SDI260 / SDI2100
MICRO SURFACE MOUNT SCHOTTKY BRIDGE
VOLTAGE
FEATURES
• Plastic package has Underwriters Laboratory
Flammability Classification 94V-O.
Flame Retardant Epoxy Molding Compound.
0.315(8.00)
0.285(7.24)
0.255(6.5)
0.245(6.2)
0.335(8.51)
0.316(8.05)
60 / 100 Volts
CURRENT
2 Amperes
• Low power loss, high efficiency.
• Low forward voltage, high current capability
• High surge capacity.
• Epitaxial chip construction.
• Ultra thin profile package for space constrained utilization
• Lead free in comply with EU RoHS 2011/65/EU directives.
• Green molding compound as per IEC61249 Std. . (Halogen Free)
0.098(2.5)
0.086(2.2)
• Super fast recovery times, high voltage.
0.045(1.14)
0.035(0.89)
0.022(0.56)
0.018(0.46)
0.185(4.69)
0.150(3.81)
MECHANICAL DATA
• Case: Reliable construction utilizing molded plastic technique results in product
• Terminals: Lead solderable per MIL-STD-750, Method 2026
• Polarity: Polarity symbols molded or marking on body
• Weight: 0.011 ounce, 0.4 gram
0.075(1.90)
0.055(1.39)
MAXIMUM RATINGS AND ELECTRICAL CHARACTERISTICS
Ratings at 25°C ambient temperature unless otherwise specified.Single phase, half wave, 60Hz, Resistive or inductive load.
For capacitive load, derate current by 20%
PA RA M E TE R
Ma xi m um Re c urr e nt P e a k Re ve rs e Vo lta g e
Ma xi m um RM S Vo lt a g e
Ma xi m um D C B lo c k i ng Vo lt a g e
Ma xi m um A ve ra g e F o rwa rd Re c t i fi e d C urre nt
P e a k F o r wa rd S urg e C urr e nt : 8 . 3 m s s i ng le ha lf s i ne -wa ve
s up e ri m p o s e d o n r a te d lo a d ( J E D E C m e t ho d )
Ma xi m um F o rwa r d Vo lt a g e a t 2 A
Ma xi m um D C R e ve rs e C ur re nt a t Ra te d D C B lo c k i ng Vo lta g e
Typ i c a l J unc ti o n C a p a c i ta nc e (V
R
= 4 V,f = 1 M Hz)
Typ i c a l The rm a l Re s i s t a nc e p e r d i o d e
Op e r a ti ng a nd S to r a g e Te mp e r a ture Ra ng e
S to r a g e Te mp e r a ture Ra ng e
(No t e 1 )
(No t e 2 )
per diode
per diode
per diode
S YM B OL
V
RRM
V
RMS
V
DC
I
F (AV )
I
F S M
V
F
I
R
C
J
R
J
A
R
J
L
T
J
T
S TG
S D I2 6 0
60
42
60
2
50
0 .6 8
50
130
85
31
S D I2 1 0 0
100
70
100
UNITS
V
V
V
A
A
0 .8 4
4
125
85
20
O
C / W
O
-5 5 to + 1 5 0
-5 5 to + 1 5 0
NOTES:
1. Mounted on an FR4 PCB, single-sided copper, mini pad.
2. Mounted on an FR4 PCB, single-sided copper, with 48cm
2
copper pad area.
January 23,2013-REV.01
0.350(8.9)
0.300(7.6)
• Exceeds environmental standards of MIL-S-19500/228
V
uA
pF
C
C
O
PAGE . 1
SDI260 / SDI2100
3
per diode
2.5
2
1.5
1
0.5
0
0
25
50
75
100
125
150
I
F
, Forward Current (A)
C
J
, Junction Capacitance
(pF)
1000
per diode
60V
100
100V
10
1
10
100
T
C
, Case Temperature (°C)
V
R
, Reverse Bias Voltage (V)
Fig.1 Forward Current Derating Curve
100000
Fig.2 Typical Junction Capacitance
I
R
, Reverse Current (μA)
T
J
= 150°C
10000
1000
100
10
T
J
= 125°C
I
R
, Reverse Current (μA)
per diode
10000
T
J
= 150°C
1000
100
10
1
T
J
= 75°C
0.1
0.01
20
40
60
80
100
T
J
= 25°C
T
J
= 125°C
100V
per diode
T
J
= 75°C
60V
T
J
= 25°C
1
20
40
60
80
100
Percent of Rated Peak Reverse Voltage (%)
Percent of Rated Peak Reverse Voltage (%)
Fig.3 Typical Reverse Characteristics
Fig.4 Typical Reverse Characteristics
10
10
T
J
= 150°C
T
J
= 125°C
per diode
T
J
= 25°C
I
F
, Forward Current (A)
I
F
, Forward Current (A)
T
J
= 150°C
1
per diode
T
J
= 25°C
0.1
T
J
= 75°C
1
T
J
= 125°C
0.1
T
J
= 75°C
60V
100V
0.01
0
0.5
1
0.01
0
0.2
0.4
0.6
0.8
1
V
F
, Forward Voltage (V)
V
F
, Forward Voltage (V)
Fig.5 Typical Forward Characteristics
Fig.6 Typical Forward Characteristics
January 23,2013-REV.01
PAGE . 2
SDI260 / SDI2100
Disclaimer
•
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from Panjit International Inc..
•
Panjit International Inc. reserves the rights to make changes of the content herein the
document anytime without notification. Please refer to our website for the latest
document.
•
Panjit International Inc. disclaims any and all liability arising out of the application or use of
any product including damages incidentally and consequentially occurred.
•
Panjit International Inc. does not assume any and all implied warranties, including warranties
of fitness for particular purpose, non-infringement and merchantability.
•
Applications shown on the herein document are examples of standard use and operation.
Customers are responsible in comprehending the suitable use in particular applications.
Panjit International Inc. makes no representation or warranty that such applications will be
suitable for the specified use without further testing or modification.
•
The products shown herein are not designed and authorized for equipments requiring high
level of reliability or relating to human life and for any applications concerning life-saving
or life-sustaining, such as medical instruments, transportation equipment, aerospace
machinery et cetera. Customers using or selling these products for use in such applications
do so at their own risk and agree to fully indemnify Panjit International Inc. for any damages
resulting from such improper use or sale.
•
Since Panjit uses lot number as the tracking base, please provide the lot number for tracking
when complaining.
January 23,2013-REV.01
PAGE . 4
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