 85 °C | 85 °C | 125 °C | 125 °C | 85 °C | 125 °C | 85 °C | 125 °C | 85 °C | 85 °C |
最低工作温度 | -40 °C | -40 °C | -55 °C | -55 °C | -40 °C | -55 °C | -40 °C | -55 °C | -40 °C | -40 °C |
封装等效代码 | SOP14,.25 | DIE OR CHIP | DIP14,.3 | DIE OR CHIP | DIE OR CHIP | DIP14,.3 | DIP14,.3 | DIE OR CHIP | DIP14,.3 | SOP14,.25 |
电源 | 2/6 V | 5 V | 2/6 V | 2/6 V | 2/6 V | 5 V | 2/6 V | 5 V | 5 V | 5 V |
认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
施密特触发器 | YES | YES | YES | YES | YES | YES | YES | YES | YES | YES |
技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
温度等级 | INDUSTRIAL | INDUSTRIAL | MILITARY | MILITARY | INDUSTRIAL | MILITARY | INDUSTRIAL | MILITARY | INDUSTRIAL | INDUSTRIAL |
是否Rohs认证 | 不符合 | - | 不符合 | - | - | 不符合 | 不符合 | - | 不符合 | 不符合 |
JESD-30 代码 | R-PDSO-G14 | - | R-XDIP-T14 | - | - | R-XDIP-T14 | R-PDIP-T14 | - | R-PDIP-T14 | R-PDSO-G14 |
JESD-609代码 | e0 | - | e0 | - | - | e0 | e0 | - | e0 | e0 |
端子数量 | 14 | - | 14 | - | - | 14 | 14 | - | 14 | 14 |
封装主体材料 | PLASTIC/EPOXY | - | CERAMIC | - | - | CERAMIC | PLASTIC/EPOXY | - | PLASTIC/EPOXY | PLASTIC/EPOXY |
封装代码 | SOP | - | DIP | - | - | DIP | DIP | - | DIP | SOP |
封装形状 | RECTANGULAR | - | RECTANGULAR | - | - | RECTANGULAR | RECTANGULAR | - | RECTANGULAR | RECTANGULAR |
封装形式 | SMALL OUTLINE | - | IN-LINE | - | - | IN-LINE | IN-LINE | - | IN-LINE | SMALL OUTLINE |
Prop。Delay @ Nom-Sup | 34 ns | 48 ns | 41 ns | 41 ns | 34 ns | 57 ns | 34 ns | - | - | - |
表面贴装 | YES | - | NO | - | - | NO | NO | - | NO | YES |
端子面层 | Tin/Lead (Sn/Pb) | - | Tin/Lead (Sn/Pb) | - | - | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | - | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
端子形式 | GULL WING | - | THROUGH-HOLE | - | - | THROUGH-HOLE | THROUGH-HOLE | - | THROUGH-HOLE | GULL WING |
端子节距 | 1.27 mm | - | 2.54 mm | - | - | 2.54 mm | 2.54 mm | - | 2.54 mm | 1.27 mm |
端子位置 | DUAL | - | DUAL | - | - | DUAL | DUAL | - | DUAL | DUAL |
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