This specification applies to the Pb Free Wound Chip Inductors
for MLCF-161008-SERIES
PRODUCT INDENTIFICATION
MLCF- 161008 - 3R3 K -
□□
①
②
③ ④
⑤
①
Product Code
②
Dimensions Code
③
Inductance Code
④
Tolerance Code
⑤
Inner Control Code
(1) SHAPES AND DIMENSIONS
A: 1.80 Max.
B: 1.20 Max.
C: 1.10 Max.
D: 0.45 Ref.
E: 0.33± 0.1
mm
mm
mm
mm
mm
(2) ELECTRICAL SPECIFICATIONS
SEE TABLE 1
TEST INSTRUMENTS
L,Q,SRF : HP 4291B IMPEDANCE ANALYZER (or equivalent)
RDC : CHROMA MODEL 16502 MILLIOHMMETER (or equivalent)
(3) CHARACTERISTICS
(3)-1 Operate temperature range ......
－40℃½＋125℃
(Including self temp. rise)
(3)-2 Storage temperature range ......
－40℃½＋125℃
MAG.LAYERS
MLCF-161008-SERIES
Page 1/8
TABLE 1
MAGLAYERS
PT/NO.
MLCF-161008-47N□
MLCF-161008-51N□
MLCF-161008-56N□
MLCF-161008-68N□
MLCF-161008-72N□
MLCF-161008-R10□
MLCF-161008-R12□
MLCF-161008-R15□
MLCF-161008-R18□
MLCF-161008-R22□
MLCF-161008-R24□
MLCF-161008-R27□
MLCF-161008-R33□
MLCF-161008-R36□
MLCF-161008-R39□
MLCF-161008-R47□
MLCF-161008-R56□
MLCF-161008-R65□
MLCF-161008-R68□
MLCF-161008-R78□
MLCF-161008-R82□
MLCF-161008-R90□
MLCF-161008-1R0□
MLCF-161008-1R2□
MLCF-161008-1R5□
MLCF-161008-1R8□
MLCF-161008-2R2□
MLCF-161008-2R7□
MLCF-161008-3R0□
MLCF-161008-3R3□
MLCF-161008-3R9□
MLCF-161008-4R7□
MLCF-161008-5R6□
MLCF-161008-6R8□
MLCF-161008-7R8□
MLCF-161008-8R2□
MLCF-161008-100□
Inductance
L(μH)
0.047
0.051
0.056
0.068
0.072
0.10
0.12
0.15
0.18
0.22
0.24
0.27
0.33
0.36
0.39
0.47
0.56
0.65
0.68
0.78
0.82
0.90
1.0
1.2
1.5
1.8
2.2
2.7
3.0
3.3
3.9
4.7
5.6
6.8
7.8
8.2
10
Percent
Tolerance
K
J
J
K
K
K
J,K
J,K
J,K
J,K
J,K
J,K
J,K
J,K
J,K
J,K
J,K
J,K
J,K
J,K
J,K
J,K
J,K
J,K
J,K
J,K
J,K
J,K
J,K
J,K
J,K
J,K
J,K
J,K
J,K
J,K
J,K
Quality
Min.
12
12
7
10
12
12
12
15
15
15
15
15
15
15
15
15
15
15
15
15
15
15
15
15
15
15
15
15
15
15
15
15
15
15
15
15
15
L,Q Freq.
(MHz)
7.9
7.9
7.9
7.9
7.9
7.9
7.9
7.9
7.9
7.9
7.9
7.9
7.9
7.9
7.9
7.9
7.9
7.9
7.9
7.9
7.9
7.9
7.9
7.9
7.9
7.9
7.9
7.9
7.9
7.9
7.9
7.9
7.9
7.9
7.9
7.9
7.9
SRF
(MHz)Min.
2000
1500
1500
1500
1500
1150
1100
1050
950
900
850
835
725
720
680
640
630
510
510
465
460
350
320
270
230
210
115
100
90
84
75
67
55
48
40
38
32
DCR
(Ω) Max.
0.075
0.075
0.095
0.120
0.12
0.13
0.15
0.15
0.15
0.30
0.33
0.30
0.40
0.41
0.41
0.43
0.44
0.52
0.52
0.63
0.69
0.81
0.81
0.87
0.96
1.10
1.20
1.38
1.45
1.50
1.50
2.10
2.37
3.10
3.35
3.50
4.46
Rated DC Current
IDC1(mA) IDC2(mA)
1800
1800
1800
1800
1800
1700
1700
1600
1500
1200
1460
1460
1420
1400
1400
1400
1400
1340
1340
1300
1200
900
1100
1000
920
900
740
700
680
680
600
580
540
500
460
440
400
1600
1500
1400
1400
1400
1300
1300
1200
1100
940
1000
950
940
920
860
820
770
760
730
730
660
650
630
540
560
500
500
460
430
420
400
350
340
330
320
300
250
Color
Coding
White
Violet
Blue
Gray
Brown
Black
Orange
Brown
Green
Red
Green
Yellow
Orange
Green
Blue
Black
Brown
Blue
Red
Orange
Yellow
Black
Green
Blue
Violet
Gray
White
Black
Black
Brown
Red
Orange
Yellow
Green
Blue
Violet
Gray
※
1.
