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M69KB048BD70ZA8F: 产品描述2MX16 PSEUDO STATIC RAM, 70ns, BGA71, 7 X 11 MM, 0.80 MM PITCH, ROHS COMPLIANT, FBGA-71; 产品类别存储存储; 文件大小653KB，共64页; 制造商ST(意法半导体); 官网地址http://www.st.com/; 标准

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M69KB048BD70ZA8F概述

2MX16 PSEUDO STATIC RAM, 70ns, BGA71, 7 X 11 MM, 0.80 MM PITCH, ROHS COMPLIANT, FBGA-71

M69KB048BD70ZA8F规格参数

参数名称	属性值
是否无铅	不含铅
是否Rohs认证	符合
厂商名称	ST(意法半导体)
零件包装代码	BGA
包装说明	7 X 11 MM, 0.80 MM PITCH, ROHS COMPLIANT, FBGA-71
针数	71
Reach Compliance Code	compliant
ECCN代码	3A991.B.2.A
最长访问时间	70 ns
其他特性	SYNCHRONOUS BURST MODE ALSO POSSIBLE
JESD-30 代码	R-XBGA-B71
长度	11 mm
内存密度	33554432 bit
内存集成电路类型	PSEUDO STATIC RAM
内存宽度	16
功能数量	1
端子数量	71
字数	2097152 words
字数代码	2000000
工作模式	ASYNCHRONOUS
最高工作温度	85 °C
最低工作温度	-30 °C
组织	2MX16
封装主体材料	UNSPECIFIED
封装代码	TFBGA
封装形状	RECTANGULAR
封装形式	GRID ARRAY, THIN PROFILE, FINE PITCH
并行/串行	PARALLEL
峰值回流温度（摄氏度）	260
认证状态	Not Qualified
座面最大高度	1.2 mm
最大供电电压 (Vsup)	1.95 V
最小供电电压 (Vsup)	1.7 V
标称供电电压 (Vsup)	1.8 V
表面贴装	YES
技术	CMOS
温度等级	OTHER
端子形式	BALL
端子节距	0.8 mm
端子位置	BOTTOM
处于峰值回流温度下的最长时间	40
宽度	7 mm

