SKBPC2514

功能特点

产品名称：SILICON /GLASS PASSIVATED THREE PHASE BRIDGE RECTIFIERS 硅/玻璃钝化三相桥式整流器

产品型号：SKBPC2514

产品特征：

Diffused Junction

Low Forward Voltage Drop

High Current Capability

High Reliability

High Surge Current Capability

Ideal for Printed Circuit Boards

机械数据：

Case: Epoxy Case with Heat Sink Interally

Mounted in the Bridge Encapsulation

Terminals:Plated Leads Solderable per

MIL-STD_202.Method 208

Polarity: As Marked on Body

Weight:20 grams (apprex.)

Mounting Position:

Bolt Down on Heatsink With Silicone Thermal

Compound Between Bridge and Mouting Surface

For Maximun Heat Transfer Efficiency

Mounting Torque:20 in Ibs.Max.

Marking:Type Number

最大额定值和电气特性：

Rating at 25℃ ambient temperature unless otherwise specified.

Single phase, half wave, 60 Hz, resistive or inductive load.

For capacitive load, derate current by 20%

产品数据：

Peak Repetitive Reverse Voltage VRRM 最大反向峰值电压 ：1400V

Working Peak Reverse Voltage VRWM 工作峰值反向电压 ：1400V

DC Blocking Voltage VR DC阻断电压 ：1400V

Peak Non-Repetitive Reverse Voltage VRSM 峰值反向电压 ：1500V

RMS Reverse Voltage VR(RMS) 反向电压有效值 ：980V

Maximum Average Forward Rectified Current @TC = 100℃ I(AV) 最大正向电流 ：25 A

Non-Repetitive Peak Forward Surge Current 非重复峰值正向浪涌电流 ：

(No Voltage Reapplid t=8.3ms at 60Hz) IFSM ：375 A

(No Voltage Reapplid t=10ms at 50Hz) IFSM ：360 A

(100% Reapplid t=8.3ms at 60Hz) IFSM ：314A

(100% Reapplid t=10ms at 50Hz) IFSM ：300 A

(I^2)t Rating for fusing

(No Voltage Reapplid t=8.3ms at 60Hz) (I^2)t ：580 (A^2)S

(No Voltage Reapplid t=10ms at 50Hz) (I^2)t ：635 (A^2)S

(100% Reapplid t=8.3ms at 60Hz) (I^2)t ：410 (A^2)S

(100% Reapplid t=10ms at 50Hz) (I^2)t ：450(A^2)S

Forward Voltage (per element) @ TJ=25℃,@IFM=40Apk per single junction VF ：1.2V

Peak Reverse Current (per leg) @ TJ=25℃ IR 最大反向漏电流 ：10μA

At Rated DC Blocking Voltage @ TJ = 125℃ IR 最大反向漏电流 ：5.0mA

RMS Isolation Voltage from Case to Lead VISO ：2500V

Operating Temperature Range TJ 工作结温 ：-40 to +125 ℃

Storage Temperature Range TSTG储存温度范围：-40 to +150 ℃

Thermal Resistance Junction to Case at DC Operation per Bridge RθJC 热阻系数 ：1.42K/W

Thermal Resistance Case to Heatsink Mounting Surface,Smooth,Flat and Greased RθCS ：0.2K/W

封装：SKBPC