□
Specify the inductance tolerance, J(±5%),K(±10%)
※
2. IDC1： Based on inductance change (△L/L0 : drop 10% Max.)@ ambient temp. 25℃
IDC2： Based on temperature rise
(△T：25℃ TYP.)
Rated DC Current： The less value which is IDC1 or IDC2.
3. Color coding is not necessarily same position,
and Color coding non-directional printing.
1st
COLOR CODING
MAG.LAYERS
MLCF-161008-SERIES
Page-2/8
(4) RELIABILITY TEST METHOD
Item
Solderability
Specifications
The metalized area must have 90%
minimum solder coverage.
Resistance to
soldering heat
There must be no case deformation
or change in dimensions.
Inductance must not change more
than the stated tolerance.
Test conditions
Dip pads in flux and dip in solder pot
(96.5 Sn/3.5 Ag solder) at 255°C ±5°C.
Inductors shall be reflowed onto a PC board
using 96.5 Sn/3.5 Ag solder paste.
Solder process shall be at a maximum
temperature of 260°C.
For 96.5 Sn/3.5 Ag solder paste:>217°C for
90 seconds
Vibration
There must be no case deformation
or change in dimensions.
Inductance must not change more
than the stated tolerance.
Solder specimen inductor on the test printed
circuit board.
Apply vibrations in each of the x,y and z directions
for 2 house for a total of 6 hours.
Frequency
Amplitude
: 10~50 Hz
: 1.5mm
High
temperature
resistance
There must be no case deformation
or change in dimensions.
Inductance must not change more
than the stated tolerance.
Inductors shall be subjected to temperature
125±2℃ for 500±12 hours.
Measure the test items after leaving the
inductors at room temperature and humidity
for 2 hours.
Static
Humidity
Inductors must not have a shorted
or open winding.
Inductors shall be subjected to temperature
85±2℃ and 90 to 95%RH. for ten 24-hours.
Measure the test items after leaving the
inductors at room temperature and humidity
for 2 hours.
Component
adhesion
(push test)
Inductors shall be subjected to
0.45Kg
Inductors shall be reflow soldered (255°C
±5°C for 10 seconds) to a tinned copper
substrate. A force gauge shall be applied
to the side of the component.
The device must withstand the stated force
without a failure of the termination.
MAG.LAYERS
MLCF-161008-SERIES
Page-4/8
Item
Low
temperature
storage
Specifications
There must be no case deformation
or change in dimensions.
Inductance must not change more
than the stated tolerance.
Test conditions
Inductors shall be subjected to temperature
-40±2℃ for 500±12 hours.
Measure the test items after leaving the
inductors at room temperature and humidity
for 1 to 2 hours.
Resistance to
solvent
There must be no case deformation,
change in dimensions, or
obliteration of marking.
Inductors must withstand 6 minutes of
alcohol or water.
Thermal
shock
There must be no case deformation
or change in dimensions.
Inductance must not change more
than the stated tolerance.
Inductors shall be subjected to 10 cycles
to the the following temperature cycle:
1 cycle
+125℃
30 min.
30 sec
-40℃
30 min.
Measure the test items after leaving the
inductors at room temperature and humidity
for 2 hours.
MAG.LAYERS
MLCF-161008-SERIES
Page-4/8
(5) RECOMMENDED SOLDERING CONDITIONS
(Please use this product by reflow soldering)
(5)-1 RECOMMENDED FOOTPRINT
Unit: mm
0.64
0.64
0.64
(5)-2 RECOMMENED REFLOW PATTERN
1.02
Temperature(℃)
300
260
200
150
100
50
Time
1 to 4 min.
10 sec
more than 2 min.
Preheating
Solding
260℃
Natural Cooling
(5)-3 IRON SOLDERING
Use a solder iron of less than 30W when soldering ,do not allow the soldering
iron tip directly touch the Ceramic body outside of terminal electrode.
4 seconds max. at 260℃.
MAG.LAYERS
MLCF-161008-SERIES
Page-5/8
嵌入式系统
京公网安备 11010802033920号
Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved
电子工程世界