M69KB048BD70ZA8F相似产品对比

	M69KB048BD70ZA8F	M69AB048BD70W8T	M69AB048BD70W8F	M69AB048BD70ZA8F	M69AB048BD70ZA8T	M69KB048BD70W8T	M69KB048BD70W8F	M69KB048BD70ZA8T
描述	2MX16 PSEUDO STATIC RAM, 70ns, BGA71, 7 X 11 MM, 0.80 MM PITCH, ROHS COMPLIANT, FBGA-71	2MX16 PSEUDO STATIC RAM, 70ns, UUC, WAFER	2MX16 PSEUDO STATIC RAM, 70ns, UUC, ROHS COMPLIANT, WAFER	2MX16 PSEUDO STATIC RAM, 70ns, BGA71, 7 X 11 MM, 0.80 MM PITCH, ROHS COMPLIANT, FBGA-71	2MX16 PSEUDO STATIC RAM, 70ns, BGA71, 7 X 11 MM, 0.80 MM PITCH, FBGA-71	2MX16 PSEUDO STATIC RAM, 70ns, UUC, WAFER	2MX16 PSEUDO STATIC RAM, 70ns, UUC, ROHS COMPLIANT, WAFER	2MX16 PSEUDO STATIC RAM, 70ns, BGA71, 7 X 11 MM, 0.80 MM PITCH, FBGA-71
是否无铅	不含铅	含铅	不含铅	不含铅	含铅	含铅	不含铅	含铅
是否Rohs认证	符合	不符合	符合	符合	不符合	不符合	符合	不符合
厂商名称	ST(意法半导体)	ST(意法半导体)	ST(意法半导体)	ST(意法半导体)	ST(意法半导体)	ST(意法半导体)	ST(意法半导体)	ST(意法半导体)
零件包装代码	BGA	WAFER	WAFER	BGA	BGA	WAFER	WAFER	BGA
包装说明	7 X 11 MM, 0.80 MM PITCH, ROHS COMPLIANT, FBGA-71	WAFER	ROHS COMPLIANT, WAFER	TFBGA, BGA71,8X12,32	7 X 11 MM, 0.80 MM PITCH, FBGA-71	WAFER	ROHS COMPLIANT, WAFER	7 X 11 MM, 0.80 MM PITCH, FBGA-71
Reach Compliance Code	compliant	not_compliant	compliant	compliant	not_compliant	compliant	compliant	compliant
ECCN代码	3A991.B.2.A	3A991.B.2.A	3A991.B.2.A	3A991.B.2.A	3A991.B.2.A	3A991.B.2.A	3A991.B.2.A	3A991.B.2.A
最长访问时间	70 ns	70 ns	70 ns	70 ns	70 ns	70 ns	70 ns	70 ns
其他特性	SYNCHRONOUS BURST MODE ALSO POSSIBLE	SYNCHRONOUS BURST MODE ALSO POSSIBLE	SYNCHRONOUS BURST MODE ALSO POSSIBLE	SYNCHRONOUS BURST MODE ALSO POSSIBLE	SYNCHRONOUS BURST MODE ALSO POSSIBLE	SYNCHRONOUS BURST MODE ALSO POSSIBLE	SYNCHRONOUS BURST MODE ALSO POSSIBLE	SYNCHRONOUS BURST MODE ALSO POSSIBLE
JESD-30 代码	R-XBGA-B71	X-XUUC-N	X-XUUC-N	R-XBGA-B71	R-XBGA-B71	X-XUUC-N	X-XUUC-N	R-XBGA-B71
内存密度	33554432 bit	33554432 bit	33554432 bit	33554432 bit	33554432 bit	33554432 bit	33554432 bit	33554432 bit
内存集成电路类型	PSEUDO STATIC RAM	PSEUDO STATIC RAM	PSEUDO STATIC RAM	PSEUDO STATIC RAM	PSEUDO STATIC RAM	PSEUDO STATIC RAM	PSEUDO STATIC RAM	PSEUDO STATIC RAM
内存宽度	16	16	16	16	16	16	16	16
功能数量	1	1	1	1	1	1	1	1
字数	2097152 words	2097152 words	2097152 words	2097152 words	2097152 words	2097152 words	2097152 words	2097152 words
字数代码	2000000	2000000	2000000	2000000	2000000	2000000	2000000	2000000
工作模式	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS
最高工作温度	85 °C	85 °C	85 °C	85 °C	85 °C	85 °C	85 °C	85 °C
最低工作温度	-30 °C	-30 °C	-30 °C	-30 °C	-30 °C	-30 °C	-30 °C	-30 °C
组织	2MX16	2MX16	2MX16	2MX16	2MX16	2MX16	2MX16	2MX16
封装主体材料	UNSPECIFIED	UNSPECIFIED	UNSPECIFIED	UNSPECIFIED	UNSPECIFIED	UNSPECIFIED	UNSPECIFIED	UNSPECIFIED
封装代码	TFBGA	DIE	DIE	TFBGA	TFBGA	DIE	DIE	TFBGA
封装形状	RECTANGULAR	UNSPECIFIED	UNSPECIFIED	RECTANGULAR	RECTANGULAR	UNSPECIFIED	UNSPECIFIED	RECTANGULAR
封装形式	GRID ARRAY, THIN PROFILE, FINE PITCH	UNCASED CHIP	UNCASED CHIP	GRID ARRAY, THIN PROFILE, FINE PITCH	GRID ARRAY, THIN PROFILE, FINE PITCH	UNCASED CHIP	UNCASED CHIP	GRID ARRAY, THIN PROFILE, FINE PITCH
并行/串行	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL
峰值回流温度（摄氏度）	260	NOT SPECIFIED	NOT SPECIFIED	260	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED
认证状态	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified
最大供电电压 (Vsup)	1.95 V	1.95 V	1.95 V	1.95 V	1.95 V	1.95 V	1.95 V	1.95 V
最小供电电压 (Vsup)	1.7 V	1.7 V	1.7 V	1.7 V	1.7 V	1.7 V	1.7 V	1.7 V
标称供电电压 (Vsup)	1.8 V	1.8 V	1.8 V	1.8 V	1.8 V	1.8 V	1.8 V	1.8 V
表面贴装	YES	YES	YES	YES	YES	YES	YES	YES
技术	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS
温度等级	OTHER	OTHER	OTHER	OTHER	OTHER	OTHER	OTHER	OTHER
端子形式	BALL	NO LEAD	NO LEAD	BALL	BALL	NO LEAD	NO LEAD	BALL
端子位置	BOTTOM	UPPER	UPPER	BOTTOM	BOTTOM	UPPER	UPPER	BOTTOM
处于峰值回流温度下的最长时间	40	NOT SPECIFIED	40	40	NOT SPECIFIED	NOT SPECIFIED	40	NOT SPECIFIED
端子数量	71	71	71	71	71	-	-	71
端子节距	0.8 mm	0.8 mm	0.8 mm	0.8 mm	0.8 mm	-	-	0.8 mm

M69KB048BD70ZA8F

M69KB048BD70ZA8F概述

M69KB048BD70ZA8F规格参数

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